A power semiconductor substrate for cooling at least one power electronic component of a power electronics system of a motor vehicle
GB202511068D0Pending Publication Date: 2025-08-20MERCEDES BENZ GROUP AG
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Patent Information
- Application Number
- GB2025011068
- Authority / Receiving Office
- GB · GB
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-07-09
- Publication Date
- 2025-08-20
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