Multi-layer chip ceramic dielectric capacitor

HK40067467BActive Publication Date: 2026-07-17DALIAN DALICAP TECH CO LTD
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Patent Information

Authority / Receiving Office
HK · HK
Patent Type
Patents
Current Assignee / Owner
DALIAN DALICAP TECH CO LTD
Filing Date
2022-07-07
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing multi-layer chip ceramic dielectric capacitors struggle to meet high operating voltage requirements and suffer from uneven electric field distribution leading to arcing discharge and potential burning under high voltage conditions.

Method used

A multi-layer chip ceramic dielectric capacitor design with evenly distributed internal electrodes and external connections, ensuring identical gaps and alternating electrode layers, allowing for series connection of equal capacitance components to withstand higher voltages by voltage division.

Benefits of technology

The capacitor can withstand higher direct current and radio-frequency voltages without arcing discharge, achieving uniform electric field distribution and preventing burnout.

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