Dry etch process for the production of high electron mobility transistors
GB2703379APending Publication Date: 2026-07-29ALIXLABS AB
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Patent Information
- Authority / Receiving Office
- GB · GB
- Patent Type
- Applications
- Current Assignee / Owner
- ALIXLABS AB
- Filing Date
- 2024-12-04
- Publication Date
- 2026-07-29
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Abstract
A method for high electron mobility transistor (HEMT) device fabrication in an atomic layer etching reactor, comprising: providing a selectively masked gallium nitride (GaN) layer 130 on a wafer 110 f
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