Photolithographic methods

GB2703873APending Publication Date: 2026-08-12PRAGMATIC SEMICON LTD
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Patent Information

Authority / Receiving Office
GB · GB
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2026-08-12

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Abstract

A photolithographic method of forming a tapered via channel 202 in an integrated circuit, IC, 100 (Figure 1) the tapered via channel extending through an insulator layer 204 sandwiched between a first
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Citation Information

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