Optical device processing

Abstract

A display backplane or other optical device layer may be attached for processing to a rigid glass substrate using an electric de-bond adhesive layer. A first conductive layer of the stack may be deposited on the rigid glass substrate, followed by an electrical de-bond adhesive layer, and a second conductive layer. The adhesive may be de-bonded by passing an electric current through the adhesive by the conductive layers to allow separation by peeling of the rigid glass substrate from subsequently formed device layers. The device layers may comprise optical elements such as lenses, liquid crystal cells, and backplanes for liquid crystal displays used in augmented reality display devices. Fig 4