Vibration sensor

Abstract

The embodiment of the present specification provides a vibration sensor, comprising an acoustic transducer, a vibration assembly and a shell, the vibration assembly comprising an elastic element and a mass element, the mass element being connected with the acoustic transducer through the elastic element, the elastic element surrounding a side wall connected with the mass element, the shell, the vibration assembly and the acoustic transducer forming a plurality of acoustic cavities containing a first acoustic cavity, the first acoustic cavity being communicated with the acoustic transducer, the vibration assembly changing the sound pressure of the first acoustic cavity in response to the vibration of the shell, the acoustic transducer generating an electrical signal based on the sound pressure change of the first acoustic cavity, wherein the vibration assembly comprises a first hole part, and the first acoustic cavity is communicated with other acoustic cavities through the first hole part. The present specification balances the pressure difference between the acoustic cavities by opening the first hole part on the vibration assembly, thereby preventing the internal elements of the vibration sensor from being damaged due to excessive pressure difference.

Description

[0001] Priority information

[0002] This application claims priority to international application No. PCT / CN2021 / 106947, filed July 16, 2021; international application No. PCT / CN2021 / 112014, filed August 11, 2021; international application No. PCT / CN2021 / 112017, filed August 11, 2021; and international application No. PCT / CN2021 / 113419, filed August 19, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This specification relates to the field of sensor design, and in particular to a vibration sensor. Background Technology

[0004] A vibration sensor is an energy conversion device that converts vibration signals into electrical signals. A vibration sensor typically includes an acoustic transducer and a vibration assembly for sound pickup. When the vibration assembly vibrates within the housing, the pressure difference between the acoustic cavities on either side of the vibration assembly can impede its vibration and potentially damage internal components such as the acoustic transducer, thus affecting the sensor's operational stability.

[0005] Therefore, this specification aims to provide a vibration sensor that can effectively eliminate the air pressure difference on both sides of a vibration component, thereby enhancing the vibration performance of the vibration component and improving the working stability of the vibration sensor. Summary of the Invention

[0006] One embodiment of this specification provides a vibration sensor, including an acoustic transducer, a vibration assembly, and a housing. The housing is configured to accommodate the acoustic transducer and the vibration assembly, and generates vibration based on an external vibration signal. The vibration assembly includes an elastic element and a mass element. The mass element is connected to the acoustic transducer through the elastic element, which surrounds a sidewall of the mass element. The housing, the mass element, the elastic element, and the acoustic transducer form a plurality of acoustic cavities including a first acoustic cavity. The first acoustic cavity is in communication with the acoustic transducer. The vibration assembly responds to the vibration of the housing by causing a change in the sound pressure of the first acoustic cavity. The acoustic transducer generates an electrical signal based on the change in the sound pressure of the first acoustic cavity. The mass element or the elastic element includes a first aperture, and the first acoustic cavity is connected to other acoustic cavities through the first aperture.

[0007] Compared with the prior art, the beneficial effects of this application are as follows: (1) The first hole of the vibration sensor can connect the first acoustic cavity located on both sides of the vibration component with other acoustic cavities to adjust the air pressure of the first acoustic cavity and other acoustic cavities, balance the air pressure difference in the two acoustic cavities, and prevent the internal components of the vibration sensor from being damaged due to excessive pressure difference. (2) The third hole opened on the housing can connect the external environment with the acoustic cavity inside the housing, thereby reducing the resistance when the vibration component vibrates and improving the sensitivity of the vibration sensor; in addition, the third hole is connected to the first acoustic cavity, and the first acoustic cavity is connected to other acoustic cavities through the first hole, thereby balancing the air pressure of the first acoustic cavity and other acoustic cavities with the external air pressure. Attached Figure Description

[0008] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0009] Figure 1 This is a modular schematic diagram of a vibration sensor according to some embodiments shown in this specification;

[0010] Figure 2 This is a schematic diagram of the vibration sensor structure shown in some embodiments of this specification;

[0011] Figure 3 This is a partial structural schematic diagram of a vibration sensor according to some embodiments of this specification;

[0012] Figure 4 This is a frequency response curve of a vibration sensor shown according to some embodiments of this specification;

[0013] Figure 5 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0014] Figure 6 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0015] Figure 7 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0016] Figure 8 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0017] Figure 9 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0018] Figure 10 This is a schematic diagram showing the protruding structure abutting against the second sidewall of the first acoustic cavity according to some embodiments of this specification;

[0019] Figure 11 These are three different shapes of protrusion structures shown in some embodiments of this specification;

[0020] Figure 12 This is a schematic diagram of a vibration sensor according to some embodiments of this specification;

[0021] Figure 13 This is a schematic diagram of a vibration sensor according to some embodiments of this specification;

[0022] Figure 14 This is a schematic diagram showing the connection of the elastic element and support frame according to some embodiments of this specification;

[0023] Figure 15 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0024] Figure 16 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0025] Figure 17 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0026] Figure 18 These are exemplary frequency response curves of two vibration sensors provided according to some embodiments of this specification;

[0027] Figure 19 This is a structural schematic diagram of a vibration sensor with a multilayer composite membrane structure as the elastic element, provided according to some embodiments of this specification.

[0028] Figure 20 This is a structural schematic diagram of a vibration sensor provided according to some embodiments of this specification;

[0029] Figure 21 These are cross-sectional views of vibration sensors with different shaped mass elements provided according to some embodiments of this specification;

[0030] Figure 22 This is a cross-sectional schematic diagram of three vibration sensors provided according to some embodiments of this specification;

[0031] Figure 23 This is a schematic diagram of the structure of a vibration sensor including a first hole, provided according to some embodiments of this specification;

[0032] Figure 24 yes Figure 23A schematic diagram of the cross-section of the vibration sensor is shown.

[0033] Figure 25 This is a cross-sectional schematic diagram of a vibration sensor provided according to some embodiments of this specification;

[0034] Figure 26 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0035] Figure 27 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0036] Figure 28 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0037] Figure 29 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification;

[0038] Figure 30 This is a schematic diagram of the structure of the vibration assembly of the vibration sensor according to some embodiments of this specification;

[0039] Figure 31 This is a schematic diagram of the frequency response curves of the vibration component in the vibration sensor according to some embodiments of this specification with different numbers of mass elements;

[0040] Figure 32 This is a structural schematic diagram of a vibration sensor according to some embodiments of this specification. Detailed Implementation

[0041] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0042] This specification describes a vibration sensor, which in some embodiments includes an acoustic transducer, a vibration assembly, and a housing. The housing houses the acoustic transducer and the vibration assembly and generates vibration based on an external vibration signal. The vibration assembly transmits the external vibration signal to the acoustic transducer to generate an electrical signal. The vibration assembly and the acoustic transducer form a plurality of acoustic cavities including a first acoustic cavity, which is in communication with the acoustic transducer. The vibration assembly responds to the vibration of the housing by causing a change in the sound pressure of the first acoustic cavity, and the acoustic transducer generates an electrical signal based on the change in sound pressure of the first acoustic cavity. In some embodiments, the vibration assembly includes a first aperture, through which the first acoustic cavity communicates with other acoustic cavities (e.g., a second acoustic cavity). The first aperture can connect the first acoustic cavity located on both sides of the vibration assembly with other acoustic cavities to regulate the air pressure of the first acoustic cavity and other acoustic cavities, balance the pressure difference between the two acoustic cavities, and prevent damage to the internal components of the vibration sensor due to excessive pressure difference.

[0043] In some embodiments, a third opening may be provided on the housing, connecting the external environment with the acoustic cavity inside the housing, thereby reducing the resistance during vibration of the vibrating component and improving the sensitivity of the vibration sensor. The third opening is connected to the first acoustic cavity, which in turn is connected to other acoustic cavities through the first opening, thus balancing the air pressure in the first and other acoustic cavities with the external air pressure. In some embodiments, the third opening and the first opening are staggered along a direction perpendicular to the vibration direction of the vibrating component (also referred to as the first direction), so that the airflow passing through the third opening does not directly enter the first opening, ensuring that the air pressure change rate on the side of the vibrating component facing the third opening is not too rapid, allowing the vibrating component to promptly sense subtle vibrations and ensuring the detection effect of the vibration sensor.

[0044] Figure 1 This is a modular schematic diagram of a vibration sensor according to some embodiments shown in this specification. For example... Figure 1As shown, in some embodiments, the vibration sensor 100 may include a housing 110, an acoustic transducer 120, and a vibration assembly 130. In some embodiments, the housing 110 is configured to house the acoustic transducer 120 and the vibration assembly 130, and generates vibration based on an external vibration signal. In some embodiments, the vibration assembly 130 and the acoustic transducer 120 form a plurality of acoustic cavities including a first acoustic cavity, the first acoustic cavity being in communication with the acoustic transducer 120. When vibration occurs in the external environment, the housing 110 generates vibration based on the vibration signal in the external environment, the vibration assembly 130 responds to the vibration of the housing 110 by causing a change in the sound pressure of the first acoustic cavity, and the acoustic transducer 120 generates an electrical signal based on the change in the sound pressure of the first acoustic cavity. In some embodiments, the vibration assembly 130 may include an elastic element 131 and a mass element 132, wherein the mass element 132 is physically connected to the elastic element 131, and the elastic element 131 is connected to a structure (e.g., a substrate) of the housing 110 or the acoustic transducer 120. In some embodiments, the vibration assembly 130 may include a first aperture for connecting a first acoustic cavity to other acoustic cavities. The first aperture connects the first acoustic cavity located on either side of the vibration assembly to other acoustic cavities to regulate the air pressure in the two acoustic cavities, balance the pressure difference between them, and prevent damage to the vibration sensor 100. In some embodiments, the first aperture may be located at the elastic element 131 or the mass element 132. For example, the first aperture may be located in an area of ​​the elastic element 131 not covered by the mass element 132. Alternatively, the first aperture may extend through both the elastic element 131 and the mass element 132.

[0045] Figure 2 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 2As shown, in some embodiments, the vibration sensor 200 may include a housing 210, an acoustic transducer 220, and a vibration component 230, wherein the acoustic transducer 220 and the vibration component 230 are located within the housing 210. In some embodiments, the housing 210 may be rectangular, approximately rectangular, cylindrical, spherical, or any other shape. In some embodiments, the housing 210 encloses a receiving space, within which the acoustic transducer 220 and the vibration component 230 are disposed. In some embodiments, the housing 210 may be made of a material with a certain degree of hardness, thereby protecting the acoustic transducer 220 and the vibration component 230. It should be noted that in some embodiments, the housing 210 may be a single housing structure or a combination of multiple housing structures, and the two forms of the housing 210 may be interchangeable. For example, the acoustic transducer 220 may have a first housing, the vibration component 230 may be connected to the acoustic transducer 220, and a second housing may be connected to the first housing, forming a space for accommodating the vibration component 230. The specific structure and components of the housing 210 described above also apply to other embodiments.

[0046] In some embodiments, the housing 210, the vibration assembly 230, and the acoustic transducer 220 form a plurality of acoustic cavities including a first acoustic cavity 240. In some embodiments, the acoustic transducer 220 includes a pickup device 221 and a substrate 250. The substrate 250 is connected to the housing 210 through its periphery, and the pickup device 221 is located on the side of the substrate 250 opposite to the vibration assembly 230. In some embodiments, the substrate 250 may include a pickup hole 251. The first acoustic cavity 240 and the acoustic transducer 220 are connected through the pickup hole 251, and the acoustic transducer 220 can acquire the sound pressure change of the first acoustic cavity 240 and convert it into an electrical signal. In some embodiments, the pickup device 221 may include a capacitive, piezoelectric, or other type of transducer depending on the transduction principle, and this specification does not limit this.

[0047] In some embodiments, the vibration assembly 230 may include an elastic element 231 and a mass element 232, wherein the periphery of the elastic element 231 is connected to the inner wall of the housing 210, and the mass element 232 may be located on the upper side (i.e. the side facing the substrate 250 in the figure) or the lower side (i.e. the side away from the substrate 250 in the figure) of the elastic element 231.

[0048] Because the air pressure difference between the acoustic cavities on both sides of the vibration component 230 during vibration may impede the vibration of the vibration component 230 and may damage the internal components of the vibration sensor 200, such as the acoustic transducer 220, thus affecting the working stability of the vibration sensor 200, in some embodiments, the vibration component 230 may include a first hole 233, through which the first acoustic cavity 240 can be connected to other acoustic cavities. The first hole 233 can connect the first acoustic cavity 240 located on both sides of the vibration component 230 with other acoustic cavities to adjust the air pressure of the first acoustic cavity and other acoustic cavities, balance the air pressure difference between the acoustic cavities, and prevent damage to the vibration sensor 200. In some embodiments, other acoustic cavities may be cavities different from those formed between the first acoustic cavity 240, the vibration component 230, and the housing 210, such as the acoustic cavity formed by the side of the vibration component 230 away from the substrate 250 and the housing 210. In some embodiments, the first aperture 233 may include a first sub-aperture 2331, which may be disposed in an area of ​​the elastic element 231 not covered by the mass element 232, so that the first acoustic cavity 240 communicates with other acoustic cavities, thereby balancing the air pressure difference between the acoustic cavities and preventing damage to the vibration sensor 200. In some embodiments, apertures may also be provided on both the elastic element 231 and the mass element 232 to communicate with other acoustic cavities. For example, the first aperture 233 may include a first sub-aperture 2331 and a second sub-aperture 2332, where the first sub-aperture 2331 is disposed on the elastic element 231, the second sub-aperture 2332 is located on the mass element 232, and the second sub-aperture 2332 communicates with the first sub-aperture 2331. In some embodiments, the dimensions of the first sub-aperture 2331 and the second sub-aperture 2332 may be the same or different. For details regarding the first aperture 233, please refer to [link to relevant documentation]. Figure 24 and Figure 25 The relevant explanations will not be repeated here.

[0049] In some embodiments, the elastic element 231 can be a thin film structure that allows air to pass through; that is, the elastic element 231 is a breathable membrane. The elastic element 231 is configured to allow air to pass through, enabling the first acoustic cavity 240 located on both sides of the elastic element 231 to communicate with other acoustic cavities, thereby regulating the air pressure in the two acoustic cavities, balancing the air pressure difference within the two acoustic cavities, and preventing damage to the vibration sensor 200. In some embodiments, the material of the elastic element 231 is a material capable of elastic deformation within a certain range. Specifically, the elastic element 231 can be made from at least one or more of the following materials: PTFE (polytetrafluoroethylene), ePTFE (expanded polytetrafluoroethylene), PES (polyethersulfone), PVDF (polyvinylidene fluoride), PP (polypropylene), PETE (polyethylene terephthalate), nylon, NC (nitrocellulose), and MCE (mixed cellulose). In some embodiments, the thickness of the elastic element 231 can be 0.05 μm to 100 μm. Specifically, the thickness of the elastic element 231 is related to its material. For example, when ePTFE (expanded polytetrafluoroethylene) is selected as the material of the elastic element 231, its thickness is 0.5μm to 100μm. Preferably, the ePTFE film thickness is 1μm to 10μm, such as 2μm, 5μm, or 7μm. In some embodiments, preferably, the minimum air permeability of the ePTFE film can be controlled to be no less than 10L / hr to ensure good air permeability. Simultaneously, the ePTFE film provides a certain degree of waterproofing to protect internal components. In some embodiments, the material of the mass element 232 can be the same as that of the elastic element 231, for example, both can be made of breathable material. In some embodiments, the material of the mass element 232 can be different from that of the elastic element 231. For example, the elastic element 231 can be made of breathable material, while the mass element 232 can be made of rigid material (e.g., iron, copper, silicon).

[0050] In some embodiments, the shape of the elastic element 231 may include a circle, rectangle, triangle, or irregular shape, etc. In some embodiments, the shape of the elastic element 231 may also be set according to actual conditions, and is not limited in this specification. In some embodiments, the shape of the mass element 232 may be a regular or irregular structure such as a cylinder, frustum, cone, cube, or triangular prism. In some embodiments, the material of the mass element 232 may be one or more of copper, tin, or other alloys and their composite materials. In some embodiments, the vibration sensor 200 can be applied to MEMS device design. In MEMS device manufacturing, the mass element 232 may be a single-layer material, such as Si, Cu, etc., or a double-layer or multi-layer composite material, such as Si / SiO2, SiO2 / Si, Si / SiNx, SiNx / Si / SiO2, etc. In some embodiments, the elastic element 231 may be a single-layer material along its thickness direction, such as Si, SiO2, SiNx, SiC, etc., or a double-layer or multi-layer composite material, such as Si / SiO2, SiO2 / Si, Si / SiNx, SiNx / Si / SiO2, etc. Please refer to [reference needed] for details. Figure 17-23 The relevant descriptions will not be repeated here.

[0051] During the assembly of the vibration sensor 200, welding may be involved. During welding, the gas pressure in the acoustic cavities on both sides of the substrate 250 inside the housing 210 may change, potentially causing uneven pressure inside the housing 210. This can damage components of the vibration sensor 200, such as causing cracking or deformation, thus affecting its performance. In some embodiments, the housing 210 may have a second hole 211 through which the first acoustic cavity 240, other acoustic cavities, and the acoustic transducer 220 communicate with the outside. During the assembly of the vibration sensor 200, the second hole 211 can deliver the gas inside the housing 210 to the outside. Thus, by providing the second hole 211, when assembling the vibration assembly 230 and the acoustic transducer 220, excessive pressure differences between the inside and outside of the housing 210 can be avoided, preventing the vibration assembly 230 (e.g., the elastic element 231) and the acoustic transducer 220 from failing, thereby reducing the assembly difficulty of the vibration sensor 200. In some embodiments, the second aperture 211 may be located in the housing 210 corresponding to the first acoustic cavity 240. The second aperture 211 communicates with the first acoustic cavity 240, and the first acoustic cavity 240 communicates with other acoustic cavities through the first aperture 233. The first acoustic cavity 240 may communicate with the cavity containing the acoustic transducer 220 through a breathable diaphragm structure at the pickup hole 251, thereby balancing the air pressure of the first acoustic cavity 240, other acoustic cavities, and the cavity containing the acoustic transducer 220 with the external air pressure. In some embodiments, the second aperture 211 may also be located in the housing 210 corresponding to other acoustic cavities. For example, the second aperture 211 may be located in the housing 210 corresponding to the acoustic cavity formed by the vibrating component 230 and the housing 210 on the side away from the acoustic transducer 220. In some embodiments, the second aperture 211 may also be located in the housing 210 corresponding to the cavity containing the acoustic transducer 220.

[0052] In some embodiments, ambient airborne sound may affect the performance of the vibration sensor 200. To reduce the impact of ambient airborne sound, after the vibration sensor 200 is manufactured or before it is applied to an electronic device, the second hole 211 can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 200. In some embodiments, the second hole 211 can be sealed by means of sealant, adhesive sealing tape, or adding a sealing plug.

[0053] When the vibration component 230 vibrates, the interior of the housing 210 is a closed space, which generates vibration resistance to the vibration of the vibration component 230. This is detrimental to the vibration of the gas inside the acoustic cavity driven by the vibration component 230, thereby affecting the sensitivity of the vibration sensor 200. In some embodiments, the housing 210 may be provided with a third hole 212, which connects the external environment with the acoustic cavity inside the housing 210, thereby reducing the resistance when the vibration component 230 vibrates and improving the sensitivity of the vibration sensor 200. In some embodiments, the third hole 212 and the first hole 233 are staggered along a direction perpendicular to the vibration direction of the vibration component 230. The staggered arrangement of the third hole 212 and the first hole 233 ensures that the airflow passing through the third hole 212 does not directly enter the first hole 233, ensuring that the air pressure change rate on the side of the vibration component 230 facing the third hole 212 is not too fast, allowing the vibration component 230 to sense subtle vibrations in a timely manner, and ensuring the effective pickup of external vibration signals by the vibration sensor 200. In some embodiments, the third aperture 212 may be located in the housing 210 corresponding to the first acoustic cavity 240. The third aperture 212 communicates with the first acoustic cavity 240, and the first acoustic cavity 240 communicates with other acoustic cavities through the first aperture 233. The first acoustic cavity 240 may communicate with the cavity containing the acoustic transducer 220 through a breathable diaphragm structure at the pickup hole 251, thereby balancing the air pressure of the first acoustic cavity 240, other acoustic cavities, and the cavity containing the acoustic transducer 220 with the external air pressure. In some embodiments, the third aperture 212 may also be located in the housing 210 corresponding to other acoustic cavities. For example, the third aperture 212 may be located in the housing 210 corresponding to the acoustic cavity formed by the vibrating component 230 and the housing 210 on the side away from the acoustic transducer 220. In some embodiments, the third aperture 212 may also be located in the housing 210 corresponding to the cavity containing the acoustic transducer 220. To effectively reduce the resistance of the vibration component 230 during vibration, the third hole 212 may have a diameter greater than 2 μm in some embodiments. To enhance the isolation capability of the third hole 212 and better prevent the entry of external moisture, dust, and other substances, the diameter of the third hole 212 may be less than 40 μm in some embodiments. To effectively reduce the resistance of the vibration component 230 during vibration while ensuring the waterproof and dustproof effect of the third hole 212, the diameter of the third hole 212 may be between 2 μm and 40 μm in some embodiments. Preferably, in some embodiments, the diameter of the third hole 212 may be between 5 μm and 20 μm. More preferably, in some embodiments, the diameter of the third hole 212 may be between 8 μm and 15 μm.

[0054] In some embodiments, the acoustic transducer 220 may include a diaphragm 222 located at the pickup hole 251 of the substrate 250. The diaphragm 222 is a device in the acoustic transducer 220 for receiving changes in sound pressure in the first acoustic cavity 240. In some embodiments, the diaphragm 222 may be provided with a fourth hole 2221, through which the cavity containing the acoustic transducer 220 communicates with the first acoustic cavity 240, and with the external environment through a second hole 211 or a third hole 212, thereby balancing the air pressure between the cavity containing the acoustic transducer 220 and the external environment, thus facilitating the assembly of the vibration sensor 200. The dimensions of the fourth hole 2221 can be referenced to the description of the third hole 212. In some embodiments, the diaphragm 222 may also be a breathable membrane made of a breathable material; the specific description of the breathable material can be referenced to the description of the elastic element 231.

[0055] Figure 3 This is a partial structural schematic diagram of a vibration sensor according to some embodiments of this specification. Figure 3 The vibration sensor 300 shown and Figure 2 The vibration sensors 200 shown have largely the same structure; the difference lies in... Figure 3 The vibration assembly 330 shown and Figure 2 The structure of the vibration component 230 shown is different. Figure 3 The housing 310, acoustic transducer (not shown), second hole (not shown), third hole 311, substrate 320, and diaphragm (not shown) shown are respectively connected to... Figure 2 The structures of the housing 210, the second hole 211, the third hole 212, the substrate 250, and the diaphragm 222 are similar and will not be described in detail here.

[0056] In some embodiments, the vibration assembly 330 may include a mass element 331 and an elastic element 332, wherein the elastic element 332 may include a first elastic element 3321 and a second elastic element 3322. In some embodiments, the first elastic element 3321 and the second elastic element 3322 may be a membrane structure. In some embodiments, the first elastic element 3321 and the second elastic element 3322 may be approximately symmetrically distributed relative to the mass element 331 in a first direction. The first elastic element 3321 and the second elastic element 3322 may be connected to the housing 310. For example, the first elastic element 3321 may be located on the side of the mass element 331 facing away from the substrate 320, the lower surface of the first elastic element 3321 may be connected to the upper surface of the mass element 331, and the peripheral side of the first elastic element 3321 may be connected to the inner wall of the housing 310. The second elastic element 3322 can be located on the side of the mass element 331 facing the substrate 320. The upper surface of the second elastic element 3322 can be connected to the lower surface of the mass element 331, and the periphery of the second elastic element 3322 can be connected to the inner wall of the housing 310. It should be noted that the membrane structure of the first elastic element 3321 and the second elastic element 3322 can be a regular and / or irregular structure such as rectangular or circular. The shape of the first elastic element 3321 and the second elastic element 3322 can be adaptively adjusted according to the cross-sectional shape of the housing 310.

[0057] In some embodiments, the volume of the acoustic cavity (e.g., the second acoustic cavity 350) formed between the first elastic element 3321 and the housing 310 corresponding to the acoustic cavity can be greater than or equal to the volume of the first acoustic cavity 340 formed between the second elastic element 3322 and the housing 310 and substrate 320 corresponding to the acoustic cavity, such that the volume of the first acoustic cavity 340 is equal to or approximately equal to the volume of the second acoustic cavity 350, thereby improving the symmetry of the vibration sensor 300. Specifically, the first acoustic cavity 340 and the second acoustic cavity 350 contain air. When the vibration component 330 vibrates relative to the housing 310, the vibration component 330 compresses the air inside the two acoustic cavities. The first acoustic cavity 340 and the second acoustic cavity 350 can be approximated as two air springs. The volume of the second acoustic cavity 350 is greater than or equal to the volume of the first acoustic cavity 340, so that the coefficient of the air spring caused by the compression of air by the vibration component 330 during vibration is approximately equal, thereby further improving the symmetry of the elastic elements (including air springs) on the upper and lower sides of the mass element 331.

[0058] In some embodiments, the vibration assembly 330 may include a first aperture 333, through which the first acoustic cavity 340 and the second acoustic cavity 350 are connected. In some embodiments, the first aperture 333 may include a first sub-aperture 3331, located in the area of ​​the first elastic element 3321 and the second elastic element 3322 not covered by the mass element 331, so that the first acoustic cavity 340 is connected to other acoustic cavities (e.g., the second acoustic cavity 350). In some embodiments, the first sub-aperture 3331 of the first elastic element 3321 and the first sub-aperture 3331 of the second elastic element 3322 may be misaligned, where misalignment can be understood as the projection of the first sub-aperture 3331 of the first elastic element 3321 onto the second elastic element 3322 not overlapping with the first sub-aperture 3331 of the second elastic element 3322. In some embodiments, the first sub-hole portion 3331 of the first elastic element 3321 and the first sub-hole portion 3331 of the second elastic element 3322 may also be disposed opposite to each other. This relative disposal can be understood as the projection of the first sub-hole portion 3331 of the first elastic element 3321 onto the second elastic element 3322 overlapping with the first sub-hole portion 3331 of the second elastic element 3322. In some embodiments, holes may also be provided on the first elastic element 3321, the second elastic element 3322, and the mass element 331, allowing the first acoustic cavity 340 to communicate with other acoustic cavities. For example, the first hole portion 333 may include two first sub-hole portions 3331 and one second sub-hole portion 3332. The two first sub-hole portions 3331 may be respectively disposed on the first elastic element 3321 and the second elastic element 3322, and the second sub-hole portion 3332 is located on the mass element 331. The two first sub-hole portions 3331 are respectively located at both ends of the second sub-hole portion 3332 and communicate with it. In some embodiments, the dimensions of the two first sub-hole portions 3331 may be the same or different. The dimensions of the first sub-hole portion 2331 and the second sub-hole portion 2332 may be the same or different. Please refer to [reference needed] for details of the first hole portion 333. Figure 24 and Figure 25 The relevant explanations will not be repeated here.

[0059] In some embodiments, the vibration component 330 may also be made of a breathable material. For example, in some embodiments, the mass element 331 may be made of the same material as the elastic element 332, both being made of a breathable material. In some embodiments, the mass element 331 may be made of a different material than the elastic element 332; for example, the elastic element 332 may be made of a breathable material, while the mass element 331 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0060] Figure 4 This is a frequency response curve of a vibration sensor shown according to some embodiments of this specification. For example... Figure 4 As shown, the horizontal axis represents frequency in Hz, and the vertical axis represents the sensitivity of the vibration sensor in dB. Curve 410 represents the sensitivity of a vibration sensor including one elastic element in the first direction. Curve 420 represents the sensitivity of a vibration sensor including two approximately symmetrical elastic elements (e.g., Figure 3 The first elastic element 3321 and the second elastic element 3322 shown are used to measure the sensitivity of a vibration sensor in the first direction. Curve 430 represents the sensitivity of a vibration sensor including one elastic element in the second direction. Curve 440 represents the sensitivity of a vibration sensor including two approximately symmetrical elastic elements (e.g., Figure 3 The sensitivity of the vibration sensor (first elastic element 3321 and second elastic element 3322) in the second direction is shown. The elastic element of the vibration sensor corresponding to curve 410 (or curve 430) has the same material and shape as the two elastic elements of the vibration sensor corresponding to curve 420 (or curve 440), the difference being that the thickness of the elastic element of the vibration sensor corresponding to curve 410 (or curve 430) is approximately equal to the total thickness of the two elastic elements of the vibration sensor corresponding to curve 420 (or curve 440). It should be noted that the error of this approximation does not exceed 50%.

[0061] Comparing curves 410 and 420, it can be seen that within a specific frequency range (e.g., below 3000 Hz), the sensitivity of a vibration sensor with an elastic element in the first direction ( Figure 4 The sensitivity of a vibration sensor with two approximately symmetrical elastic elements in the first direction (curve 410) is compared with that of the curve in the middle. Figure 4The frequencies of the vibration sensor are approximately equal (as shown in curve 420). This can also be understood as follows: within a specific frequency range (e.g., below 3000Hz), the number and distribution of the elastic elements in the vibration sensor have a relatively small impact on the sensitivity of the vibration sensor in the first direction. Furthermore, in curves 410 and 420, f1 is the resonant frequency of the resonance peak of the vibration sensor with one elastic element in the first direction, and f2 is the resonant frequency of the resonance peak of the vibration sensor with two approximately symmetrical elastic elements in the first direction. The resonant frequency f1 of the vibration sensor with one elastic element in the first direction is approximately equal to the resonant frequency f2 of the vibration sensor with two approximately symmetrical elastic elements in the first direction. In other words, within a specific frequency range, the sensitivity of the vibration sensor with one elastic element in the first direction is approximately equal to the sensitivity of the vibration sensor with two approximately symmetrical elastic elements in the first direction. Considering that vibration sensors are non-ideal devices, the resonant frequency in the first direction of the vibration sensor has a mapping (also called a component) in the second direction. Accordingly, in curve 430, f3 is used to characterize the mapping of the resonant frequency in the first direction of a vibration sensor with one elastic element in the second direction frequency response curve (which can also be understood as the component of the resonant frequency in the first direction in the second direction frequency response curve), and f5 is the resonant frequency of the vibration sensor with one elastic element in the second direction. In curve 440, f4 is used to characterize the mapping of the resonant frequency in the first direction of a vibration sensor including two elastic elements in the second direction frequency response curve, and f6 is the resonant frequency of the vibration sensor with two approximately symmetrical elastic elements in the second direction. Due to the existence of the mapping relationship, the resonant frequency f3 in the third curve 430 is approximately equal to the resonant frequency f1 in the first curve 410, and the resonant frequency f4 in the fourth curve 440 is approximately equal to the resonant frequency f2 in the second curve 420. Comparing curves 430 and 440, it can be seen that within a specific frequency range (e.g., below 3000Hz), the sensitivity of the vibration sensor including one elastic element in the second direction (in the second direction) is (…). Figure 4 The sensitivity of the vibration sensor in the second direction (curve 430) is greater than that of the sensor comprising two approximately symmetrical elastic elements. Figure 4(Curve 440). This can also be understood as follows: within a specific frequency range (e.g., below 3000Hz), the number and distribution of elastic elements in the vibration sensor have a significant impact on the sensitivity of the vibration sensor in the second direction. Furthermore, combining curves 430 and 440, it can be seen that when f1 and f2 are approximately equal (or f3 and f4 are approximately equal), within a specific frequency range (e.g., below 3000Hz), the resonant frequency f5 corresponding to the resonant peak in the second direction of a vibration sensor with one elastic element is significantly lower than the resonant frequency f6 corresponding to the resonant peak in the second direction of a vibration sensor with two approximately symmetrical elastic elements. In some embodiments, by providing two approximately symmetrical elastic elements in the vibration sensor, the resonant frequency of the vibration sensor's resonant peak in the second direction can be located in a higher frequency range, thereby reducing the sensitivity of the vibration sensor in the low-to-mid frequency range, which is far from the resonant frequency. Further, within a specific frequency range (3000Hz), the sensitivity of the vibration sensor with two approximately symmetrical elastic elements in the second direction (…) Figure 4 The sensitivity of the vibration sensor in the second direction relative to curve 440 (including an elastic element) is ( Figure 4 The middle curve (430) is flatter.

[0062] Based on the above curve analysis, it can be seen that by setting approximately symmetrical first and second elastic elements in the vibration sensor, it is possible to reduce the sensitivity of the vibration sensor in the second direction while essentially maintaining its sensitivity in the first direction within a specific frequency band (e.g., below 3000Hz). This increases the difference between the sensitivity in the second direction and the sensitivity in the first direction, thereby improving the directional selectivity of the vibration sensor and enhancing its noise immunity. In some embodiments, to further reduce the sensitivity in the second direction, within a specific frequency range (e.g., below 3000Hz), the ratio of the resonant frequency f6 corresponding to the resonance peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements to the resonant frequency f5 corresponding to the resonance peak in the second direction of the vibration sensor with one elastic element can be greater than 2. In some embodiments, within a specific frequency range (e.g., below 3000Hz), the ratio of the resonant frequency f6 corresponding to the resonance peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements to the resonant frequency f5 corresponding to the resonance peak in the second direction of the vibration sensor with one elastic element can be greater than 3.5. In some embodiments, within a specific frequency range (e.g., below 3000 Hz), the ratio of the resonant frequency f6 corresponding to the resonant peak in the second direction to the resonant frequency f5 corresponding to the resonant peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements can be greater than 5. In some embodiments, the resonant frequency f6 corresponding to the resonant peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements can be greater than 1 to its resonant frequency f2 corresponding to the resonant peak in the first direction. Preferably, the resonant frequency f6 corresponding to the resonant peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements can be greater than 1.5 to its resonant frequency f2 corresponding to the resonant peak in the first direction. More preferably, the resonant frequency f6 corresponding to the resonant peak in the second direction of the vibration sensor with two approximately symmetrical elastic elements can be greater than 2 to its resonant frequency f2 corresponding to the resonant peak in the first direction.

[0063] Figure 5 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 5 As shown, the vibration sensor 500 may include a housing 510, an acoustic transducer, and a vibration assembly 530. Figure 5 The vibration sensor 500 shown can be used with Figure 3 The vibration sensor 300 shown is the same as or similar to the one shown.

[0064] In some embodiments, Figure 5 The vibration sensor shown is Figure 3The main difference between the vibration sensor 300 and the one shown is that the first elastic element 5321 and the second elastic element 5322 of the vibration sensor 500 can be columnar structures. The first elastic element 5321 and the second elastic element 5322 can extend along the thickness direction of the mass element 531 and be connected to the substrate 520 on the upper surface of the housing 510 or the acoustic transducer. In some embodiments, the first elastic element 5321 and the second elastic element 5322 can be approximately symmetrically distributed with respect to the mass element 531 in a first direction. In some embodiments, the first elastic element 5321 can be located on the side of the mass element 531 facing away from the substrate 520, the lower surface of the first elastic element 5321 can be connected to the upper surface of the mass element 531, and the upper surface of the first elastic element 5321 can be connected to the inner wall of the housing 510. In some embodiments, the second elastic element 5322 may be located on the side of the mass element 531 facing the substrate 520. The upper surface of the second elastic element 5322 may be connected to the lower surface of the mass element 531, and the lower surface of the second elastic element 5322 may be connected to the substrate 520 on the upper surface of the acoustic transducer. It should be noted that the columnar structure of the first elastic element 5321 and the second elastic element 5322 may be a regular and / or irregular structure such as a cylinder or a square column. The shapes of the first elastic element 5321 and the second elastic element 5322 may be adaptively adjusted according to the cross-sectional shape of the housing 510.

[0065] In some embodiments, the mass element 531 may also have a first hole 533, through which the first acoustic cavity 540 and the second acoustic cavity 550 are connected. In some embodiments, the first hole 533 is located in a region of the mass element 531 not covered by the first elastic element 5321 and the second elastic element 5322, so that the first acoustic cavity 540 can communicate with other acoustic cavities (e.g., the second acoustic cavity 550). Details of the first hole 533 can be found in [reference needed]. Figure 24 and Figure 25 The relevant explanations will not be repeated here. In some embodiments, the mass element 531 may also be made of a breathable material.

[0066] In some embodiments, the housing 510 may have a second opening (not shown in the figure), through which the first acoustic cavity 540, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 500, the second opening can deliver the gas inside the housing 510 to the outside. Thus, by providing the second opening, during the assembly of the vibration assembly 530 and the acoustic transducer, the failure of the vibration assembly 530 (e.g., the elastic element 532) and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 510 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 500. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 500. To reduce the impact of airborne sound in the environment, after the vibration sensor 500 is manufactured, or before it is applied to an electronic device, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 500. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details regarding the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0067] In some embodiments, the housing 510 may be provided with a third hole 511, which connects the external environment with the acoustic cavity inside the housing 510, thereby reducing the resistance of the vibration assembly 130 during vibration and improving the sensitivity of the vibration sensor 500. For details of the third hole 511, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0068] Figure 6 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 6 As shown, the vibration sensor 600 may include a housing 610, an acoustic transducer, and a vibration assembly 630. Figure 6 The vibration sensor 600 shown can be used with Figure 3 The vibration sensor 300 shown is the same as or similar to the one shown.

[0069] In some embodiments, unlike vibration sensor 300, the first elastic element 6321 of vibration sensor 600 may include a first sub-elastic element 63211 and a second sub-elastic element 63212. The first sub-elastic element 63211 and the housing 610 corresponding to the acoustic cavity are connected via the second sub-elastic element 63212, and the first sub-elastic element 63211 is connected to the upper surface of the mass element 631. Figure 6As shown, the upper surface of the mass element 631 is connected to the lower surface of the first sub-elastic element 63211, the upper surface of the first sub-elastic element 63211 is connected to the lower surface of the second sub-elastic element 63212, and the upper surface of the second sub-elastic element 63212 is connected to the inner wall of the housing 610. In some embodiments, the periphery of the first sub-elastic element 63211 and the periphery of the second sub-elastic element 63212 may coincide or approximately coincide. In some embodiments, the second elastic element 6322 of the vibration sensor 600 may include a third sub-elastic element 63221 and a fourth sub-elastic element 63222. The third sub-elastic element 63221 and the acoustic transducer corresponding to the acoustic cavity are connected through the fourth sub-elastic element 63222, and the third sub-elastic element 63221 is connected to the lower surface of the mass element 631. Figure 6 As shown, the lower surface of the mass element 631 is connected to the upper surface of the third sub-elastic element 63221, the lower surface of the third sub-elastic element 63221 is connected to the upper surface of the fourth sub-elastic element 63222, and the lower surface of the fourth sub-elastic element 63222 is connected to the acoustic transducer via the substrate 620 on the upper surface of the acoustic transducer. In some embodiments, the periphery of the third sub-elastic element 63221 and the periphery of the fourth sub-elastic element 63222 may coincide or approximately coincide.

[0070] In some embodiments, the periphery of the first sub-elastic element 63211 and the periphery of the second sub-elastic element 63212 (or the periphery of the third sub-elastic element 63221 and the periphery of the fourth sub-elastic element 63222) may not coincide. For example, when the first sub-elastic element 63211 is a membrane structure and the second sub-elastic element 63212 is a columnar structure, the periphery of the first sub-elastic element 63211 may be connected to the inner wall of the housing 610, and there may be a gap between the periphery of the second sub-elastic element 63212 and the inner wall of the housing 610.

[0071] In some embodiments, the first sub-elastic element 63211 and the third sub-elastic element 63221 may be approximately symmetrically distributed relative to the mass element 631 in a first direction. The size, shape, material, or thickness of the first sub-elastic element 63211 and the third sub-elastic element 63221 may be the same. In some embodiments, the second sub-elastic element 63212 and the fourth sub-elastic element 63222 may be approximately symmetrically distributed relative to the mass element 631 in a first direction. The size, shape, material, or thickness of the second sub-elastic element 63212 and the fourth sub-elastic element 63222 may be the same. In some embodiments, the size, shape, material, or thickness of the first sub-elastic element 63211 and the second sub-elastic element 63212 (or the third sub-elastic element 63221 and the fourth sub-elastic element 63222) may be the same. For example, the first sub-elastic element 63211 and the second sub-elastic element 63212 may both be made of polytetrafluoroethylene (PTFE). In some embodiments, the size, shape, material, or thickness of the first sub-elastic element 63211 and the second sub-elastic element 63212 (or the third sub-elastic element 63221 and the fourth sub-elastic element 63222) may be different. For example, the first sub-elastic element 63211 is a membrane structure and the second sub-elastic element 63212 is a columnar structure.

[0072] In some embodiments, the vibration sensor 600 may further include a fixing plate 670. The fixing plate 670 may be distributed along the periphery of the mass element 631, located between the first sub-elastic element 63211 and the third sub-elastic element 63221, and the upper and lower surfaces of the fixing plate 670 may be connected to the first sub-elastic element 63211 and the third sub-elastic element 63221, respectively. In some embodiments, the fixing plate 670 may be a separate structure. For example, the fixing plate 670 may be a columnar structure with a thickness approximately the same as that of the mass element 631, and the upper surface of the fixing plate 670 may be connected to the lower surface of the first sub-elastic element 63211, and the lower surface of the fixing plate 670 may be connected to the upper surface of the third sub-elastic element 63221. In some embodiments, the fixing plate 670 may also be a structure integrally formed with other structures. For example, the fixing plate 670 may be a columnar structure integrally formed with the first sub-elastic element 63211 and / or the third sub-elastic element 63221. In some embodiments, the fixing piece 670 may also be a columnar structure penetrating the first sub-elastic element 63211 and / or the third sub-elastic element 63221. For example, the fixing piece 670 may penetrate the first sub-elastic element 63211 and connect to the second sub-elastic element 63212. In some embodiments, the structure of the fixing piece 670 may be other types of structures besides a columnar structure, such as a ring structure. In some embodiments, when the fixing piece 670 is a ring structure, the fixing pieces 670 are evenly distributed around the periphery of the mass element 631, the upper surface of the fixing piece 670 is connected to the lower surface of the first sub-elastic element 63211, and the lower surface of the fixing piece 670 is connected to the upper surface of the third sub-elastic element 63221.

[0073] In some embodiments, the thickness of the fixing plate 670 may be the same as the thickness of the mass element 631. In some embodiments, the thickness of the fixing plate 670 may be different from the thickness of the mass element 631. For example, the thickness of the fixing plate 670 may be greater than the thickness of the mass element 631. In some embodiments, the material of the fixing plate 670 may be an elastic material, such as foam, plastic, rubber, silicone, etc. In some embodiments, the material of the fixing plate 670 may also be a rigid material, such as metal, metal alloy, etc. Preferably, the material of the fixing plate 670 may be the same as the material of the mass element 631. In some embodiments, the fixing plate 670 may also serve as an additional mass element to adjust the resonant frequency of the vibration sensor, thereby adjusting (e.g., reducing) the difference between the sensitivity of the vibration sensor in the second direction and the sensitivity of the vibration sensor in the first direction.

[0074] In some embodiments, the vibration assembly 630 further includes a first aperture (not shown in the figure), through which the first acoustic cavity 640 and the second acoustic cavity 650 are connected. In some embodiments, the first aperture may include a first sub-aperture (not shown in the figure), and two first sub-apertures may be respectively disposed in the areas of the first sub-elastic element 63211 and the third sub-elastic element 63221 that are not covered by the mass element 631 and the second sub-elastic element 63212 and the fourth sub-elastic element 63222, so that the first acoustic cavity 640 can communicate with other acoustic cavities (e.g., the second acoustic cavity 650). The two first sub-apertures may be staggered or arranged opposite each other. In some embodiments, apertures may also be provided on the first sub-elastic element 63211, the third sub-elastic element 63221, and the mass element 631, so that the first acoustic cavity 640 can communicate with other acoustic cavities. It should be noted that the areas where the apertures are provided are not covered by the second sub-elastic element 63212 and the fourth sub-elastic element 63222. For example, the first hole may include two first sub-holes and one second sub-hole. The two first sub-holes may be respectively disposed on the first sub-elastic element 63211 and the third sub-elastic element 63221. The second sub-hole is located on the mass element 631, and the two first sub-holes are respectively located at both ends of the second sub-hole and communicate with it. In some embodiments, the dimensions of the two first sub-holes may be the same or different. The dimensions of the first sub-hole and the second sub-hole may be the same or different. For details on the first hole, please refer to [reference needed]. Figure 24 and Figure 25 The relevant descriptions will not be repeated here. In some embodiments, the vibration component 630 may also be made of a breathable material. For example, in some embodiments, the material of the mass element 631 may be the same as that of the elastic element 632 (e.g., the first sub-elastic element 63211 and the third sub-elastic element 63221), both of which are made of a breathable material. In some embodiments, the material of the mass element 631 may be different from that of the elastic element 632. For example, the elastic element 632 (e.g., the first sub-elastic element 63211 and the third sub-elastic element 63221) may be made of a breathable material, while the mass element 631 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0075] In some embodiments, a second opening (not shown in the figure) may be provided on the housing 610, through which the first acoustic cavity 640, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 600, the second opening can deliver the gas inside the housing 610 to the outside. Thus, by providing the second opening, when assembling the vibration assembly 630 and the acoustic transducer, failure of the vibration assembly 630 (e.g., the elastic element 632) and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 610 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 600. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 600. To reduce the impact of airborne sound in the environment, after the vibration sensor 600 is manufactured or before it is applied to electronic devices, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 600. In some embodiments, the second opening can be sealed by means of sealant, adhesive sealing tape, or adding a sealing plug. For details of the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0076] In some embodiments, the housing 610 may be provided with a third opening (not shown in the figure), which connects the external environment with the acoustic cavity inside the housing 610, thereby reducing the resistance of the vibration assembly 630 during vibration and improving the sensitivity of the vibration sensor 600. For details of the third opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0077] Figure 7 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 7 As shown, the vibration sensor 700 may include a housing 710, an acoustic transducer, and a vibration assembly 730. Figure 7 The vibration sensor 700 shown can be used with Figure 3 The vibration sensor 300 shown is the same as or similar to the one shown.

[0078] In some embodiments, the vibration sensor 700 differs from the vibration sensor 300 in the structure of its vibration assembly. The vibration assembly 730 of the vibration sensor 700 may include at least one elastic element 732 and two mass elements (e.g., a first mass element 7311 and a second mass element 7312). In some embodiments, the mass element 731 may include a first mass element 7311 and a second mass element 7312. The first mass element 7311 and the second mass element 7312 are symmetrically arranged relative to the at least one elastic element 732 in a first direction. In some embodiments, the first mass element 7311 may be located on the side of the at least one elastic element 732 facing away from the substrate 720, and the lower surface of the first mass element 7311 is connected to the upper surface of the at least one elastic element 732. The second mass element 7312 may be located on the side of the at least one elastic element 732 facing the substrate 720, and the upper surface of the second mass element 7312 is connected to the lower surface of the at least one elastic element 732. In some embodiments, the first mass element 7311 and the second mass element 7312 may have the same size, shape, material, or thickness. In some embodiments, the first mass element 7311 and the second mass element 7312 are symmetrically arranged with respect to at least one elastic element 732 in the first direction, such that the center of gravity of the mass element 731 approximately coincides with the centroid of at least one elastic element 732. This allows the vibration component 730 to reduce the vibration of the mass element 731 in the second direction when it vibrates in response to the vibration of the housing 710, thereby reducing the response sensitivity of the vibration component 730 to the vibration of the housing 710 in the second direction and improving the directional selectivity of the vibration sensor 700.

[0079] In some embodiments, the first mass element 7311 and the second mass element 7312 are distributed on opposite sides of at least one elastic element 732 in a first direction. Here, the first mass element 7311 and the second mass element 7312 can be approximated as a single, integral mass element. The center of gravity of this integral mass element approximately coincides with the centroid of at least one elastic element 732. This allows the vibration assembly 730 to have a higher response sensitivity to vibrations of the housing 710 in the first direction than to vibrations of the housing 710 in the second direction within a target frequency range (e.g., below 3000 Hz). In some embodiments, the difference between the response sensitivity of the vibration assembly 730 to vibrations of the housing 710 in the second direction and the response sensitivity of the vibration assembly 730 to vibrations of the housing 710 in the first direction can be -30 dB to -40 dB.

[0080] In some embodiments, during the operation of the vibration sensor 700, the vibration generated by the vibration component 730 in the second direction can be reduced, thereby reducing the response sensitivity of the vibration component 730 to the vibration of the housing 710 in the second direction, thereby improving the directional selectivity of the vibration sensor 700 and reducing the interference of noise signals on sound signals.

[0081] In some embodiments, the centroid of at least one elastic element 732 may coincide with or approximately coincide with the center of gravity of the mass element 731. In some embodiments, when the vibration assembly 730 vibrates in response to the vibration of the housing 710, the centroid of at least one elastic element 732 coincides with or approximately coincides with the center of gravity of the mass element 731. This can reduce the vibration of the mass element 731 in the second direction while keeping the response sensitivity of the vibration assembly 730 to the vibration of the housing 710 in the first direction substantially unchanged, thereby reducing the response sensitivity of the vibration assembly 730 to the vibration of the housing 710 in the second direction and improving the directional selectivity of the vibration sensor 700. In some embodiments, the response sensitivity of the vibration assembly 730 to the vibration of the housing 710 in the first direction can be changed (e.g., increased) by adjusting the thickness, elastic coefficient of the elastic element 732, the mass, size, etc. of the mass element 731.

[0082] In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a first direction may not be greater than 1 / 3 of the thickness of the mass element 731. In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a first direction may not be greater than 1 / 2 of the thickness of the mass element 731. In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a first direction may not be greater than 1 / 4 of the thickness of the mass element 731. In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a second direction may not be greater than 1 / 3 of the side length or radius of the mass element 731. In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a second direction may not be greater than 1 / 2 of the side length or radius of the mass element 731. In some embodiments, the distance between the centroid of at least one elastic element 732 and the center of gravity of the mass element 731 in a second direction may not be greater than 1 / 4 of the side length or radius of the mass element 731. For example, when the mass element 731 is a cube, the distance between the centroid of at least one elastic element 732 and the centroid of the mass element 731 in the second direction is no greater than 1 / 3 of the side length of the mass element 731. As another example, when the mass element 731 is a cylinder, the distance between the centroid of at least one elastic element 732 and the centroid of the mass element 731 in the second direction is no greater than 1 / 3 of the radius of the circle on the upper (or lower) surface of the mass element 731.

[0083] In some embodiments, when the centroid of at least one elastic element 732 coincides with or nearly coincides with the center of gravity of the mass element 731, the resonant frequency of the vibration component 730 in the second direction can be shifted to a higher frequency without changing the resonant frequency of the vibration component 730 in the first direction. In some embodiments, when the centroid of at least one elastic element 732 coincides with or nearly coincides with the center of gravity of the mass element 731, the resonant frequency of the vibration component 730 in the first direction can remain substantially unchanged. For example, the resonant frequency of the vibration component 730 in the first direction can be a frequency within a relatively strong frequency range perceived by the human ear (e.g., 20Hz-2000Hz, 2000Hz-3000Hz, etc.). The resonant frequency of the vibration component 730 in the second direction can be shifted to a higher frequency range and fall within a relatively weak frequency range perceived by the human ear (e.g., 5000Hz-3000Hz, 1kHz-14kHz, etc.). Since the resonant frequency of the vibration component 730 in the second direction shifts to a higher frequency, while the resonant frequency of the vibration component 730 in the first direction remains substantially unchanged, the ratio of the resonant frequency of the vibration component 730 in the second direction to the resonant frequency of the vibration component 730 in the first direction can be greater than or equal to 2. In some embodiments, the ratio of the resonant frequency of the vibration component 730 in the second direction to the resonant frequency of the vibration component 730 in the first direction can also be greater than or equal to other values. For example, the ratio of the resonant frequency of the vibration component 730 in the second direction to the resonant frequency of the vibration component 730 in the first direction can also be greater than or equal to 1.5.

[0084] In some embodiments, the vibration assembly 730 further includes a first aperture (not shown), through which the first acoustic cavity 740 and the second acoustic cavity 750 communicate. In some embodiments, the first aperture may include a first sub-aperture (not shown), which may be disposed in an area of ​​the elastic element 732 not covered by the first mass element 7311 and the second mass element 7312, so that the first acoustic cavity 740 communicates with other acoustic cavities (e.g., the second acoustic cavity 750). In some embodiments, apertures may also be provided on the first mass element 7311, the second mass element 7312, and the elastic element 732, so that the first acoustic cavity 740 communicates with other acoustic cavities. For example, the first aperture may include one first sub-aperture and two second sub-apertures (not shown), which may be disposed on the first mass element 7311 and the second mass element 7312, respectively. The first sub-aperture is located on the elastic element 732, and the two second sub-apertures are located at both ends of the first sub-aperture and communicate with it. In some embodiments, the dimensions of the two second sub-hole portions may be the same or different. The dimensions of the first sub-hole portion and the second sub-hole portion may be the same or different. For details regarding the first hole portion, please refer to... Figure 24 and Figure 25 The relevant descriptions will not be repeated here. In some embodiments, the vibration component 730 may also be made of a breathable material. For example, in some embodiments, the material of the mass element 731 may be the same as that of the elastic element 732, both being made of a breathable material. In some embodiments, the material of the mass element 731 may be different from that of the elastic element 732; for example, the elastic element 732 may be made of a breathable material, while the mass element 731 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0085] In some embodiments, the housing 710 may have a second opening (not shown in the figure), through which the first acoustic cavity 740, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 700, the second opening can deliver the gas inside the housing 710 to the outside. Thus, by providing the second opening, during the assembly of the vibration assembly 730 and the acoustic transducer, the failure of the vibration assembly 730 (e.g., the elastic element 732) and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 710 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 700. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 700. To reduce the impact of airborne sound in the environment, after the vibration sensor 700 is manufactured, or before it is applied to an electronic device, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 700. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details regarding the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0086] In some embodiments, the housing 710 may be provided with a third opening (not shown in the figure), which connects the external environment with the acoustic cavity inside the housing 710, thereby reducing the resistance of the vibration assembly 730 during vibration and improving the sensitivity of the vibration sensor 700. For details of the third opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0087] Figure 8 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 8 As shown, the vibration sensor 800 may include a housing 810, an acoustic transducer, and a vibration unit 830. Figure 8 The vibration sensor 800 shown can be used with Figure 7 The vibration sensor 700 shown is the same as or similar to the one described.

[0088] Unlike vibration sensor 700, the elastic element 832 of vibration sensor 800 may further include a second elastic element 8322 and a third elastic element 8323. In some embodiments, the first elastic element 8321 may be connected to the housing 810 and / or the acoustic transducer via the second elastic element 8322 and the third elastic element 8323, respectively. Figure 8As shown, the first elastic element 8321 is a membrane structure, and the second elastic element 8322 and the third elastic element 8323 are columnar structures. The upper surface of the first elastic element 8321 is connected to the lower surface of the second elastic element 8322, and the upper surface of the second elastic element 8322 is connected to the inner wall of the housing 810. The lower surface of the first elastic element 8321 is connected to the upper surface of the third elastic element 8323, and the lower surface of the third elastic element 8323 is connected to the acoustic transducer through the substrate 820 on the upper surface of the acoustic transducer. In some embodiments, the peripheries of the first elastic element 8321, the second elastic element 8322, and the third elastic element 8323 may overlap or approximately overlap. In some embodiments, the peripheries of the first elastic element 8321, the second elastic element 8322, and the third elastic element 8323 may not overlap. For example, when the first elastic element 8321 is a membrane structure and the second elastic element 8322 and the third elastic element 8323 are columnar structures, the periphery of the first elastic element 8321 can be connected to the inner wall of the housing 810, and there is a gap between the periphery of the second elastic element 8322 and the third elastic element 8323 and the inner wall of the housing 810.

[0089] It should be noted that the vibration components of the vibration sensors shown in some embodiments of this specification (e.g., Figure 3 The vibration component 330 shown Figure 5 The vibration component 530 shown is arranged in a transverse direction. In some embodiments, the vibration component can also be arranged in other directions (e.g., longitudinal or oblique). Accordingly, the first direction and the second direction follow the mass element (e.g., Figure 3 The vibration component 330 shown Figure 5 The vibration component 530 (as shown) changes accordingly. For example, when the vibration component 330 (mass element 331) of the vibration sensor 300 is disposed longitudinally, it can be approximated here as... Figure 3 The vibration assembly 330 shown is rotated 90° clockwise (or counterclockwise) as a whole. Correspondingly, the first direction and the second direction also change with the rotation of the vibration assembly 330. The working principle of the vibration sensor when the vibration assembly is arranged longitudinally is similar to that when the vibration assembly is arranged laterally, and will not be described in detail here.

[0090] In some embodiments, the vibration assembly 830 further includes a first aperture (not shown), through which the first acoustic cavity 840 and the second acoustic cavity 850 communicate. In some embodiments, the first aperture may include a first sub-aperture (not shown), which may be disposed in an area of ​​the first elastic element 8321 not covered by the second elastic element 8322, the third elastic element 8323, and the first mass element 8311 and the second mass element 8312, so that the first acoustic cavity 840 communicates with other acoustic cavities (e.g., the second acoustic cavity 850). In some embodiments, apertures may also be provided on the first mass element 8311, the second mass element 8312, and the first elastic element 8321, so that the first acoustic cavity 840 communicates with other acoustic cavities. For example, the first hole may include a first sub-hole and two second sub-holes (not shown in the figure). The two second sub-holes may be respectively disposed on the first mass element 8311 and the second mass element 8312. The first sub-hole is located on the first elastic element 8321, and the two second sub-holes are respectively located at both ends of the first sub-hole and communicate with it. It should be noted that the area where the hole is disposed cannot be covered by the second elastic element 8322 or the third elastic element 8323. In some embodiments, the dimensions of the two second sub-holes may be the same or different. The dimensions of the first sub-hole and the second sub-hole may be the same or different. For details of the first hole, please refer to [reference needed]. Figure 24 and Figure 25 The relevant descriptions will not be repeated here. In some embodiments, the vibration component 830 may also be made of a breathable material. For example, in some embodiments, the material of the mass element 831 may be the same as that of the elastic element 832 (e.g., the first elastic element 8321), both being made of a breathable material. In some embodiments, the material of the mass element 831 may be different from that of the elastic element 832. For example, the elastic element 832 (e.g., the first elastic element 8321) may be made of a breathable material, while the mass element 831 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0091] In some embodiments, a second opening (not shown in the figure) may be provided on the housing 810, through which the first acoustic cavity 840, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 800, the second opening can deliver the gas inside the housing 810 to the outside. Thus, by providing the second opening, during the assembly of the vibration assembly 830 and the acoustic transducer, failure of the vibration assembly 830 (e.g., the elastic element 832) and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 810 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 800. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 800. To reduce the impact of airborne sound in the environment, after the vibration sensor 800 is manufactured, or before it is applied to an electronic device, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 800. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details regarding the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0092] In some embodiments, the housing 810 may be provided with a third opening (not shown in the figure), which connects the external environment with the acoustic cavity inside the housing 810, thereby reducing the resistance of the vibration assembly 830 during vibration and improving the sensitivity of the vibration sensor 800. For details of the third opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0093] Figure 9 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 9 As shown, the vibration sensor 900 may include an elastic element 920, an acoustic transducer 930, a housing 940, a mass element 960, and a sealing unit 970, wherein the elastic element 920 and the mass element 960 constitute a vibration assembly. The housing 940 may have an acoustic cavity 941 for accommodating one or more components of the vibration sensor 900 (e.g., the elastic element 920, the mass element 960, and the sealing unit 970). In some embodiments, the housing 940 is a semi-enclosed housing, forming the acoustic cavity 941 by connection with the acoustic transducer 930. For example, the housing 940 covers the acoustic transducer 930 to form the acoustic cavity 941.

[0094] In some embodiments, Figure 9The vibration sensor 900 shown can be used as a vibration sensor in the field of microphones, such as bone conduction microphones. For example, when applied to a bone conduction microphone, the acoustic transducer 930 can acquire the sound pressure change of the first acoustic cavity 950 and convert it into an electrical signal. In some embodiments, an elastic element 920 is disposed above the acoustic transducer (i.e., acoustic transducer 930), and the first acoustic cavity 950 is formed between the elastic element 920 and the acoustic transducer.

[0095] The elastic element 920 may include an elastic film 921. A protrusion 923 is provided on the surface (also called the inner surface) of the elastic film 921 near the acoustic transducer 930. The protrusion 923 and the elastic film 921 (forming the first sidewall of the first acoustic cavity 950) together with the acoustic transducer 930 (forming the second sidewall of the first acoustic cavity 950) form the first acoustic cavity 950.

[0096] In some embodiments, the vibration assembly may include a first aperture 980, through which a first acoustic cavity 950 communicates with other acoustic cavities. In some embodiments, the first aperture 980 may include a first sub-aperture 981, which may be disposed in an area of ​​the elastic film 921 of the elastic element 920 not covered by the mass element 960, so that the first acoustic cavity 950 communicates with other acoustic cavities (e.g., acoustic cavity 941). In some embodiments, apertures may also be provided on both the elastic element 920 and the mass element 960, so that the first acoustic cavity 950 communicates with other acoustic cavities. For example, the first aperture 980 may include a first sub-aperture 981 and a second sub-aperture 982. The first sub-aperture 981 may be disposed between two adjacent protrusions 923 in the elastic film 921, and the second sub-aperture 982 is located on the mass element 960, communicating with the first sub-aperture 981. In some embodiments, the protrusion structure 923 may include a fifth hole 990, wherein the fifth hole 990 extends through the protrusion structure 923 along a first direction, and a first hole 980 communicates with the fifth hole 990. In some embodiments, the dimensions of the first sub-hole 981, the second sub-hole 982, and the fifth hole 990 may be the same or different. For details regarding the first hole 980, please refer to... Figure 24 and Figure 25 The relevant explanations will not be repeated here. In some embodiments, the vibration component may also be made of a breathable material. For example, in some embodiments, the material of the mass element 960 may be the same as that of the elastic element 920, both being made of a breathable material. In some embodiments, the material of the mass element 960 may be different from that of the elastic element 920; for example, the elastic element 920 may be made of a breathable material, while the mass element 960 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0097] In some embodiments, a second opening (not shown in the figure) may be provided on the housing 940, through which the acoustic cavity 941, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 900, the second opening can deliver the gas inside the housing 940 to the outside. Thus, by providing the second opening, when assembling the elastic element 920, the mass element 960, and the acoustic transducer, failure of the elastic element 920 and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 940 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 900. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 900. To reduce the impact of airborne sound in the environment, after the vibration sensor 900 is manufactured or before it is applied to electronic devices, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 900. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details on the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0098] In some embodiments, the housing 940 may be provided with a third hole 942, which connects the external environment with the acoustic cavity inside the housing 940, thereby reducing the resistance of the elastic element 920 during vibration and improving the sensitivity of the vibration sensor 900. For details of the third hole 942, please refer to... Figure 2 The relevant descriptions will not be repeated here.

[0099] like Figure 9As shown, the outer edge of the elastic diaphragm 921 can be physically connected to the acoustic transducer 930. Physical connection can include bonding, nailing, snapping, and connection via additional connecting components (e.g., sealing unit 970). For example, the outer edge of the elastic diaphragm 921 can be bonded to the acoustic transducer 930 with an adhesive to form a first acoustic cavity 950. However, adhesive bonding has poor sealing performance, which reduces the sensitivity of the vibration sensor 900 to some extent. In some embodiments, the tip of the protrusion structure 923 abuts against the surface of the acoustic transducer 930. The tip refers to the end of the protrusion structure 923 away from the elastic diaphragm 921. The connection between the tip of the protrusion structure 923, located around the elastic diaphragm 921, and the surface of the acoustic transducer 930 can be sealed by the sealing unit 970, so that the protrusion structure 923, the elastic diaphragm 921, the sealing unit 970, and the acoustic transducer 930 together form a closed first acoustic cavity 950. It is understood that the location of the sealing unit 970 is not limited to the above description. In some embodiments, the sealing unit 970 may not be limited to the connection between the top of the protruding structure 923 and the surface of the acoustic transducer 930, but may also be located on the outer side of the protruding structure 923 forming the first acoustic cavity 950 (i.e., the side of the protruding structure 923 away from the first acoustic cavity 950). In some embodiments, to further improve the sealing performance, a sealing unit may also be provided inside the first acoustic cavity 950. By sealing the connection between the elastic element 920 and the acoustic transducer 930 with the sealing unit 970, the sealing performance of the entire first acoustic cavity 950 can be guaranteed, thereby effectively improving the reliability and stability of the vibration sensor 900 and ensuring the sensitivity of the vibration sensor 900. In some embodiments, the sealing unit 970 may be made of materials such as silicone or rubber to further improve the sealing performance of the sealing unit 970. In some embodiments, the type of sealing unit 970 may include one or more of sealing rings, sealing gaskets, and sealing strips.

[0100] The mass element 960 can be connected to the elastic element 920 and located on the side of the elastic element 920 opposite to the first acoustic cavity 950. For example, the mass element 960 can be disposed on the elastic diaphragm 921, located on the side opposite to the first acoustic cavity 950. In response to the vibration of the housing 940 and / or the acoustic transducer 930, the mass element 960 and the elastic element 920 can together form a resonant system to generate vibration. The mass element 960 has a certain mass, thus increasing the vibration amplitude of the elastic element 920 relative to the housing 940, so that the volume change of the first acoustic cavity 950 can change significantly under the action of external vibrations of different intensities, thereby improving the sensitivity of the vibration sensor 900.

[0101] In some embodiments, the mass element 960 may be disposed on the side of the elastic element 920 facing the acoustic transducer 930. For example, a protrusion structure 923 may be directly disposed on the surface of the mass element 960 facing the acoustic transducer 930 (e.g., processed by cutting, injection molding, bonding, etc.). Since the mass element 960 itself is elastic, the protrusion structure 923 disposed on the mass element 960 is also elastic. In this embodiment, the mass element 960 can reduce the volume of the first acoustic cavity 950, thereby improving the sensitivity of the vibration sensor 900 to some extent. In some embodiments, the top end of the protrusion structure 923 disposed on the mass element 960 may abut against the surface of the acoustic transducer 930, so that the protrusion structure 923 undergoes elastic deformation due to compression during movement, increasing the volume change of the first acoustic cavity 950, thereby improving the sensitivity of the vibration sensor 900.

[0102] In some embodiments, the sensitivity of the vibration sensor 900 can be improved in other ways. For example, adjusting the Young's modulus of the elastic film 921 and the Young's modulus of the mass element 960, adjusting the ratio or difference between the thickness of the mass element 960 and the thickness of the elastic film 921, adjusting the ratio between the projected area of ​​the mass element 960 in the first direction and the projected area of ​​the elastic element 920 in the first direction, adjusting the ratio between the projected area of ​​the mass element 960 in the first direction and the projected area of ​​the first acoustic cavity 950 in the first direction, increasing the volume change of the first acoustic cavity 950 and / or decreasing the volume of the first acoustic cavity 950, adjusting the spacing between adjacent protrusions 923, adjusting the width of a single protrusion 923, adjusting the ratio between the width of a protrusion 923 and the spacing between adjacent protrusions 923, adjusting the height of the protrusion 923, adjusting the difference between the height of the protrusion 923 and the height of the first acoustic cavity 950, adjusting the gap between the surface of the protrusion 923 and the acoustic transducer 930, and adjusting the ratio between the height of the protrusion 923 and the thickness of the elastic film 921, etc.

[0103] In some embodiments, the protrusion 923 may be in direct contact with the surface of the acoustic transducer 930. In this case, the height of the protrusion 923 is the same as or similar to the height of the first acoustic cavity 950. Figure 10 This is a schematic diagram illustrating the protruding structure abutting against the second sidewall of the first acoustic cavity, according to some embodiments of this specification. (See diagram for example.) Figure 10 As shown, the protruding structure 923 can abut against the second sidewall of the first acoustic cavity 950. The protruding structure 923 can have a certain degree of elasticity. In this embodiment, when the elastic element 920 is excited by an external force and moves, it will drive the protruding structure 923 to move in the direction of the acoustic transducer 930.

[0104] In some embodiments, the volume change of the first acoustic cavity 950 may also be related to the shape of the protrusion structure 923. In some embodiments, the shape of the protrusion structure 923 may be various shapes. Figure 11 Three different shapes of protrusion structures are shown. Among them, Figure 11 The protrusion structure 923-1 in (a) is pyramid-shaped and distributed in a dot array on the inner surface of the elastic element 920-1. Figure 11 (b) The protrusion structure 923-2 is hemispherical in shape and is distributed in a dot array on the inner surface of the elastic element 920-2. Figure 11 In (c), the protrusions 923-3 are striped and arranged in a linear array on the inner surface of the elastic element 920-3. It is understood that this is for illustrative purposes only and is not intended to limit the shape of the protrusions 923. The protrusions 923 can also be other possible shapes, such as trapezoidal, cylindrical, or ellipsoidal.

[0105] Reference Figure 11 The protrusion 923 is pyramidal in shape. Compared to other shapes (e.g., hemispherical), when the protrusion 923 is subjected to external force, the pyramidal shape causes stress concentration at the top. For protrusions 923 of different shapes, if their Young's modulus is the same, the pyramidal shape will have lower equivalent stiffness, lower elastic modulus, and greater elastic deformation, resulting in a larger volume change of the first acoustic cavity 950 and a greater increase in the sensitivity of the vibration sensor 900.

[0106] Figure 12 This is a schematic diagram of a vibration sensor 1400 according to some embodiments of this specification. Figure 12 The vibration sensor 1410 shown is... Figure 9 Similar to the vibration sensor 900 shown, the elastic element 1420 and the mass element 1460 constitute a vibration assembly. The difference is that the elastic element 1420 of the vibration sensor 1410 includes a first elastic element 1420-1 and a second elastic element 1420-2. The first elastic element 1420-1 and the second elastic element 1420-2 are respectively disposed on both sides of the mass element 1460 in a first direction. Specifically, the first elastic element 1420-1 is located on the side of the mass element 1460 closer to the acoustic transducer 1430, and the second elastic element 1420-2 is located on the side of the mass element 1460 away from the acoustic transducer 1430. Similar to... Figure 9The elastic element 920 shown includes a first elastic element 1420-1 comprising a first elastic film 1421-1 and a first protrusion structure 1423-1 disposed on the surface (also called the inner surface) of the first elastic film 1421-1 facing the first acoustic cavity 1450. The edge of the first protrusion structure 1423-1 is sealed to the acoustic transducer 1430 through a first sealing unit 1470-1, such that the first elastic film 1421-1, the first protrusion structure 1423-1, the first sealing unit 1470-1, and the acoustic transducer 1430 together form the first acoustic cavity 1450. The second elastic element 1420-2 includes a second elastic film 1421-2 and a second protrusion structure 1423-2 disposed on the side of the second elastic film 1421-2 away from the first acoustic cavity 1450. The edge of the second protrusion structure 1423-2 is sealed to the top wall of the housing 1440 (i.e. the side of the housing 1440 away from the acoustic transducer 1430) via the second sealing unit 1470-2.

[0107] In some embodiments, at least one of the first elastic element 1420-1 and the second elastic element 1420-2 may include an elastic microstructure layer (not shown in the figures). Taking the first elastic element 1420-1 as an example, the first elastic element 1420-1 may include a first elastic film 1421-1 and a first elastic microstructure layer, the first elastic microstructure layer being disposed on the side of the first elastic film 1421-1 facing the acoustic transducer 1430. The side of the first elastic microstructure layer facing the acoustic transducer 1430 includes a first protrusion structure 1423-1. The first protrusion structure 1423-1 may be a part of the first elastic microstructure layer. The elastic microstructure layer may be the same as or similar to the elastic microstructure layer in one or more of the foregoing embodiments, and will not be described again here.

[0108] like Figure 12 As shown, the first elastic element 1420-1 and the second elastic element 1420-2 are distributed on opposite sides of the mass element 1460 along the first direction. Here, the first elastic element 1420-1 and the second elastic element 1420-2 can be approximated as a single elastic element 1420. For ease of description, the elastic element 1420 formed by the first elastic element 1420-1 and the second elastic element 1420-2 can be referred to as the third elastic element. The centroid of the third elastic element coincides with or approximately coincides with the center of gravity of the mass element 1460, and the second elastic element 1420-2 is sealed to the top wall of the housing 1440 (i.e., the side of the housing 1440 facing away from the acoustic transducer 1430). This allows the third elastic element to have a higher response sensitivity to vibrations of the housing 1440 in the first direction than to vibrations of the housing 1440 in the second direction within the target frequency range (e.g., below 3000Hz).

[0109] In some embodiments, the third elastic element (i.e., elastic element 1420) vibrates in a first direction in response to the vibration of the housing 1440. The vibration in the first direction can be considered as the target signal picked up by the vibration sensor 1410 (e.g., a vibration sensor), and the vibration in the second direction can be considered as a noise signal. During the operation of the vibration sensor 1410, the response sensitivity of the third elastic element to the vibration of the housing 1440 in the second direction can be reduced by reducing the vibration generated by the third elastic element in the second direction, thereby improving the directional selectivity of the vibration sensor 1410 and reducing the interference of the noise signal on the sound signal.

[0110] In some embodiments, when the third elastic element vibrates in response to the vibration of the housing 1440, if the centroid of the third elastic element coincides with or approximately coincides with the center of gravity of the mass element 1460, and the second elastic element 1420-2 is sealed to the top wall of the housing 1440 (i.e., the side of the housing 1440 facing away from the acoustic transducer 1430), then the vibration of the mass element 1460 in the second direction can be reduced while maintaining the third elastic element's response sensitivity to the vibration of the housing 1440 in the first direction substantially unchanged. This reduces the third elastic element's response sensitivity to the vibration of the housing 1440 in the second direction, thereby improving the directional selectivity of the vibration sensor 1410. It should be noted that the approximate coincidence of the centroid of the third elastic element and the center of gravity of the mass element 1460 can be understood as the third elastic element having a uniform density and regular geometric structure, thus its centroid and center of gravity are approximately coincident. The center of gravity of the third elastic element can be considered as the center of gravity of the mass element 1460. In this case, the centroid of the third elastic element can be considered to be approximately coincident with the center of gravity of the mass element 1460. In some embodiments, when the third elastic element is an irregular structure or has a non-uniform density, its actual center of gravity can be considered to approximately coincide with the center of gravity of the mass element 1460. Approximate coincidence means that the distance between the actual center of gravity or the centroid of the third elastic element and the center of gravity of the mass element 1460 is within a certain range, for example, less than 100 μm, less than 500 μm, less than 1 mm, less than 2 mm, less than 3 mm, less than 5 mm, less than 10 mm, etc.

[0111] When the centroid of the third elastic element coincides with or nearly coincides with the centroid of the mass element 1460, the resonant frequency of the third elastic element vibrating in the second direction can be shifted to a higher frequency without changing the resonant frequency of the third elastic element vibrating in the first direction. The resonant frequency of the third elastic element vibrating in the first direction can remain essentially unchanged; for example, the resonant frequency of the third elastic element vibrating in the first direction can be a frequency within a relatively strong frequency range perceived by the human ear (e.g., 20Hz-2000Hz, 2000Hz-3000Hz, etc.). Meanwhile, the resonant frequency of the third elastic element vibrating in the second direction can be shifted to a higher frequency range perceived by the human ear (e.g., 5000Hz-14000Hz, 1kHz-14kHz, etc.).

[0112] It should be noted that, Figure 9 The first hole 980, the second hole, the third hole, and the fifth hole in the vibration sensor 900 shown are also applicable to... Figure 12 The vibration sensor 1400 shown, for example, has a first hole or a fifth hole on the first elastic element 1420-1, the second elastic element 1420-2 and the mass element 1460.

[0113] Figure 13 This is a structural schematic diagram of the vibration sensor 1600 shown according to some embodiments of this specification. For example... Figure 13 As shown, the vibration sensor 1600 may include a housing 1610, a vibration assembly 1620, and an acoustic transducer 1660. In some embodiments, the housing 1610 may be connected to the acoustic transducer 1660 to form a hollow structure. The connection between the housing 1610 and the acoustic transducer 1660 may be a physical connection. In some embodiments, the vibration assembly 1620 may be located within the enclosed hollow structure. The housing 1610 is configured to generate vibration based on an external vibration signal, and the vibration assembly 1620 is capable of picking up, converting, and transmitting the vibration (e.g., converting the vibration into compression of air within the first acoustic cavity 1624) so ​​that the acoustic transducer 1660 generates an electrical signal.

[0114] In some embodiments, the vibration assembly 1620 may include a mass element 1621, an elastic element 1622, and a support frame 1623. The mass element 1621 and the support frame 1623 are physically connected to both sides of the elastic element 1622, respectively. For example, the mass element 1621 and the support frame 1623 may be connected to the upper and lower surfaces of the elastic element 1622, respectively. The support frame 1623 is physically connected to the acoustic transducer 1660; for example, the upper end of the support frame 1623 may be connected to the lower surface of the elastic element 1622, and its lower end may be connected to the acoustic transducer 1660. The support frame 1623, the elastic element 1622, and the acoustic transducer 1660 may form a first acoustic cavity 1624. For example, as... Figure 13 As shown, the first acoustic cavity 1624 can be formed by an elastic element 1622, an acoustic transducer 1660, and a support frame 1623 including a ring structure. For example, as... Figure 13 As shown, the first acoustic cavity 1624 can be formed by an elastic element 1622, an acoustic transducer 1660, and a support frame 1623 including an annular structure and a base plate. The first acoustic cavity 1624 is acoustically connected to the acoustic transducer 1660. For example, the acoustic transducer 1660 may be provided with a pickup hole 1661, which can be a hole on the acoustic transducer 1660 for receiving signals of volume change of the first acoustic cavity. The first acoustic cavity 1624 can be connected to the pickup hole 1661 provided on the acoustic transducer 1660. The acoustic connection between the first acoustic cavity 1624 and the acoustic transducer 1660 allows the acoustic transducer 1660 to sense changes in the volume of the first acoustic cavity 1624 and generate an electrical signal based on the changes in the volume of the first acoustic cavity 1624. With this configuration, the housing 1610 vibrates based on an external vibration signal. The mass element 1621 is configured to respond to the vibration of the housing 1610, causing the elastic element 1622 to change the volume of the first acoustic cavity 1624. The acoustic transducer 1660 generates an electrical signal based on the change in the volume of the first acoustic cavity 1624. The mass element 1621, the elastic element 1622, and the support frame together constitute a mass-spring-damping system. This vibration assembly 1620 can effectively improve the sensitivity of the vibration sensor.

[0115] In some embodiments, the mass element 1621 is positioned perpendicular to the thickness direction of the mass element 1621 (e.g., ...). Figure 13 The cross-sectional area (in the direction of the middle arrow) is greater than that of the first acoustic cavity 1624 along the direction perpendicular to the height of the first acoustic cavity 1624 (e.g., ...). Figure 13The cross-sectional area (direction of the arrow). In some embodiments, the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 is greater than the cross-sectional area of ​​the first acoustic cavity 1624 along the height direction perpendicular to the first acoustic cavity 1624. The mass element 1621 is configured to compress and deform the area of ​​the elastic element 1622 in contact with the support frame 1623 in response to vibration of the housing 1610, and the elastic element 1622 is capable of vibrating to change the volume of the first acoustic cavity 1624. The acoustic transducer 1660 generates an electrical signal based on the change in volume of the first acoustic cavity 1624.

[0116] It should be noted that when the cross-sectional area of ​​the first acoustic cavity 1624 along the direction perpendicular to its height varies with different heights, the cross-sectional area of ​​the first acoustic cavity 1624 along the direction perpendicular to its height as described in this specification can refer to the area of ​​the cross-section of the first acoustic cavity 1624 on the side closest to the elastic element 1622 along the direction perpendicular to its height.

[0117] In other embodiments, the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621 is smaller than the cross-sectional area of ​​the first acoustic cavity 1624 along the height direction perpendicular to the first acoustic cavity 1624.

[0118] In some embodiments, the vibration assembly 1620 further includes a first aperture 1630, through which the first acoustic cavity 1624 communicates with other acoustic cavities. In some embodiments, apertures are provided on both the elastic element 1622 and the mass element 1621, allowing the first acoustic cavity 1624 to communicate with other acoustic cavities. In some embodiments, the first aperture 1630 may include a first sub-aperture 1631 and a second sub-aperture 1632. The first sub-aperture 1631 may be disposed on the elastic element 1622, and the second sub-aperture 1632 may be located on the mass element 1621, communicating with the first sub-aperture 1631. In some embodiments, the dimensions of the first sub-aperture 1631 and the second sub-aperture 1632 may be the same or different. For details regarding the first aperture 1630, please refer to [reference needed]. Figure 24 and Figure 25 The relevant explanations will not be repeated here. In some embodiments, the vibration component may also be made of a breathable material. For example, in some embodiments, the material of the mass element 1621 may be the same as that of the elastic element 1622, both being made of a breathable material. In some embodiments, the material of the mass element 1621 may be different from that of the elastic element 1622; for example, the elastic element 1622 may be made of a breathable material, while the mass element 1621 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0119] In some embodiments, a second opening (not shown in the figure) may be provided on the housing 1610, through which the first acoustic cavity 1624, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 1600, the second opening can transport the gas inside the housing 1610 to the outside. Thus, by providing the second opening, when assembling the elastic element 1622, the mass element 1621, and the acoustic transducer, failure of the elastic element 1622 and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 1610 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 1600. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 1600. To reduce the impact of airborne sound in the environment, after the vibration sensor 1600 is manufactured, or before it is applied to electronic devices, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 1600. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details on the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0120] In some embodiments, the housing 1610 may be provided with a third hole 1611, which connects the external environment with the acoustic cavity inside the housing 1610, thereby reducing the resistance of the elastic element 1622 during vibration and improving the sensitivity of the vibration sensor 1600. For details of the third hole, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0121] Figure 14 This is a schematic diagram illustrating the connection of the elastic element and support frame according to some embodiments of this specification. For example... Figure 14 As shown, when the mass element 1621 vibrates, only the area 1650 where the elastic element 1622 contacts the support frame 1623 undergoes compressive deformation. The contact portion between the elastic element 1622 and the support frame 1623 is equivalent to a spring. This structure can increase the sensitivity of the vibration sensor 1600.

[0122] In some embodiments, the first acoustic cavity 1624 may be directly connected to the pickup hole 1661 of the acoustic transducer 1660 to form an acoustic connection between the first acoustic cavity 1624 and the acoustic transducer 1660. In other embodiments, the first acoustic cavity 1624 may be connected to the pickup hole 1661 of the acoustic transducer 1660 through a through hole provided on the support frame 1623 to form an acoustic connection between the first acoustic cavity 1624 and the acoustic transducer 1660.

[0123] In some embodiments, the cross-sectional area of ​​the through hole on the support frame 1623 may be different from the cross-sectional area of ​​the pickup hole 1661 of the acoustic transducer 1660. In some embodiments, the cross-sectional shape of the through hole on the support frame 1623 may be different from the cross-sectional shape of the pickup hole 1661 of the acoustic transducer 1660. In some embodiments, the through hole on the support frame 1623 may have a different cross-sectional area but the same cross-sectional shape as the pickup hole 1661 of the acoustic transducer 1660. For example, the cross-sectional area of ​​the through hole may be smaller than the cross-sectional area of ​​the pickup hole 1661, and both the cross-sectional shapes of the through hole and the pickup hole are circular. In some embodiments, the through hole on the support frame 1623 and the pickup hole 1661 of the acoustic transducer 1660 may be aligned. For example, the central axis of the through hole and the central axis of the pickup hole 1661 may be completely coincident. In some embodiments, the through hole on the support frame 1623 and the pickup hole 1661 of the acoustic transducer 1660 may not be aligned. For example, the central axis of the through hole and the central axis of the pickup hole 1661 may be spaced a certain distance apart. It should be noted that the description of a single pickup hole 1661 is for illustrative purposes only and is not intended to limit the scope of the invention. It should be understood that the vibration sensor 1600 may include more than one pickup hole 1661. For example, the vibration sensor 1600 may include a plurality of pickup holes 1661 arranged in an array.

[0124] In some embodiments, the physical connection between the mass element 1621 and the elastic element 1622, the physical connection between the support frame 1623 and the elastic element 1622, and the physical connection between the support frame 1623 and the acoustic transducer 1660 may include welding, gluing, or any combination thereof.

[0125] In some embodiments, the cross-sectional shape of the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 can be rectangular, circular, hexagonal, or irregular, etc. In some embodiments, the cross-sectional shape of the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be rectangular, circular, hexagonal, or irregular, etc. In some embodiments, the cross-sectional shape of the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 and the cross-sectional shape of the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be the same. In other embodiments, the cross-sectional shape of the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 and the cross-sectional shape of the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be different.

[0126] In some embodiments, the height of the first acoustic cavity 1624 may be equal to the thickness of the support frame 1623. In other embodiments, the height of the first acoustic cavity 1624 may be less than the thickness of the support frame 1623.

[0127] In some embodiments, the support frame 1623 may include a ring structure. The support frame 1623 including a ring structure may mean that the support frame 1623 itself is a ring structure (e.g., Figure 13 (As shown), or the support frame 1623 can include a ring structure and a base plate (see details). Figure 15 (and related descriptions), the support frame 1623 may also include an annular structure and other structures. When the support frame 1623 includes an annular structure, the first acoustic cavity 1624 may be located in the hollow part of the annular structure, and the elastic element 1622 may be disposed above the annular structure and close the hollow part of the annular structure to form the first acoustic cavity 1624.

[0128] Understandably, ring structures can include circular ring structures, triangular ring structures, rectangular ring structures, hexagonal ring structures, and irregular ring structures, etc. In this specification, a ring structure can include an inner edge and an outer edge surrounding the inner edge. The inner and outer edges of the ring can have the same shape. For example, both the inner and outer edges of the ring structure can be circular, in which case the ring structure is a circular ring structure; or, for another example, both the inner and outer edges of the ring structure can be hexagonal, in which case the ring structure is a hexagonal ring. The inner and outer edges of the ring structure can have different shapes. For example, the inner edge of the ring structure can be circular, and the outer edge of the ring structure can be rectangular.

[0129] The cross-sectional area of ​​the mass element 1621 along the direction perpendicular to its thickness is greater than the cross-sectional area of ​​the first acoustic cavity 1624 along the direction perpendicular to its height. This can be understood as the mass element 1621 opening the upper end of the first acoustic cavity 1624 (e.g., ...). Figure 13 As shown, the first acoustic cavity 1624 is completely covered. The cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 can be larger than the cross-sectional area of ​​the first acoustic cavity 1624 along the height direction perpendicular to the first acoustic cavity 1624. This can be understood as the mass element 1621 and the elastic element 1622 opening the upper end of the first acoustic cavity 1624 (as shown). Figure 13 (As shown) completely covered. By designing the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621, the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621, and the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622, the area where the vibration unit 1620 deforms is the area where the elastic element 1622 contacts the support frame 1623.

[0130] In some embodiments, the outer edges of the mass element 1621 and the elastic element 1622 may both be located on the support frame 1623. As an example only, when the support frame 1623 includes an annular structure, the outer edges of the mass element 1621 and the elastic element 1622 may both be located on the upper surface of the annular structure, or the outer edges of the mass element 1621 and the elastic element 1622 may be flush with the outer ring of the annular structure. In some embodiments, the outer edges of the mass element 1621 and the elastic element 1622 may both be located outside the support frame 1623. For example, when the support frame 1623 includes an annular structure, the outer edges of the mass element 1621 and the elastic element 1622 may both be located outside the outer ring of the annular structure.

[0131] In some embodiments, when the support frame 1623 is an annular structure, the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be greater than the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624, and the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 can be greater than the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624. In some embodiments, the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be equal to the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624, and the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 can be equal to the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624.

[0132] In some embodiments, the difference between the inner and outer diameters of the annular structure can be greater than a first difference threshold (e.g., 1 μm). In some embodiments, the difference between the inner and outer diameters of the annular structure can be less than a second difference threshold (e.g., 300 μm). For example, the difference between the inner and outer diameters of the annular structure can be 10 μm to 100 μm. By defining the difference between the inner and outer diameters of the annular structure, the area of ​​the region where the elastic element 1622 contacts the support frame 1623 can be defined. Therefore, by setting the difference between the inner and outer diameters of the annular structure within the above-mentioned range, the sensitivity of the vibration sensor can be improved.

[0133] The relationship between the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621 and the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624, and the relationship between the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622 and the cross-sectional area of ​​the outer ring of the annular structure along the height direction perpendicular to the first acoustic cavity 1624, can change the size of the area in contact between the elastic element 1622 and the support frame 1623, thereby changing the area of ​​the region undergoing compression deformation. The size of this area can affect the equivalent stiffness of the vibration unit 1620, thereby affecting the resonant frequency of the vibration unit 1620. By adjusting the size of the area undergoing compression deformation, the equivalent stiffness of the vibration unit 1620 can be adjusted, thereby adjusting the resonant frequency of the vibration unit 1620 to improve the sensitivity of the vibration sensor 1600.

[0134] In some embodiments, for ease of processing, the cross-sectional area of ​​the mass element 1621 along the thickness direction perpendicular to the mass element 1621 can be substantially equal to the cross-sectional area of ​​the elastic element 1622 along the thickness direction perpendicular to the elastic element 1622. With this arrangement, the mass element 1621 and the elastic element 1622 can be cut together during processing, thereby improving production efficiency.

[0135] Figure 15 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 15 As shown, the vibration sensor 1800 may include a housing 1810, a vibration unit 1820, and an acoustic transducer 1860. The vibration unit 1820 may include a mass element 1821, an elastic element 1822, and a support frame 1823. The elastic element 1822, the support frame 1823, and the acoustic transducer 1860 may form a first acoustic cavity 1824. Figure 15 The arrangement, size, shape, etc. of the above-mentioned components can be consistent with... Figure 13 The corresponding component of the vibration sensor 1600 shown is similar. For example... Figure 15 As shown, the vibration sensor 1800 support frame 1823 includes an annular structure 1823-1 and a base plate 1823-2, with the annular structure 1823-1 located on the base plate 1823-2. The base plate 1823-2 has a through hole 1823-3 for communicating with a pickup hole, allowing the first acoustic cavity 1824 to acoustically communicate with the acoustic transducer 1860. In some embodiments, the annular structure 1823-1 and the base plate 1823-2 can be integrally formed, and both can be manufactured by stamping.

[0136] It should be noted that, Figure 13The first hole 1630, the second hole, and the third hole can be applied to Figure 15 The vibration sensor 1800 shown here will not be described in detail.

[0137] Figure 16 This is a structural schematic diagram of a vibration sensor according to some embodiments shown in this specification, such as... Figure 16 As shown, the vibration sensor 2100 may include a housing 2110, a vibration assembly 2120, and an acoustic transducer 2160. The vibration assembly 2120 may include a mass element 2121, an elastic element 2122, and a support frame 2123. The elastic element 2122, the support frame 2123, and the acoustic transducer 2160 can form a first acoustic cavity 2124. Figure 16 The arrangement, size, shape, etc. of the above-mentioned components can be consistent with... Figure 13 The corresponding component of the vibration sensor 1600 shown is similar. The vibration assembly 2120 may also include another elastic element 2125 and another support frame 2126. The other elastic element 2125 is physically connected to the side of the mass element 2121 opposite to the elastic element 2122, and the other support frame 2126 is physically connected to the side of the other elastic element 2125 opposite to the mass element 2121. That is, the other support frame 2126 and the mass element 2121 can be physically connected to both sides of the other elastic element 2125, respectively. The other support frame 2126 is physically connected to the housing 2110. By configuring the other support frame 2126 and the other elastic element 2125, the lateral sensitivity of the vibration sensor 2100 can be reduced, and the longitudinal sensitivity of the vibration sensor 2100 can be increased, thereby improving the directional selectivity of the sensitivity. The other elastic element 2125 and... Figure 2 The diaphragm 222 shown is made of a similar material and is arranged in a similar manner to the other support frame 2126. Figure 2 The support frames 223 shown are made of similar materials. The structures of support frames 2123 and another support frame 2126 can be the same or different. For example, both support frames 2123 and another support frame 2126 can be ring-shaped structures. As another example, support frame 2123 may include a base plate and a ring-shaped structure, while the other support frame 2126 may be a ring-shaped structure itself.

[0138] In some embodiments, the cross-sectional area of ​​the other elastic element 2125 along the direction perpendicular to its thickness can be exactly the same as the cross-sectional area of ​​the elastic element 2122 along the direction perpendicular to its thickness. In some embodiments, the cross-sectional shape of the other elastic element 2125 along the direction perpendicular to its thickness can be the same as the cross-sectional shape of the elastic element 2122 along the direction perpendicular to its thickness, while the cross-sectional areas may be slightly different.

[0139] In some embodiments, another elastic element 2125 and another elastic element 2122 are symmetrically arranged with respect to the mass element 2121. Symmetrical arrangement can be understood as the elastic element 2122 and the other elastic element 2125 being located on opposite sides of the mass element 2121, with the thickness of the elastic element 2122 being the same as the thickness of the other elastic element 2125, and the cross-sectional area of ​​the elastic element 2122 along the direction perpendicular to its thickness being the same as the cross-sectional area of ​​the other elastic element 2125 along the direction perpendicular to its thickness. Figure 16 As shown, another elastic element 2125 and elastic element 2122 can be fixed to the upper and lower surfaces of the mass element, respectively.

[0140] In some embodiments, the vibration assembly 2120 further includes a first aperture (not shown in the figure), through which the first acoustic cavity 2124 communicates with other acoustic cavities. In some embodiments, the first aperture may include at least three apertures (not shown in the figure), which are respectively disposed on the elastic element 2122, the mass element 2121, and the elastic element 2125, so that the first acoustic cavity 2124 communicates with the other acoustic cavities. For details of the first aperture, please refer to [reference needed]. Figure 24 and Figure 25 The relevant explanations will not be repeated here. In some embodiments, the vibration component may also be made of a breathable material. For example, in some embodiments, the material of the mass element 2121 may be the same as that of the elastic element 2122, both being made of a breathable material. In some embodiments, the material of the mass element 2121 may be different from that of the elastic element 2122; for example, the elastic element 2122 may be made of a breathable material, while the mass element 2121 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0141] In some embodiments, the housing 2110 may have a second opening (not shown in the figure), through which the first acoustic cavity 2124, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 2100, the second opening can deliver the gas inside the housing 2110 to the outside. Thus, by providing the second opening, when assembling the elastic element 2122, the mass element 2121, and the acoustic transducer, failure of the elastic element 2122 and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 2110 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 2100. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 2100. To reduce the impact of airborne sound in the environment, after the vibration sensor 2100 is manufactured, or before it is applied to an electronic device, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 2100. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details regarding the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0142] In some embodiments, the housing 2110 may be provided with a third opening (not shown in the figure), which connects the external environment with the acoustic cavity inside the housing 2110, thereby reducing the resistance of the elastic element 2122 during vibration and improving the sensitivity of the vibration sensor 2100. For details of the third opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0143] Figure 17 This is a structural schematic diagram of a vibration sensor provided according to some embodiments of this specification. For example... Figure 17 As shown, the vibration sensor 2200 may include an acoustic transducer 2210 and a resonant system. In some embodiments, the acoustic transducer 2210 may be housed within the space formed by the housing 2211 and the substrate (PCB) 2212. The acoustic transducer 2210 may include a processor 2213 and a sensing element 2214. The housing 2211 may be a regular or irregular three-dimensional structure with an internal cavity (i.e., a hollow portion), for example, it may be a hollow frame structure, including but not limited to regular shapes such as rectangular frames, circular frames, regular polygonal frames, and any irregular shape. The processor 2213 may acquire electrical signals from the sensing element 2214 and perform signal processing.

[0144] In some embodiments, the sensing element 2214 and the processor 2213 are respectively connected to the upper surface of the substrate 2212, which is located in a cavity inside the housing 2211. The housing 2211 seals the sensing element 2214, the processor 2213, the substrate 2212, and the circuits and other components disposed thereon. The substrate 2212 divides the cavity inside the housing 2211 into two chambers arranged vertically. In some embodiments, the sensing element 2214 and the processor 2213 are fixedly connected to the substrate 2212 by sensing element fixing adhesive and processor fixing adhesive, respectively. In some embodiments, the sensing element fixing adhesive and / or the processor fixing adhesive can be conductive adhesive (e.g., conductive silver paste, copper powder conductive adhesive, nickel-carbon conductive adhesive, silver-copper conductive adhesive, etc.). In some embodiments, the conductive adhesive can be one or more of conductive glue, conductive film, conductive ring, conductive tape, etc. The sensing element 2214 and / or the processor 2213 are electrically connected to other components through circuits disposed on the substrate 2212. The sensing element 2214 and the processor 2213 can be directly connected by wires (such as gold wire, copper wire, aluminum wire, etc.).

[0145] The resonant system is located in the cavity corresponding to the lower surface of the substrate 2212. In some embodiments, the resonant system may include a vibration component 2220, which can generate vibration in response to the vibration of the housing 2211, so that the vibration sensor 2200 forms a second resonant frequency less than the first resonant frequency corresponding to the sensor in a specific frequency band (e.g., the human voice frequency band), thereby improving the sensitivity of the sensor device 2200 in the specific frequency band range.

[0146] In some embodiments, the vibration assembly 2220 may include at least an elastic element 2221 and a mass element 2222. The elastic element 2221 can be connected to the housing 2211 via its periphery; for example, the elastic element 2221 can be connected to the inner wall of the housing 220 by means of adhesive bonding, snap-fitting, etc. The mass element 2222 is disposed on the elastic element 2221. Specifically, the mass element 2222 can be disposed on the upper surface or the lower surface of the elastic element 2221. The upper surface of the elastic element 2221 may refer to the side of the elastic element 2221 facing the substrate 2212, and the lower surface of the elastic element 2221 may refer to the side of the elastic element 2221 facing away from the substrate 2212. In some embodiments, the number of mass elements 2222 can be multiple, and multiple mass elements 2222 can be simultaneously located on the upper or lower surface of the elastic element 2221. In some embodiments, a portion of the plurality of mass elements 2222 may be disposed on the upper surface of the elastic element 2221, while another portion of the mass elements 2222 may be located on the lower surface of the elastic element 2221. In some embodiments, the mass elements 2222 may also be embedded in the elastic element 2221.

[0147] In some embodiments, a first acoustic cavity 2230 may be formed between the elastic element 2221 and the acoustic transducer 2210. Specifically, the upper surface of the elastic element 2221, the substrate 2212, and the housing 2211 may form the first acoustic cavity 2230, and the lower surface of the elastic element 2221 and the housing 2211 may form a second acoustic cavity 2240. In embodiments of this specification, by introducing a resonant system based on the acoustic transducer 2210, the second resonant frequency provided by the resonant system allows the vibration sensor 2200 to generate new resonant peaks (e.g., a second resonant peak) in frequency bands other than the first resonant frequency of the acoustic transducer 2210 (e.g., near the second resonant frequency), thereby enabling the vibration sensor 2200 to have higher sensitivity over a wider frequency range compared to a standard sensor. In some embodiments, the second resonant frequency can be adjusted by adjusting the mechanical parameters of the resonant system (e.g., stiffness, mass, damping, etc.), thereby adjusting the sensitivity of the vibration sensor 2200. It should be noted that the comparison between the sensitivity of the vibration sensor and the sensitivity of the acoustic transducer 2210 in the embodiments of this specification can be understood as a comparison of the sensitivity of the acoustic transducer 2210 after the introduction of the resonant system and before the introduction of the resonant system.

[0148] In this embodiment, the elastic element 2221 provides stiffness and damping for the resonant system, and the mass element 2222 provides mass and damping for the resonant system. The combination of the elastic element 2221 and the mass element 2222 is equivalent to a spring-mass-damped system, thus constituting a resonant system. Therefore, the stiffness, mass, and damping of the resonant system can be adjusted by modifying the structure, material, etc., of the elastic element 2221 and / or the mass element 2222, thereby adjusting the second resonant frequency provided by the resonant system. This allows the vibration sensor to generate a new resonant peak within the desired frequency band (e.g., near the second resonant frequency), improving sensitivity. This ensures that the vibration sensor 2200 also has high sensitivity for external signals whose frequencies are not near the first resonant frequency of the acoustic transducer 2210.

[0149] Furthermore, the sensitivity of the vibration sensor 2200 can be related to the stiffness of the elastic element 2221, the mass of the mass element 2222, and the spatial volume of the cavity (i.e., the first acoustic cavity 2230) between the elastic element 2221 and the acoustic transducer 2210. In some embodiments, the lower the stiffness of the elastic element 2221, the greater the mass of the mass element 2222, or the smaller the spatial volume of the first acoustic cavity 2230, the higher the sensitivity of the vibration sensor.

[0150] In some embodiments, the mechanical parameters (e.g., material, size, shape, etc.) of the mass element 2222 can be adjusted to enable the vibration sensor 2200 to obtain a more ideal frequency response, thereby adjusting the resonant frequency and sensitivity of the vibration sensor 2200 and ensuring the reliability of the vibration sensor 2200. In some embodiments, the mass element 2222 can be a regular or irregular shape such as a cuboid, cylinder, sphere, ellipsoid, or triangle.

[0151] In some embodiments, the mass element 2222 can be made of polymeric materials such as polyurethane (PU), polyamide (PA) (commonly known as nylon), polytetrafluoroethylene (PTFE), and phenolic resin (PF). The elastic properties of the polymeric material mass element 2222 can absorb external impact loads, thereby effectively reducing stress concentration at the connection between the elastic element and the sensor housing, further reducing the possibility of damage to the vibration sensor due to external impacts.

[0152] In some embodiments, the stiffness of the elastic element 2221 can be adjusted by modifying its mechanical parameters (e.g., Young's modulus, tensile strength, elongation, and hardness Shore A) to achieve a more ideal frequency response for the vibration sensor 2200, thereby enabling adjustment of the resonant frequency and sensitivity of the vibration sensor 2200. In some embodiments, to improve the sensitivity of the vibration sensor 2200 relative to the acoustic transducer 2210, the second resonant frequency provided by the resonant system can be lower than the first resonant frequency of the acoustic transducer 2210. For example, a second resonant frequency that is 1000Hz to 10000Hz lower than the first resonant frequency can improve the sensitivity of the vibration sensor 2200 by 3dB to 30dB compared to the acoustic transducer 2210.

[0153] In some embodiments, the elastic element 2221 may be made of a flexible polymer material, which may include, but is not limited to, polyimide (PI), parylene, polydimethylsiloxane (Pdms), hydrogel, etc. In some embodiments, the elastic element 2221 may also be made of an inorganic rigid material, which may include, but is not limited to, semiconductor materials such as silicon (Si) and silicon dioxide (SiO2) or metallic materials such as copper, aluminum, steel, gold, etc.

[0154] In some embodiments, to facilitate the adjustment of the mechanical parameters of the elastic element and achieve stiffness adjustment of the resonant system, thereby improving the frequency response curve of the vibration sensor and enhancing its resonant frequency and sensitivity, the elastic element may also be a multilayer composite film structure. In some embodiments, the elastic element may include at least two film layers. The at least two film layers in the multilayer composite film structure have different stiffnesses.

[0155] In some embodiments, the vibration assembly 2220 further includes a first aperture (not shown in the figure), through which the first acoustic cavity 2230 communicates with other acoustic cavities. In some embodiments, the first aperture may include a first sub-aperture (not shown in the figure), which may be disposed in an area of ​​the elastic element 2221 not covered by the mass element 2222, so that the first acoustic cavity 2230 communicates with other acoustic cavities. In some embodiments, apertures may also be provided on both the elastic element 2221 and the mass element 2222, so that the first acoustic cavity 2230 communicates with other acoustic cavities. For example, the first aperture may include a first sub-aperture and a second sub-aperture (not shown in the figure), where the first sub-aperture may be disposed on the elastic element 2221 and the second sub-aperture is located on the mass element 2222, and the first sub-aperture and the second sub-aperture communicate with each other. In some embodiments, the dimensions of the first sub-aperture and the second sub-aperture may be the same or different. For details on the first aperture, please refer to [reference needed]. Figure 24 and Figure 25 The relevant explanations will not be repeated here. In some embodiments, the vibration component may also be made of a breathable material. For example, in some embodiments, the material of the mass element 2222 may be the same as that of the elastic element 2221, both being made of a breathable material. In some embodiments, the material of the mass element 2222 may be different from that of the elastic element 2221; for example, the elastic element 2221 may be made of a breathable material, while the mass element 2222 may be made of a rigid material (e.g., iron, copper, silicon, etc.).

[0156] In some embodiments, a second opening (not shown in the figure) may be provided on the housing 2211, through which the first acoustic cavity 2230, other acoustic cavities, and acoustic transducers communicate with the outside. During the assembly of the vibration sensor 2200, the second opening can deliver the gas inside the housing 2230 to the outside. Thus, by providing the second opening, during the assembly of the vibration assembly 2220 and the acoustic transducer, the failure of the elastic element 2221 and the acoustic transducer due to excessive air pressure difference between the inside and outside of the housing 2230 can be avoided, thereby reducing the assembly difficulty of the vibration sensor 2200. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 2200. To reduce the impact of airborne sound in the environment, after the vibration sensor 2200 is manufactured, or before it is applied to electronic devices, the second opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 2200. In some embodiments, the second opening can be sealed by using sealant, adhesive sealing tape, or adding a sealing plug. For details regarding the second opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0157] In some embodiments, the housing 2211 may be provided with a third opening (not shown in the figure). The third opening connects the external environment with the acoustic cavity inside the housing 2211, thereby reducing the resistance of the elastic element 2221 during vibration and improving the sensitivity of the vibration sensor 2200. For details of the third opening, please refer to [reference needed]. Figure 2 The relevant descriptions will not be repeated here.

[0158] Figure 18 Figure (a) in the figure is an exemplary frequency response curve of a vibration sensor provided according to some embodiments of this specification. Figure 18 As shown in (a), the dashed line represents the frequency response curve 2310, which is the frequency response curve of the sensor, and the solid line represents the frequency response curve 2320, which is the frequency response curve of the sensing device. The horizontal axis represents frequency in Hertz (Hz), and the vertical axis represents sensitivity in Decibels (dBV). Frequency response curve 2310 includes a resonance peak 2311, which corresponds to the resonant frequency of the sensor. Frequency response curve 2320 includes a first resonance peak 2321 and a second resonance peak 2322. For the sensing device, the frequency corresponding to the first resonance peak 2321 is the first resonant frequency, and the second resonance peak 2322 is formed by the action of the resonant system, corresponding to the second resonant frequency.

[0159] It should be noted that the second resonant peak 2322 shown in the figure is to the left of the first resonant peak 2321, meaning the frequency corresponding to the second resonant peak 2322 is lower than the frequency corresponding to the first resonant peak. In some embodiments, the mechanical parameters in the acoustic transducer 2210 or the vibration component 2220 can be changed so that the frequency corresponding to the second resonant peak 2322 (i.e., the first resonant frequency) is greater than the frequency corresponding to the first resonant peak 2321 (i.e., the second resonant frequency), meaning the second resonant peak 2322 is to the right of the first resonant peak 2321. In some embodiments, when the resonant system includes a vibration component composed of an elastic element and a mass element, the second resonant peak 2322 can be to the left of the first resonant peak 2321, meaning the second resonant frequency is lower than the first resonant frequency. For example, in some embodiments, the difference between the second resonant frequency and the first resonant frequency is between 200Hz and 15000Hz. In other embodiments, the difference between the second resonant frequency and the first resonant frequency is between 1000Hz and 8000Hz. For example, in some embodiments, the difference between the second resonant frequency and the first resonant frequency is between 2000Hz and 6000Hz. In some embodiments, the position of the second resonant peak 2322 is relative to the elastic element (e.g., Figure 17 The elastic element 2221 shown) and / or the mass element (e.g., Figure 17 The second resonant peak 2322 is related to the mechanical parameters of the mass element 2222 shown. For example, the larger the mass of the mass element, the lower the second resonant frequency, and the lower the second resonant peak 2322 will shift to lower frequencies; or the better the elasticity of the elastic element, the higher the second resonant frequency, and the higher the second resonant peak 2322 will shift to higher frequencies. In some embodiments, for a sensing device with an internally filled liquid as a resonant system, the second resonant peak 2322 is located to the left of the first resonant peak 2321, and its position can be related to the properties of the filled liquid (e.g., density, kinematic viscosity, volume, etc.) and the properties of the elastic element. As the density of the liquid decreases or the kinematic viscosity increases, its resonant peak shifts to higher frequencies.

[0160] In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 100Hz to 18000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 100Hz to 10000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 500Hz to 10000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 1000Hz to 7000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 1500Hz to 5000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 2000Hz to 5000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 2000Hz to 4000Hz. In some embodiments, the frequency corresponding to the resonance peak 2311 is in the range of 3000Hz to 4000Hz.

[0161] In some embodiments, the frequency corresponding to the first resonance peak 2321 (i.e., the first resonant frequency) and the resonant frequency corresponding to the resonance peak 2311 may be the same. For example, when the resonant system includes a vibration component formed by a combination of elastic elements and mass elements, the resonant system has almost no effect on the stiffness, mass, and damping of the sensor itself, so the first resonant frequency of the sensor in the sensing device does not change relative to the sensor's own resonant frequency (i.e., the resonant frequency corresponding to the resonance peak 2311).

[0162] In some embodiments, the frequency corresponding to the first resonant peak 2321 is in the range of 500Hz to 10000Hz. In some embodiments, the frequency corresponding to the first resonant peak 2321 is in the range of 1500Hz to 5000Hz. In some embodiments, the frequency corresponding to the first resonant peak 2321 is in the range of 2000Hz to 4000Hz. In some embodiments, the frequency corresponding to the first resonant peak 2321 is in the range of 3000Hz to 4000Hz.

[0163] In some embodiments, the resonant frequency (first resonant frequency) corresponding to the first resonant peak 2321 is different from the resonant frequency corresponding to the resonant peak 2311. For example, for a sensing device whose housing cavity is filled with liquid, the liquid acts as a resonant system. Since the liquid is incompressible, the system's stiffness increases, so the first frequency corresponding to the first resonant peak 2321 is larger than the resonant frequency corresponding to the resonant peak 2311, that is, the first resonant peak 2321 shifts to the right relative to the resonant peak 2311.

[0164] In some embodiments, the frequency corresponding to the second resonant peak 2322 is in the range of 100Hz to 5000Hz. In some embodiments, the frequency corresponding to the second resonant peak 2322 is in the range of 500Hz to 5000Hz. In some embodiments, the frequency corresponding to the second resonant peak 2322 is in the range of 1000Hz to 2000Hz. In some embodiments, the frequency corresponding to the second resonant peak 2322 is in the range of 1500Hz to 2000Hz. In some embodiments, one or more mechanical parameters (e.g., ...) can be adjusted by modifying the structure, materials, and resonant system of the sensor. Figure 17 The mass of the mass element 2222, the stiffness of the elastic element 2221, and the dimensions of the first acoustic cavity 2230 (as shown) make the area between the two resonant peaks 2321 and 2322 on the frequency response curve 2320 relatively flat, thereby improving the output quality of the sensing device. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 50 dBV. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 20 dBV. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 15 dBV. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 10 dBV. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 8 dBV. In some embodiments, the sensitivity difference between the trough between the first resonant peak 2321 and the second resonant peak 2322 corresponding to the first resonant frequency and the peak value of the higher of the two resonant peaks is no higher than 5 dBV.

[0165] Accordingly, the difference between the resonant frequencies corresponding to the first resonant peak 2321 and the second resonant peak 2322 (the first resonant frequency corresponding to the first resonant peak 2321 is represented by f0 (close to the resonant peak 2311), and the second resonant frequency of the second resonant peak 2322 is represented by f1; the frequency difference Δf1 represents the difference between the resonant frequencies corresponding to the first resonant peak 2321 and the second resonant peak 2322, i.e., the difference between the first resonant frequency f0 and the second resonant frequency f1) within a certain range can make the frequency response curve between the resonant peaks 2321 and 2322 relatively flat. In some embodiments, the frequency difference Δf1 is in the range of 200Hz to 8000Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.3 to 3. In some embodiments, the frequency difference Δf1 is in the range of 200 to 2000Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.2 to 0.65. In some embodiments, the frequency difference Δf1 is in the range of 500~1500Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.25~0.6. In some embodiments, the frequency difference Δf1 is in the range of 800~1500Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.3~0.6. In some embodiments, the frequency difference Δf1 is in the range of 1000~1500Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.35~0.6.

[0166] See also Figure 18 As shown in (a), compared to frequency response curve 2310, frequency response curve 2320 exhibits a higher and more stable increase in sensitivity (i.e., the difference, denoted by ΔV1) within the frequency range below the resonant frequency f1 corresponding to the second resonant peak 2322. In some embodiments, the increase ΔV1 is in the range of 15 dBV to 50 dBV. In some embodiments, the increase ΔV1 is in the range of 30 dBV to 40 dBV.

[0167] In some embodiments, the presence of the resonant system suppresses the resonant peak corresponding to the sensor in the sensing device, resulting in a relatively low Q value at the first resonant peak 2321 of the frequency response curve 2320. This flattens the frequency response curve within the desired frequency band (e.g., mid-to-low frequencies), and the difference between the peak value of the highest peak and the valley value of the lowest valley in the overall frequency response curve 2320 (also known as the peak-to-valley value, denoted by ΔV2) is within a certain range. In some embodiments, the peak-to-valley value does not exceed 5 dBV.

[0168] In some embodiments, the frequency response of the sensing device can be described by one or more of the relevant parameters of curve 2320, such as the peak value and frequency of the first resonant peak 2321, the peak value and frequency of the second resonant peak 2322, the Q value, Δf1, ΔV1, ΔV2, the ratio of Δf1 to f0, the ratio of peak-to-valley values ​​to the peak value of the highest peak, and the first-order, second-order, and third-order coefficients of the equation determined by fitting the frequency response curve. In some embodiments, when the resonant system includes resonant elements, the frequency response of the sensing device can be related to the mechanical parameters of the mass element and the elastic element (e.g., mass, damping, stiffness, etc.). In some embodiments, when the resonant system is formed of liquid, the frequency response of the sensing device can be related to the properties of the filling liquid and / or the parameters of the sensor. The properties of the liquid may include, for example, liquid density, liquid kinematic viscosity, liquid volume, presence of bubbles, bubble volume, bubble location, number of bubbles, etc. The parameters of the sensor may include, for example, the internal structure, dimensions, and stiffness of the housing, the mass of the sensor, and / or the dimensions and stiffness of the sensing element (e.g., a cantilever beam), etc.

[0169] Figure 18 Figure (b) in the figure is an exemplary frequency response curve of another vibration sensor provided according to some embodiments of this specification. Figure 18 As shown in (b), the dashed line represents the frequency response curve 2360, which is the frequency response curve of the sensor, and the solid line represents the frequency response curve 2370, which is the frequency response curve of the sensing device. Frequency response curve 2360 includes a resonance peak 2361, which corresponds to the resonant frequency of the sensor. In some embodiments, the higher resonant frequency of the sensor is not in the desired frequency range (e.g., 100~5000Hz, 500~7000Hz, etc.). In some embodiments, the resonant frequency of the sensor can be in a higher frequency range. For example, in some embodiments, the resonant frequency of the sensor is higher than 7000Hz. In some embodiments, the resonant frequency of the sensor is higher than 10000Hz. In some embodiments, the resonant frequency of the sensor is higher than 12000Hz. In some embodiments, the resonant frequency of the sensor is higher than 15000Hz. Accordingly, because the sensing device has an additional resonant system, the sensing device can have higher stiffness, resulting in higher shock resistance and reliability.

[0170] Frequency response curve 2370 includes a first resonant peak (not shown) and a second resonant peak 2372. In some embodiments, the frequency corresponding to the first resonant peak is close to or the same as the resonant frequency of the sensor in frequency response curve 2360. In some embodiments, frequency response curve 2370 and... Figure 18 The frequency response curve 2320 in a is roughly the same, except that the first resonant peak is shifted to the right. The frequency corresponding to the second resonant peak 2372 is... Figure 18The frequency range corresponding to the second resonance peak 2322 in a is the same or similar.

[0171] In some embodiments, within a desired frequency range (e.g., within 2000Hz, 3000Hz, 5000Hz, etc.), the difference between the maximum and minimum sensitivity values ​​in the frequency response curve 2370 should be maintained within a certain range to ensure the stability of the sensing device. In some embodiments, within a desired frequency range (e.g., the second resonant frequency range), the difference between the minimum sensitivity value within the frequency range below the second resonant frequency and the sensitivity of the peak value of the second resonant peak 2372 corresponding to the second resonant frequency is no higher than 40 dBV. In some embodiments, within a desired frequency range (e.g., the second resonant frequency range), the difference between the minimum sensitivity value within the frequency range below the second resonant frequency and the sensitivity of the peak value of the second resonant peak 2372 corresponding to the second resonant frequency is no higher than 30 dBV. In some embodiments, within a desired frequency range (e.g., the second resonant frequency range), the difference between the minimum sensitivity value within the frequency range below the second resonant frequency and the sensitivity of the peak value of the second resonant peak 2372 corresponding to the second resonant frequency is no higher than 20 dBV. In some embodiments, within a desired frequency range (e.g., a second resonant frequency range), the difference between the minimum sensitivity within the frequency range below the second resonant frequency and the sensitivity of the peak value of the second resonant peak 2372 corresponding to the second resonant frequency is no higher than 10 dBV.

[0172] In some embodiments, the difference between the resonant frequencies corresponding to the first resonant peak and the second resonant peak 2372 (the frequency of the first resonant peak is represented by f0 (close to the resonant peak 2361), the frequency of the second resonant peak 2372 is represented by f1, and the difference between the resonant frequencies corresponding to the two resonant peaks is represented by the frequency difference Δf2) is within a certain range. In some embodiments, the frequency difference Δf1 is in the range of 200Hz to 8000Hz, and the ratio of the frequency difference Δf1 to f0 is in the range of 0.3 to 3. In some embodiments, the frequency difference Δf2 is in the range of 1000 to 6000Hz, and the ratio of the frequency difference Δf2 to f0 is in the range of 0.2 to 0.65. In some embodiments, the frequency difference Δf2 is in the range of 3000 to 5000Hz, and the ratio of the frequency difference Δf2 to f0 is in the range of 0.3 to 0.5. In some embodiments, the frequency difference Δf2 is in the range of 3000 to 4000Hz, and the ratio of the frequency difference Δf2 to f0 is in the range of 0.3 to 0.4.

[0173] Furthermore, compared to frequency response curve 2360, frequency response curve 2370 exhibits a higher and more stable increase in sensitivity (i.e., the difference, denoted by ΔV3) within the frequency range below the resonant frequency f1 corresponding to the second resonant peak 2372. In some embodiments, the increase ΔV3 is in the range of 10 dBV to 60 dBV. In some embodiments, the increase ΔV3 is in the range of 30 dBV to 40 dBV.

[0174] In some embodiments, the frequency response of the sensing device 200 can be described by one or more of the following parameters related to curve 2370: the peak value and frequency of the primary resonance peak, the peak value and frequency of the secondary resonance peak 2372, the Q value, Δf2, ΔV3, the ratio of Δf2 to f0, the ratio of the maximum sensitivity to the minimum sensitivity within the desired frequency range, and the first-order, second-order, and third-order coefficients of the equation determined by fitting the frequency response curve. In some embodiments, the frequency response of the sensing device can be related to the properties of the filling liquid and / or the parameters of the sensor. In some embodiments, to obtain the ideal output frequency response of the sensing device (e.g., frequency response curve 2370), the ranges of the parameters (also known as frequency response influencing factors, including the parameters of the vibrating components and / or the sensor) listed above that affect the frequency response can be determined by computer simulation, phantom experiments, etc. Figure 18 The methods described in section a are the same or similar, and will not be repeated here.

[0175] In some embodiments, when the resonant system is formed of a liquid, such as when liquid is filled between multiple elastic elements as a resonant system, the frequency response of the sensing device may be related to the properties of the filling liquid and / or the parameters of the sensor and the elastic elements. In some embodiments, the properties of the liquid may include, but are not limited to, one or more of the following: liquid density, liquid kinematic viscosity, liquid volume, presence of bubbles, bubble volume, bubble location, and number of bubbles. In some embodiments, the parameters of the sensor may include, but are not limited to, the internal structure, dimensions, and stiffness of the housing, the mass of the sensor, and / or the dimensions and stiffness of the sensing element (e.g., a diaphragm). In some embodiments, the parameters of the elastic element may include, but are not limited to, dimensions, Young's modulus, stiffness, damping, elongation, and hardness.

[0176] In some embodiments, the influence of certain factors on the frequency response of a sensing device is related to that of other factors. Therefore, the influence of parameter pairs or groups on the frequency response of the sensing device can be determined by using corresponding parameter pairs or groups. For example, for Figure 17In the resonant system shown, when the shape of the mass element 2222 is changed, the mass element 2222's mass, volume, and contact area with the elastic element 2221 also change. Therefore, the shape, mass, volume, and contact area with the elastic element 2221 (or the ratio of any two parameters, or the product of at least two parameters, etc.) of the mass element can be used as a parameter set to test the performance of sensing devices with different parameter pairs and parameter set characteristics.

[0177] For example, for a sensing device that includes mass elements of different masses, the larger the mass of the mass element, the smaller the Q value of the frequency response of the sensing device.

[0178] It should be noted that the above description of the frequency response curve of the sensing device is merely illustrative and should not be construed as limiting this specification to the scope of the illustrated embodiments. It is understood that those skilled in the art, after understanding the principle of the system, may make arbitrary adjustments to its structure and composition without departing from this principle. Such modifications are all within the scope of protection of this specification.

[0179] In some embodiments, the resonant system can reduce the external impact on the sensing element to protect it. For example, the resonant system includes an elastic structure (e.g., an elastic element) whose elasticity can absorb external impact loads, reducing the possibility of damage to the sensing device due to external impacts. Alternatively, the resonant system may also include a mass element made of a polymer material; the elastic properties of the polymer mass element can also absorb external impact loads, thereby effectively reducing stress concentration at the connection between the elastic element and the sensor housing, further reducing the possibility of damage to the sensing device due to external impacts. Furthermore, if the resonant system is a liquid filling the sensor cavity, the viscosity of the liquid, coupled with its relatively low stiffness compared to the device material, improves the impact reliability when the sensing device receives external impact loads (e.g., a bone conduction microphone requires resistance to impacts with 10,000g acceleration). Specifically, due to the viscosity of the liquid, some impact energy can be absorbed and dissipated, significantly reducing the impact load on the sensing element.

[0180] It should be noted that the sensing device in the above embodiments can be considered as a sensor with a resonant system added. The resonant system is coupled between the sensor housing and the sensing element. Here, the sensor housing can be regarded as the housing of the sensing device. In some other embodiments, the housing for accommodating the resonant system can also be a housing structure independent of the sensor housing, which is connected to the sensor housing, and the cavities of the two are interconnected.

[0181] Figure 19This is a schematic diagram of a vibration sensor 2400 with a multilayer composite film structure as its elastic element, provided according to some embodiments of this specification. The structure of the vibration sensor 2400 is similar to... Figure 17 The vibration sensor 2200 shown has a similar structure, the difference being the different elastic elements. Figure 19 The structures shown, including housing 2411, substrate 2412, processor 2413, sensing element 2414, pickup hole 24121, mass element 2422, first acoustic cavity 2430, and second acoustic cavity 2440, are respectively related to... Figure 17 The structures of the housing 2211, substrate 2212, processor 2213, sensing element 2214, pickup hole 22121, mass element 2222, first acoustic cavity 2230 and second acoustic cavity 2240 shown are similar and will not be described in detail here.

[0182] Furthermore, such as Figure 19 As shown, the elastic element 2421 is a multilayer composite vibrating diaphragm, comprising a first elastic element 24211 and a second elastic element 24212. In some embodiments, the first elastic element 24211 and the second elastic element 24212 may be made of the same or different materials. For example, in some embodiments, the first elastic element 24211 and the second elastic element 24212 may be made of the same material (e.g., polyimide). As another example, in some embodiments, one of the first elastic element 24211 and the second elastic element 24212 may be made of a polymer material, while the other may be made of a different polymer material or a metallic material. In some embodiments, the stiffness of the first elastic element 24211 and the second elastic element 24212 may be different; for example, the stiffness of the first elastic element 24211 may be greater than or less than the stiffness of the second elastic element 24212. In this embodiment, taking the first elastic element 24211 having a higher stiffness than the second elastic element 24212 as an example, the second elastic element 24212 can provide the required damping for the resonant system, while the first elastic element 24211 has a higher stiffness, which can ensure that the elastic element 2421 has higher strength, thereby ensuring the reliability of the resonant system and even the entire vibration sensor 2400.

[0183] It is important to note that Figure 19The descriptions regarding the number of membrane layers in the elastic element are for illustrative purposes only and should not limit this specification to the embodiments described. In some embodiments, the elastic element may also include two or more membrane layers, for example, three, four, five, or more membrane layers. As an example only, the elastic element may include a first elastic element, a second elastic element, and a third elastic element connected sequentially from top to bottom. The material, mechanical parameters, and dimensions of the first elastic element may be the same as those of the third elastic element, while the material, mechanical parameters, and dimensions of the second elastic element may be different from those of the first or third elastic element. For example, the stiffness of the first or third elastic element may be greater than that of the second elastic element. In some embodiments, the mechanical parameters of the elastic element can be adjusted by adjusting the material, mechanical parameters, and dimensions of the first, second, and / or third elastic elements, thereby ensuring the stability of the vibration sensor 2400.

[0184] By configuring the elastic element 2421 as a multilayer elastic element, the stiffness of the elastic element 2421 can be easily adjusted. For example, by increasing or decreasing the number of elastic elements (e.g., the first elastic element 24211 and / or the second elastic element 24212), the stiffness and damping of the resonant system can be adjusted, thereby adjusting the second resonant frequency. This allows the vibration sensor to generate a new resonant peak in the desired frequency band (e.g., near the second resonant frequency), improving the sensitivity of the vibration sensor in a specific frequency range. In some embodiments, adjacent two layers of the multilayer composite film structure (e.g., the first elastic element 24211 and the second elastic element 24212) can be bonded together to form the elastic element 2421.

[0185] In some embodiments, the stiffness of the elastic element 2421 can be adjusted by modifying the mechanical parameters (e.g., material, Young's modulus, tensile strength, elongation, and hardness Shore A) of at least one layer of elastic element 2421 (first elastic element 24211 and / or second elastic element 24212) to achieve a more ideal frequency response for the vibration sensor 2400, thereby enabling adjustment of the resonant frequency and sensitivity of the vibration sensor 2400. In some embodiments, to improve the sensitivity of the vibration sensor 2400 relative to the sensor 2410, the second resonant frequency provided by the resonant system can be lower than the first resonant frequency of the sensor 2410. For example, a second resonant frequency that is 1000 Hz to 10000 Hz lower than the first resonant frequency can improve the sensitivity of the vibration sensor 2400 by 3 dB to 30 dB compared to the sensor 2410.

[0186] In some embodiments, the sensitivity of the vibration sensor 2400 can also be adjusted by modifying the mechanical parameters (e.g., material, size, shape, etc.) of the mass element 2422. For instructions on how to adjust the mechanical parameters of the mass element 2422 to adjust the sensitivity of the vibration sensor 2400, please refer to [reference needed]. Figure 17 The description in the document concerns adjusting the mechanical parameters of the mass element 2222 to achieve sensitivity adjustment of the vibration sensor 2200.

[0187] In some embodiments, when the parameters of the elastic element (e.g., Young's modulus, tensile strength, hardness, elongation, etc.) and the volume or mass of the mass element are constant, increasing the efficiency of the elastic deformation of the elastic element can increase the electrical signal output by the vibration sensor, thereby improving the acoustic-to-electrical conversion effect of the vibration sensor. In some embodiments, the contact area between the mass element and the elastic element can be reduced to improve the efficiency of the elastic deformation of the elastic element, thereby increasing the electrical signal output by the vibration sensor.

[0188] It should be noted that the first, second, and third holes of the vibration sensor 2200 can also be used. Figure 19 The vibration sensor 2400 shown will not be described in detail here.

[0189] Figure 20 This is a structural schematic diagram of a vibration sensor 2500 provided according to some embodiments of this specification. The structure of the vibration sensor 2500 is similar to... Figure 17 The structure of the vibration sensor 2200 shown is as follows: Figure 19 The vibration sensor 2400 shown is largely the same, the difference being the different mass element. Among other things, Figure 20 The structures shown, including housing 2511, substrate 2512, processor 2513, sensing element 2514, pickup hole 25121, elastic element 2521, first acoustic cavity 2530, and second acoustic cavity 2540, are respectively related to... Figure 17 The structures shown, including the housing 2211, substrate 2212, processor 2213, sensing element 2214, pickup hole 22121, elastic element 2221, first acoustic cavity 2230, and second acoustic cavity 2240, are similar. Additionally, the structure of the elastic element 2521 can also be similar to... Figure 19 The structure of the elastic element 2421 in the vibration sensor 2400 shown is similar, and will not be described in detail here.

[0190] like Figure 20As shown, the mass element 2522 can be an ellipsoid, and its contact area with the elastic element 2521 is smaller than its projected area on the elastic element 2521. This ensures that the mass element 2522 has a smaller contact area with the elastic element under the same volume or mass. When the housing 220 of the vibration sensor vibrates, causing the mass element 2522 to vibrate, the contact area between the elastic element 2521 and the mass element 2522 can be approximated as not deforming. By reducing the contact area between the elastic element 2521 and the mass element 2522, the area of ​​the area where the elastic element 2521 does not contact the mass element 2522 can be increased, thereby increasing the area of ​​the area where the elastic element 2521 deforms during vibration (that is, the area of ​​the area where the elastic element 2521 does not contact the mass element 2522). This increases the amount of compressed air in the first acoustic cavity 2530, allowing the sensing element 2514 of the sensor 2510 to output a larger electrical signal, thereby improving the acoustic-electric conversion effect of the vibration sensor 2500. In some embodiments, the mass element 2522 can also be a trapezoidal body, wherein the smaller side of the trapezoidal body is connected to the elastic element 2521, thus ensuring that the contact area between the mass element 2522 and the elastic element is smaller than the projected area of ​​the mass element 2522 on the elastic element 2521. In some embodiments, the mass element 2522 can also be an arched structure. When the mass element 2522 is an arched structure, the two arch legs of the arched structure are connected to the upper or lower surface of the elastic element 2521, wherein the contact area between the two arch legs and the elastic element 2521 is smaller than the projected area of ​​the arch waist on the elastic element 2521, that is, the contact area between the arched mass element 2522 and the elastic element 2521 is smaller than its projected area on the elastic element 2521. It should be noted that in this embodiment, any regular or irregular shape or structure that satisfies the requirement that the contact area between the mass element 2522 and the elastic element is smaller than the projected area of ​​the mass element 2522 on the elastic element 2521 is within the scope of variations of the embodiments in this specification, and will not be listed individually in this specification.

[0191] It should be noted that the first, second, and third holes of the vibration sensor 2200 can also be used. Figure 19 The vibration sensor 2400 shown will not be described in detail here.

[0192] In some embodiments, the mass element can be a solid structure. For example, the mass element 2522 can be a regular or irregular structure such as a solid cylinder, a solid cuboid, a solid ellipsoid, or a solid triangle. In some embodiments, to ensure that the mass element 2522 has a constant mass while reducing the contact area between the mass element 2522 and the elastic element 2521, and to improve the sensitivity of the vibration sensor in a specific frequency range, the mass element can also be a partially hollowed-out structure. For example, such as... Figure 21 As shown in (a), the mass element 2522 is a ring-shaped cylinder. For example, as... Figure 21 As shown in (b), the mass element 2522 is a rectangular cylindrical structure.

[0193] In some embodiments, the mass element may include multiple mutually separated sub-mass elements, and the multiple sub-mass elements are located in different regions of the elastic element. In some embodiments, the mass element may include two or more mutually separated sub-mass elements, such as 3, 4, 5, etc. In some embodiments, the mass, size, shape, material, etc. of the multiple mutually separated sub-mass elements may be the same or different. In some embodiments, the multiple mutually separated sub-mass elements may be evenly spaced, unequally spaced, symmetrically distributed, or asymmetrically distributed on the elastic element. In some embodiments, the multiple mutually separated sub-mass elements may be disposed on the upper surface and / or lower surface of the elastic element. By disposing of multiple mutually separated sub-mass elements in the central region of the elastic element, not only can the area of ​​the deformation region of the elastic element under the vibration driven by the shell be increased, improving the deformation efficiency of the elastic element and thus improving the sensitivity of the vibration sensor, but also the reliability of the resonant system and the vibration sensor can be improved. In some embodiments, by adjusting the parameters such as the mass, size, shape, and material of the multiple mass elements, the multiple sub-mass elements may have different frequency responses, thereby further improving the sensitivity of the vibration sensor in different frequency ranges.

[0194] Figure 22 (a) is a cross-sectional schematic diagram of a vibration sensor provided according to some embodiments of this specification. Figure 22As shown in (a), mass element 2722-1 may include two rectangular cylindrical sub-mass elements 2722a and 2722b with a certain dimensional ratio. In some embodiments, the thickness (i.e., the wall thickness) of sub-mass elements 2722a and 2722b is the same. In some embodiments, the length and width of sub-mass element 2722a are in the same ratio as the length and width of sub-mass element 2722b. In some embodiments, the length and / or width ratio of sub-mass element 2722a to sub-mass element 2722b is in the range of 0.1 to 0.8. In some embodiments, the length and / or width ratio of sub-mass element 2722a to sub-mass element 2722b is in the range of 0.2 to 0.6. In some embodiments, the length and / or width ratio of sub-mass element 2722a to sub-mass element 2722b is in the range of 0.25 to 0.5. In some embodiments, the two rectangular cylindrical sub-mass elements 2722a and 2722b are both located in the central region of the elastic element 2721-1, and their geometric centers coincide with the geometric center of the elastic element 2721-1. In some embodiments, the geometric centers of the rectangular cylindrical sub-mass elements 2722a and 2722b may not coincide.

[0195] It should be noted that the number of sub-mass components is not limited to Figure 22 (a) The two mentioned can also be three, four, or more. Furthermore, the shape of the sub-mass element is not limited to... Figure 22 The rectangular cylindrical shape shown in (a) can also be a structure of other shapes. For example, in some embodiments, mass element 2722-1 may include two annular sub-mass elements with different inner diameters, both located in the central region of elastic element 2721, with their centers coinciding with the geometric center of elastic element 2721-1. As another example, mass element 2722-1 may include two sub-mass elements of different shapes (e.g., annular and rectangular sub-mass elements), with the larger sub-mass element surrounding the smaller sub-mass element. Furthermore, multiple sub-mass elements may be located on different surfaces of elastic element 2721-1; for example, some may be located on the upper surface of elastic element 2721-1, and others on the lower surface.

[0196] Figure 22 (b) is a cross-sectional schematic diagram of a vibration sensor provided according to some embodiments of this specification. Figure 22As shown in (b), the mass element 2722-2 may include four sub-mass elements 2722c, 2722d, 2722e, and 2722f, which are arranged in a matrix in the central region of the elastic element 2721-2. The sub-mass elements 2722c, 2722d, 2722e, and 2722f may have any regular or irregular shape, such as rectangular, circular, or elliptical. In some embodiments, the shape, size, material, etc., of the sub-mass elements 2722c, 2722d, 2722e, and 2722f may be the same or different.

[0197] Figure 22 (c) is a cross-sectional schematic diagram of a vibration sensor provided according to some embodiments of this specification. Figure 22 As shown in (c), the mass element 2722 may include four sub-mass elements 2722g, 2722h, 2722i, and 2722j. The sub-mass elements 2722g, 2722h, 2722i, and 2722j are distributed in a ring at equal intervals in the central region of the elastic element 2721, and the center of the ring coincides with the geometric center of the elastic element 2721.

[0198] It is important to note that Figure 22 The number, shape, and distribution of the sub-mass elements shown are for illustrative purposes only and are not intended to limit this specification. For example, Figure 22 The rectangular cylindrical submass element and Figure 22 The number of sub-mass elements in (c) can be more than two (e.g., 3, 4, 5, etc.). For example, Figure 22 (b) The number of sub-mass elements can be 6 in a 2x3 matrix or 8 in a 4x4 matrix, etc.

[0199] Figure 23 This is a schematic diagram of the structure of a vibration sensor including a first hole 28211, based on some embodiments of this specification, with an elastic element 28211 provided. Figure 23 The vibration sensor 2800 shown is... Figure 17 The vibration sensor 2200 shown can be structurally similar; the difference lies in... Figure 23 The elastic element 2821 shown has a first hole 28211. Figure 23 The structures shown, including housing 2811, substrate 2812, processor 2813, sensing element 2814, pickup hole 28121, mass element 2822, first acoustic cavity 2830, and second acoustic cavity 2840, are respectively related to... Figure 17The structures of the middle shell 2211, substrate 2212, processor 2213, sensing element 2214, pickup hole 22121, mass element 2222, first acoustic cavity 2230 and second acoustic cavity 2240 are similar and will not be described in detail here.

[0200] In some embodiments, such as Figure 23 As shown, the elastic element 2821 may include at least one first hole 28211, which can connect the first acoustic cavity 2830 and at least one second acoustic cavity 2840 to adjust the air pressure inside the first acoustic cavity 2830 and the second acoustic cavity 2840, balance the air pressure difference between the two cavities, prevent damage to the vibration sensor 2800, and also increase the damping of the resonant system, reduce the quality factor Q value of the vibration sensor 2800, and make the frequency response curve of the vibration sensor 2800 flatter. The second acoustic cavity 2840 may refer to a cavity different from the first acoustic cavity 2830, which is confined between the elastic element 2821 and the housing 2811.

[0201] Figure 24 yes Figure 23 The diagram shows a cross-sectional view of the vibration sensor 2800. In some embodiments, such as... Figure 24 As shown, the first hole 28211 may include a first sub-hole 282111 disposed on the elastic element 2821, and at least one first sub-hole 282111 may be located in the area of ​​the elastic element 2821 not covered by the mass element 2822. In some embodiments, the number of first sub-holes 282111 on the elastic element 2821 can be set according to the actual required damping, for example, the number of first sub-holes 282111 may be 4, 8, 16, etc. In some embodiments, the plurality of first sub-holes 282111 may be distributed in a rectangular or annular equally spaced manner in the area of ​​the elastic element 2821 not covered by the mass element 2822.

[0202] In some embodiments, the first aperture 28211 may further include a second sub-aperture disposed on the mass element 2822, at least one second sub-aperture communicating with at least one first sub-aperture 282111 to adjust the air pressure in the first acoustic cavity 2830 and the second acoustic cavity 2840, and at the same time adjust the damping of the resonant system, so that the frequency response curve of the vibration sensor 2800 is flatter.

[0203] Figure 25 This is a cross-sectional schematic diagram of a vibration sensor 3000 provided according to some embodiments of this specification. Figure 250 shows the vibration sensor 3000 and... Figure 23 or Figure 24 The vibration sensor 2800 shown is structurally similar to the one shown, the difference being... Figure 25The vibration sensor 3000 shown has a second sub-hole 30221 on its mass element 3022. (Regarding...) Figure 25 The description of the housing 3011 and the elastic element 3021 shown can be found in [reference]. Figure 23 The relevant descriptions of housing 2811 and elastic element 2821 are provided.

[0204] In some embodiments, such as Figure 25 As shown, the mass element 3022 has multiple second sub-holes 30221, and the elastic element 3021 has multiple first sub-holes 30211. A portion of the first sub-holes 30211 are located in the area of ​​the elastic element 3021 covered by the mass element 3022, and correspond in position to the second sub-holes 30221. The first sub-holes 30211 located in the area of ​​the elastic element 3021 covered by the mass element 1722 can communicate with the corresponding second sub-holes 13021 to ensure communication between the first acoustic cavity and the second acoustic cavity. In addition, another portion of the first sub-holes 30211 are located in the area of ​​the elastic element 3021 not covered by the mass element 3022, which also enables communication between the first acoustic cavity and the second acoustic cavity.

[0205] In some embodiments, the first sub-hole portion (e.g., Figure 23 The first sub-hole portion 282111 shown or Figure 25 The aperture of the first sub-hole portion 30211 or the second sub-hole portion 30221 shown is 0.05 μm to 20 μm.

[0206] In some embodiments, instead of providing a first sub-hole in the elastic element or a second sub-hole in the mass element, the elastic element can be manufactured using a thin film material containing micropores. In this embodiment, the micropores inherent in the elastic element can serve as gas conductors, and can also achieve air pressure regulation within the acoustic cavity and damping adjustment of the resonant system.

[0207] In this embodiment, the elastic element can be a microporous film made of materials such as polytetrafluoroethylene (PTFE), nylon, polyether sulfone (PES), polyvinylidene fluoride (PVDF), and polypropylene (PP). Preferably, the elastic element can be a PTFE microporous film. In some embodiments, the micropore diameter of the microporous film is 0.01 μm to 10 μm. In some embodiments, the micropore diameter of the microporous film is 0.05 μm to 10 μm. In some embodiments, the micropore diameter of the microporous film is 0.1 μm to 10 μm. Using a microporous film for the elastic element eliminates the need for drilling holes in the elastic element or mass element, simplifying the manufacturing process and saving costs.

[0208] In some embodiments, the elastic element may further include at least one elastic layer (not shown in the figures), which may be located in an area of ​​the elastic element not covered by the mass element. The at least one elastic layer may cover at least a portion of the first sub-hole or micropore on the elastic element, thereby adjusting the porosity of the first sub-hole or micropore and the stiffness of the elastic element, thus adjusting the sensitivity and reliability of the vibration sensor. In some embodiments, the thickness of the elastic layer may be 1 μm to 100 μm. In some embodiments, the thickness of the elastic layer may be 50 μm to 100 μm.

[0209] In some embodiments, at least one of the vibration sensors may be different from the first acoustic cavity (e.g., Figure 17 The second acoustic cavity (e.g., the first acoustic cavity 2230 shown) Figure 17 The second acoustic cavity 2240 (as shown) is filled with a fluid-flowing material. Figure 17Taking the vibration sensor 2200 as an example, the second acoustic cavity 2240 can be a cavity confined between the elastic element 2221 and / or the mass element 2222 and the sensor housing 2211. By providing a fluid-pairing filler in the second acoustic cavity 2240, the quality factor Q and sensitivity of the vibration sensor 2200 can be adjusted, and when the vibration sensor 2200 is subjected to impact, the fluid filler can also absorb the impact load, preventing damage to the vibration sensor 2200. In some embodiments, the higher the kinematic viscosity of the filler, the higher the sensitivity of the vibration sensor 2200. In some embodiments, the kinematic viscosity of the filler is within 20,000 cst. In some embodiments, the kinematic viscosity of the filler is within 10,000 cst. In some embodiments, the kinematic viscosity of the filler is within 5,000 cst. In some embodiments, the kinematic viscosity of the filler is within 500 cst. In some embodiments, the kinematic viscosity of the filler is within 50 cst. In some embodiments, the kinematic viscosity of the filler is within 50 cst. In some embodiments, the fluid-pairing filler in the second acoustic cavity 2240 can include flexible materials such as liquids, gases, and gels. Preferably, the material of the fluid filler in the second acoustic cavity 2240 is oil, aloe vera gel, silicone gel, polydimethylsiloxane (PDMS), etc. In some embodiments, the fluid filler may completely or partially fill the second acoustic cavity 2240 (e.g., air bubbles are present).

[0210] In some embodiments, the vibration sensor may include multiple resonant systems, which can enable multimodal vibration of the vibration sensor and improve the sensitivity of the vibration sensor over a wider frequency range.

[0211] Figure 26 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 26 As shown, in some embodiments, the vibration sensor 3100 includes an acoustic transducer 3120 and a vibration assembly 3130. (See reference...) Figure 26 In some embodiments, the acoustic transducer 3120 includes a housing 3110 and a pickup device 3121. In some embodiments, the pickup device 3121 may include a capacitive, piezoelectric, or other type of transducer according to the transduction principle. This specification does not impose any limitations.

[0212] In some embodiments, the housing 3110 has a pickup hole 3111 for sound pickup. In some embodiments, the vibration assembly 3130 is disposed near the pickup hole 3111 of the housing 3110. In some embodiments, one or more sets of elastic elements (e.g., a first elastic element 31311, a second elastic element 31312, and a third elastic element 31313) and mass elements (e.g., a first mass element 31321, a second mass element 31322, and a third mass element 31323) are disposed outside the pickup hole 3111. In some embodiments, the vibration assembly 3130 is physically connected to the housing 3110. Specifically, the physical connection method may include welding, snap-fitting, bonding, or integral molding, etc., and the connection method is not limited here. It should be noted that in some embodiments, one or more sets of elastic elements and mass elements may also be disposed within the pickup hole 3111 parallel to the radial section of the pickup hole 3111, as detailed below. Figure 28 Related descriptions.

[0213] In some embodiments, when the vibration sensor 3100 is used for air-conduction sound pickup, when the external environment generates vibration (e.g., sound waves), one or more sets of elastic elements and mass elements on the elastic elements vibrate in response to the vibration of the external environment. Since the elastic elements allow air to pass through, the vibration generated by the elastic elements and mass elements, together with the external vibration signal (e.g., sound waves), can cause a change in sound pressure (or air vibration) within the pickup hole 3111, causing the vibration signal to be transmitted through the pickup hole 3111 to the pickup device 3121 and converted into an electrical signal. This achieves the process of converting the vibration signal into an electrical signal after being amplified in one or more target frequency bands. The target frequency band can be the frequency range of the resonant frequency (or harmonic frequency) corresponding to a set of elastic elements and mass elements. For example, when the vibration sensor 3100 is used as a microphone, the target frequency band range can be 3100 Hz to 2 kHz. Specifically, in some embodiments, if the resonant frequency of the acoustic transducer is 2 kHz, the resonant frequency of the vibration component 3130 can be configured to 1 kHz.

[0214] In some embodiments, when the vibration sensor 3100 is used for bone conduction sound pickup, a conductive housing can be provided outside the pickup hole 3111. The acoustic transducer 3120 and the conductive housing can form an acoustic cavity by enclosing a receiving space. One or more sets of elastic elements and mass elements are disposed within the receiving space. In some embodiments, the vibration assembly 3130 (e.g., a vibrating element) can be physically connected to the housing 3110. When the external environment vibrates, the vibration is received through the conductive housing and causes the vibration assembly 3130 to vibrate. The vibration of the vibration assembly 3130 can cause the air inside the acoustic cavity to vibrate. The vibration generated by the elastic element and mass element, together with the vibration signal inside the acoustic cavity, is transmitted through the pickup hole 3111 to the pickup device 3121 and converted into an electrical signal.

[0215] like Figure 26 As shown, in some embodiments, the vibration sensor 3100 may include three sets of elastic elements and mass elements. Specifically, the three sets of elastic elements and mass elements may have different resonant frequencies. Each set of elastic elements and mass elements can resonate under the action of vibration at different frequencies in the external vibration signal, so that the sensitivity of the sound signal acquired by the vibration sensor 3100 relative to the acoustic transducer 3120 in the three target frequency bands is greater than that of the acoustic transducer 3120. It should be noted that in some embodiments, multiple sets of elastic elements and mass elements may have the same resonant frequency to greatly improve the sensitivity in the target frequency band. For example, when the vibration sensor 3100 is used to mainly detect mechanical vibrations in the range of 5kHz to 5.5kHz, the resonant frequencies of multiple sets of elastic elements and mass elements can be configured to values ​​within this detection range (such as 5.3kHz), so that the vibration sensor 3100 has higher sensitivity within the detection range compared to the case of only setting one set of elastic elements and mass elements. It should be noted that... Figure 26 The number of groups of elastic elements and mass elements shown is for illustrative purposes only and does not limit the scope of the invention. For example, the number of groups of elastic elements and mass elements can be one, two, four, etc.

[0216] In some embodiments, when the vibration assembly 3130 has multiple elastic elements, the elastic element furthest from the acoustic transducer 3120 is configured to prevent air from passing through. Figure 26As shown, the third elastic element 31313 in the figure can be configured to prevent air from passing through. This configuration creates a sealed space between the third elastic element 31313 and the acoustic transducer 3120, which can better reflect vibration information. It should be noted that in some embodiments, the elastic element farthest from the acoustic transducer 3120 can be configured to allow air to pass through. For example, when a conductive housing (not shown in 31) is provided outside the pickup hole 3111, the conductive housing and the acoustic transducer 3120 form an acoustic cavity, in which the air can effectively reflect vibration information. In some embodiments, the conductive housing or the housing can be provided with holes (e.g., a second hole or a third hole), which can connect the acoustic cavity formed inside the acoustic transducer 3120 and between the multiple sets of vibration components 3130 with the external environment. During the assembly of the vibration sensor 3100, the holes can transport the gas inside the housing 3110 to the outside. Thus, by providing the opening, during the assembly of the vibration assembly 3130 and acoustic transducer 3120, failure of the vibration assembly 3130 and acoustic transducer 3120 due to excessive air pressure difference between the inner and outer spaces of the housing 3110 and the conductive housing can be avoided, thereby reducing the assembly difficulty of the vibration sensor 3100. In some embodiments, airborne sound in the environment may affect the performance of the vibration sensor 3100. To reduce the impact of airborne sound in the environment, after the vibration sensor 3100 is manufactured or before it is applied to electronic devices, the opening can be sealed with a sealing material to prevent it from affecting the performance of the vibration sensor 3100. In some embodiments, the opening can be sealed by means of sealant, adhesive sealing tape, or adding a sealing plug.

[0217] In some embodiments, the vibration assembly 3130 may include a first elastic element 31311, a second elastic element 31312, and a third elastic element 31313 arranged sequentially in the vibration direction; the mass element may include a first mass element 31321, a second mass element 31322, and a third mass element 31323 arranged sequentially in the vibration direction. The first elastic element 31311 is connected to the first mass element 31321, the second elastic element 31312 is connected to the second mass element 31322, and the third elastic element 31313 is connected to the third mass element 31323. In some embodiments, the distance between any two adjacent elastic elements among the first elastic element 31311, the second elastic element 31312, and the third elastic element 31313 is not less than the maximum amplitude of the two adjacent elastic elements. This arrangement is used to ensure that the elastic element does not interfere with the adjacent elastic element during vibration, thereby affecting the transmission effect of the vibration signal. In some embodiments, when the vibration assembly 3130 includes multiple sets of elastic elements and mass elements, the elastic elements are arranged sequentially along a vibration direction perpendicular to the elastic elements. In some embodiments, the distance between adjacent elastic elements may be the same or different. In some embodiments, the gap between an elastic element and its adjacent elastic elements can form multiple cavities, and the multiple cavities between the elastic element and its adjacent elastic elements can accommodate air and allow the elastic element to vibrate within them.

[0218] In some embodiments, the vibration assembly 230 may further include a limiting structure (not shown) configured to ensure that the distance between adjacent elastic elements in the vibration assembly is not less than the maximum amplitude of the adjacent elastic elements. In some embodiments, the limiting structure may be connected to the edge of the elastic element, and the damping of the limiting structure may be controlled to prevent it from interfering with the vibration of the elastic element.

[0219] In some embodiments, the mass elements in the multiple sets of vibration assemblies 3130 may include multiple mass elements, which may be respectively disposed on both sides of the elastic element. For example, suppose a set of vibration assemblies includes two mass elements, which are symmetrically disposed on both sides of the elastic element. In some embodiments, the mass elements in the multiple sets of vibration assemblies 3130 may be located on the same side of the elastic element, wherein the mass elements may be disposed on the outer or inner side of the elastic element, wherein the side of the elastic element closer to the acoustic transducer 3120 is the inner side, and the side farther from the acoustic transducer 3120 is the outer side. It should be noted that in some embodiments, the mass elements in the multiple sets of vibration assemblies may be located on different sides of the elastic element, such as the first mass element 31321 and the second mass element 31322 being located on the outer side of the corresponding elastic element, and the third mass element 31323 being located on the inner side of the corresponding elastic element.

[0220] In some embodiments, the elastic elements (e.g., the first elastic element 31311, the second elastic element 31312, and the third elastic element 31313) are configured as thin-film structures that allow air to pass through. In some embodiments, the elastic elements (e.g., the first elastic element 31311, the second elastic element 31312, and the third elastic element 31313) can be breathable membranes. Configuring the elastic elements to allow air to pass through allows vibration signals to cause the vibration assembly 3130 to vibrate while further penetrating the breathable membrane and being received by the acoustic transducer 3120, thereby improving sensitivity in the target frequency band. Furthermore, the breathable thin-film structure allows the acoustic cavities formed between the multiple elastic elements to be interconnected, thereby adjusting the air pressure between the acoustic cavities, balancing the pressure differences within each acoustic cavity, and preventing damage to the components inside the vibration sensor 3100 due to large pressure differences.

[0221] In some embodiments, the elastic elements (e.g., the first elastic element 31311, the second elastic element 31312, and the third elastic element 31313) may also be thin film materials with a first pore, specifically, the pore diameter of the first pore is 0.01 μm to 10 μm. Preferably, the pore diameter of the first pore can be 0.1 μm to 5 μm, such as 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, etc. In some embodiments, the diameter of the first pore in the vibration assembly 230 may be the same or different, and the diameter of the first pore on a single vibration assembly 230 may be the same or different. In some embodiments, the pore diameter of the first pore may also be greater than 5 μm. When the pore diameter of the first pore is greater than 5 μm, other materials (such as silicone) can be applied to the elastic element to cover part of the first pore or a portion of the first pore without affecting air permeability. In some embodiments, holes may be simultaneously formed on the elastic elements (e.g., the first elastic element 31311, the second elastic element 31312, and the third elastic element 31313) and the mass elements (e.g., the first mass element 31321, the second mass element 31322, and the third mass element 31323) so that the acoustic cavities formed between the multiple elastic elements are connected.

[0222] In some embodiments, the vibration assembly 230 may further include a support structure 3133 for supporting one or more sets of elastic elements and mass elements. The support structure 3133 is physically connected to the acoustic transducer 3120 (e.g., housing structure 3110), and the one or more sets of elastic elements and mass elements are connected to the support structure 3133. Specifically, the support structure 3133 is physically connected to the housing 3110. The physical connection method may include snap-fit, adhesive, or integral molding. In some embodiments, preferably, the support structure 3133 and the housing 3110 are connected by adhesive. The adhesive material may include, but is not limited to, epoxy resin and silicone.

[0223] In some embodiments, the support structure 3133 can also be connected to the support structure 3133 to achieve fixed support to control the spacing between adjacent elastic elements, so as to ensure the transmission effect of vibration signals.

[0224] Figure 27 This is a schematic diagram of the vibration sensor 3200 according to some embodiments shown in this specification. Figure 27 As shown, in some embodiments, the vibration component 3230 in the vibration sensor 3200 may include a set of elastic elements 3231 and mass elements 3232, which are connected to the sound sensor 3220 via a support structure 3233. Specifically, the mass element 3232 is physically connected to the elastic element 3231, and the mass element 3232 is positioned outside the elastic element 3231. In some embodiments, the mass element 3232 resonates in response to vibrations in the external environment. The resonance generated by the elastic element 3231 and the mass element 3232 transmits the external vibration signal to the acoustic transducer 3220, thereby enhancing the sensitivity of the vibration component 3230 near the resonant frequency, realizing the process of converting the vibration signal into an electrical signal after amplification within the target frequency band.

[0225] In some embodiments, since the vibration sensor 3200 includes only one set of vibration components 3230, the elastic element 3231 may be airtight in some embodiments to achieve better sound pickup. It should be noted that... Figure 27 The elastic element 3231 or mass element 3232 in the vibration sensor 3200 can also be breathable to balance the air pressure difference between the acoustic cavities. For example, the elastic element 3231 or mass element 3232 may have a first hole. Or, for example, the elastic element 3231 or mass element 3232 may be made of a breathable material.

[0226] In some embodiments, the resonant frequency of each set of elastic elements 3231 and mass elements 3232 is related to the parameters of elastic elements 3231 and / or mass elements 3232, including the modulus of elastic elements 3231, the volume of the cavity formed between acoustic transducer 3220 and elastic elements 3231, the radius of mass elements 3232, the height of mass elements 3232, the density of mass elements 3232, and combinations thereof.

[0227] Figure 28 This is a schematic diagram of a vibration sensor structure based on some embodiments shown in this specification. In some embodiments, one or more sets of elastic elements and mass elements in the vibration sensor 3300 may be disposed within the pickup hole parallel to the radial section (i.e., perpendicular to the vibration direction). Figure 28 As shown, in some embodiments, a conduit 3311 may be provided at the pickup hole. The elastic element and mass element include a first elastic element 33311, a second elastic element 33312, and a first mass element 33321 and a second mass element 33322, all with radial cross-sections parallel to the pickup hole and disposed within the pickup hole. In some embodiments, the conduit 3311 may be made of an airtight material, and its function is similar to that of the support structure 3133 in the aforementioned vibration sensor 3100. In some embodiments, to ensure free vibration of the mass element, the mass element does not contact the inner wall of the pickup hole or the conduit 3311. It should be noted that providing the conduit 3311 is only a specific embodiment and does not limit the scope of the present invention. For example, in some embodiments, the conduit 3311 may not be provided, and one or more sets of elastic elements and mass elements may be directly connected to the pickup hole, or a support structure may be disposed within the pickup hole and support one or more sets of elastic elements and mass elements.

[0228] In some embodiments, the first mass element 33321 and the second mass element 33322 can simultaneously resonate in response to vibrations in the external environment. The vibration signal generated by the resonance of the first elastic element 33311, the second elastic element 33312, and the first mass element 33321 and the second mass element 33322 is transmitted to the acoustic sensor 3320 through the conduit 3311 and converted into an electrical signal, thereby realizing the process of amplifying the vibration signal in one or more target frequency bands and then converting it into an electrical signal. It should be noted that... Figure 28 The number of groups of elastic elements and mass elements shown is two for illustrative purposes only and does not limit the scope of protection of the present invention. For example, the number of groups of elastic elements and mass elements can be one, three, or others.

[0229] It should be noted that, Figure 26The conductive housing of the vibration sensor 3100 shown, or the hole on the housing 3110, and the first hole on the vibration assembly 3130, or the vibration assembly 3130 made of breathable material, are also applicable. Figure 28 The vibration sensor 3300 shown here will not be described in detail.

[0230] Figure 29 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 29 As shown, in some embodiments, the vibration sensor 3400 includes an acoustic transducer 3410 and a vibration assembly. The vibration assembly mainly includes interconnected mass elements and elastic elements. In some embodiments, the elastic element may include one or more plate-like structures (e.g., a cantilever beam 3421, a membrane structure 3422), each plate-like structure being connected to at least one of the one or more mass elements. In some embodiments, the structure formed by a plate-like structure and the mass element physically connected to that plate-like structure may also be referred to as a resonant structure. A plate-like structure can refer to a structure made of flexible or rigid material capable of supporting one or more mass elements. The mass element is a small-volume and heavy object; in some embodiments, the volume and mass of the mass element vary depending on the application scenario and target frequency of the vibration assembly.

[0231] In some embodiments, the plate-like structure may include a single plate-like structure (also referred to as a plate member). In some embodiments, the plate-like structure may include multiple plate members, such as 2, 3, 4, etc. In some embodiments, at least one mass element connected to each plate-like structure may include a single mass element. In some embodiments, at least one mass element connected to each plate-like structure may include multiple mass elements, such as 2, 3, 4, etc.

[0232] In some embodiments, the vibration assembly further includes a support structure 3420 for supporting the plate-like structure, the support structure 3420 being connected to the acoustic transducer, and the support structure 3420 having space for placing the plate-like structure.

[0233] In some embodiments, one or more mass elements may be disposed on either side of the plate-like structure in the vibration direction. In some embodiments, multiple mass elements may be disposed on both sides of the plate-like structure in the vibration direction. In some embodiments, the projection area of ​​the mass element connected to the plate-like structure in the vibration direction is located within the projection area of ​​the plate-like structure. In some embodiments, in the direction parallel to the surface connected to the plate-like structure and the mass element (i.e., perpendicular to the vibration direction), the sum of the cross-sectional areas of one or more mass elements on one side is less than the cross-sectional area of ​​the plate-like structure. In some embodiments, the vibration direction of the mass element driven by the plate-like structure is the same as the vibration direction of the plate-like structure. In some embodiments, in the direction perpendicular to the surface connected to an elastic element and one or more mass elements, the projection area of ​​the mass element does not overlap with the projection area of ​​the support structure 3420.

[0234] In some embodiments, one or more plate-like structures and multiple mass elements physically connected to the plate-like structures correspond to multiple target frequency bands in the target frequency bands, such that the sensitivity of the vibration sensor is greater than the sensitivity of the acoustic transducer in the corresponding multiple target frequency bands. In some embodiments, the combination of at least one plate-like structure and mass element can generate a larger amplitude of the vibration signal near its resonant frequency when it receives the vibration signal, thereby improving the sensitivity of the vibration sensor.

[0235] In some embodiments, to accommodate multiple vibration modes, a plate-like structure and a vibration assembly formed by one or more mass elements physically connected to the plate-like structure may have multiple resonant frequencies, which may be the same or different. At least two of the mass elements may have at least one different structural parameter. The structural parameters of the mass elements may include size, mass, density, shape, etc. Specifically, the size of the mass element may be at least one of the following parameters: length, width, height, cross-sectional area, or volume.

[0236] In some embodiments, the frequency response curve of the vibration sensor under the action of the vibration component has multiple resonance peaks. In some embodiments, the difference between at least one of the multiple resonant frequencies of the resonant structure formed by a plate-like structure and multiple mass elements physically connected to the plate-like structure and the resonant frequency of the acoustic transducer is within 1 kHz to 10 kHz. In some embodiments, the difference between two adjacent resonant frequencies of the plate-like structure and multiple mass elements physically connected to the plate-like structure is less than 2 kHz. In some embodiments, the difference between two adjacent resonant frequencies of the plate-like structure and multiple mass elements physically connected to the plate-like structure is no greater than 1 kHz. In some embodiments, the resonant frequencies of the plate-like structure and multiple mass elements physically connected to the plate-like structure are within 1 kHz to 10 kHz. In some embodiments, the resonant frequencies of the plate-like structure and multiple mass elements physically connected to the plate-like structure are within 1 kHz to 5 kHz.

[0237] By incorporating at least one mass element into the vibration assembly, the assembly can possess multiple vibration modes, resulting in a frequency response curve for the vibration sensor exhibiting two or more resonance peaks. Since the sensitivity of the vibration sensor increases within the frequency range of the resonance peaks, having two or more resonance peaks in the frequency response curve expands the frequency range of high sensitivity for the vibration sensor. A vibration mode is a vibration state with a fixed frequency, damping ratio, and mode shape. Different vibration modes correspond to different deformation forms; for example, multiple mass elements may vibrate synchronously upwards; one mass element may vibrate upwards; and one mass element may vibrate downwards. The vibration mode depends on the inherent characteristics of the vibration assembly, such as the stiffness and size of the mass elements, and the size, position, and density of the counterweights. In some embodiments, one mass element can generate one mode, two mass elements can generate two modes, three mass elements can generate three effective modes, or two effective modes. An effective mode refers to a mode that causes a volume change in the air gap.

[0238] In some embodiments, at least one of the plate-like structures may be a membrane structure 3422. The membrane structure 3422 may include a rigid membrane or a flexible membrane. A rigid membrane refers to a membrane whose Young's modulus is greater than a first modulus threshold (e.g., 50 GPa). A flexible membrane refers to a membrane whose Young's modulus is less than a second modulus threshold. In some embodiments, the first modulus threshold and / or the second modulus threshold may be set according to actual needs. In some embodiments, the first modulus threshold may be equal to or unequal to the second modulus threshold. For example, the first modulus threshold may be 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc., and the second modulus threshold may be 1 MPa, 10 MPa, 1 GPa, 10 GPa, etc. In some embodiments, the mass blocks may include multiple mass blocks 3424, which may be respectively disposed on both sides of the membrane structure 3422. In some embodiments, the multiple mass blocks 3424 may also be disposed on the same side of the membrane structure 3422. In some embodiments, the multiple mass blocks 3424 may be arranged collinearly or non-collinearly. For example, in some embodiments, if there are four mass blocks, two or three of the four mass blocks may be arranged collinearly. In addition, the four mass blocks may also be arranged in an array (such as a rectangular array and a circular array).

[0239] In some embodiments, at least one of the plate structures 3421 may be a cantilever beam. A cantilever beam may include a rigid plate. In some embodiments, a rigid plate refers to a plate whose Young's modulus is greater than a third modulus threshold (e.g., 50 GPa). In some embodiments, the third modulus threshold may be set according to actual needs, such as 20 GPa, 30 GPa, 40 GPa, 50 GPa, etc.

[0240] In some embodiments, one or more plate-like structures may include at least one membrane structure 3422 and at least one cantilever beam 3421. For the case where the plate-like structure is a cantilever beam 3421, please refer to the following text for details. Figure 30 The relevant content will not be repeated here.

[0241] In some embodiments, the vibration assembly sequentially includes a cantilever beam 3421 and a diaphragm structure 3422 in the direction away from the acoustic transducer 3410 within the pickup hole 3411. In some embodiments, the cantilever beam 3421 has one or more mass elements 3423, which are located at the free end of the cantilever beam 3421 and are collinearly arranged with the cantilever beam 3421. In some embodiments, the diaphragm structure 3422 has one or more mass elements 3424. In some embodiments, the cantilever beam 3421 may also be located on the side of the diaphragm 3422 away from the acoustic transducer 3410. In some embodiments, the cantilever beam 3421 and the mass elements 3423 may correspond to a resonant frequency; the diaphragm 3422 and the multiple mass elements 3424 may correspond to one or two resonant frequencies. In some embodiments, the aforementioned three resonant frequencies may be set to be different, so that the frequency response curve of the vibration sensor under the action of the vibration assembly 3400 has three resonant peaks, thereby forming multiple high-sensitivity frequency ranges and a wider frequency band.

[0242] In some embodiments, the diaphragm structure 3422 can be a breathable or impermeable membrane. When the diaphragm structure 3422 is a breathable membrane, the acoustic cavities inside the vibration sensor 3400 can be connected through the breathable diaphragm structure 3422 to adjust the air pressure between the acoustic cavities, balance the air pressure difference between the two acoustic cavities, and prevent the vibration sensor 3400 from being damaged due to a large air pressure difference. At the same time, it can also ensure that air vibrations (e.g., sound waves) can pass through the diaphragm structure 3422 as completely as possible and be picked up by the pickup device, which can effectively improve the pickup quality. In some embodiments, the diaphragm structure 3422 or the mass element 3424 can be made of a breathable material. In some embodiments, the diaphragm structure 3422 can be provided with a first hole, wherein the first hole is located in the area of ​​the diaphragm structure 3422 not covered by the mass element 3424, and the first hole can connect the acoustic cavities inside the vibration sensor 3400 (e.g., the acoustic cavities on both sides of the diaphragm structure 3422). In some embodiments, both the diaphragm structure 3422 and the mass element 3424 may have a first aperture. For example, the diaphragm structure 3422 may have a first sub-aperture, and the mass element 3424 may have a second sub-aperture, wherein the first sub-aperture and the second sub-aperture are connected. In some embodiments, by constructing the diaphragm structure 3422, which is furthest from the acoustic transducer 3410, as airtight, the space of the support structure 3420 is sealed so that air does not escape when the support structure 3420 vibrates, ensuring the effect of air compression, thereby enabling the vibration sensor 3400 to have a better sound pickup effect.

[0243] It should be noted that, Figure 26 The conductive housing or the hole on the housing 3110 of the vibration sensor 3100 shown is also applicable. Figure 29 The vibration sensor 3400 shown here will not be described in detail.

[0244] Figure 30 This is a structural schematic diagram of the vibration assembly of a vibration sensor according to some embodiments of this specification. Figure 30 (a) is a three-dimensional structural diagram of the vibration component 3520; Figure 30 (b) is Figure 30 (a) is a projection of the vibration component 3520 in the vibration direction; Figure 30 (b) is Figure 30 (a) is a projection of the vibration component 820 perpendicular to the vibration direction.

[0245] like Figure 30 As shown in (a), the vibration assembly includes a support structure 3530, a cantilever beam 3521, and a mass element 3522. One end of the cantilever beam 3521 is physically connected to one side of the support structure 3530, and the other end is a free end. The mass element 3522 is physically connected to the free end of the cantilever beam 3521. Specifically, the physical connection between the cantilever beam 3521 and the support structure 3530 may include welding, snap-fitting, bonding, or integral molding, etc., and the connection method is not limited here. In some embodiments, the vibration assembly may not include the support structure 3530, and the cantilever beam 3521 may be disposed within or outside the conduction channel of the pickup hole along the radial cross-section of the conduction channel of the pickup hole, and the cantilever beam 3521 does not completely cover the conduction channel.

[0246] In some embodiments, the material of the cantilever beam 3521 includes at least one of copper, aluminum, tin, silicon, silicon oxide, silicon nitride, silicon carbide, aluminum nitride, zinc oxide, lead zirconate titanate, or alloys. In some embodiments, the mass element 3522 may be disposed on either side of the cantilever beam 3521 in the vibration direction. In this embodiment, the mass element 3522 is described as being disposed on the side of the cantilever beam 3521 away from the transducer (not shown in the figure) in the vibration direction.

[0247] In some embodiments, at least one mass element 3522 is provided on either side of the free end of the cantilever beam 3521 perpendicular to the vibration direction. The dimensions of the various mass elements 3522 may be partially the same, all the same, or all different. In some embodiments, the distance between adjacent mass elements 3522 may be the same or different. In practical use, the design can be based on the vibration modes.

[0248] Also refer to Figure 30 (a) and Figure 30(b) In some embodiments, three mass elements 3522 are provided on the cantilever beam 3521. The three mass elements 3522 on the cantilever beam 3521 are of the same size and are collinear at the center point of the cantilever beam 3521. In some embodiments, since the cantilever beam 3521 is narrow in the horizontal direction perpendicular to the vibration direction, preferably, one or more mass elements 3522 are arranged collinearly with the cantilever beam 3521 to obtain a more stable sensitivity improvement.

[0249] In some embodiments, the cantilever beam 3521 has a rectangular profile in its radial cross-section. In other embodiments, the radial cross-section of the cantilever beam 3521 can be rectangular, triangular, trapezoidal, rhomboid, or other curved shapes. In some embodiments, multiple resonant peak positions of the vibration sensor can be adjusted by changing the material, shape, and size of the cantilever beam 3521 and the mass element 3522.

[0250] In some embodiments, the vibration sensor can be applied to MEMS device design. In some embodiments, the vibration sensor can be applied to the design of macroscopic devices (such as microphones, speakers, etc.). In MEMS device fabrication, the cantilever beam 3521 can be a single-layer material along its thickness direction, such as Si, SiO2, SiNx, SiC, etc., or it can be a two-layer or multi-layer composite material, such as Si / SiO2, SiO2 / Si, Si / SiNx, SiNx / Si / SiO2, etc. The mass element 3522 can be a single-layer material, such as Si, Cu, etc., or it can be a two-layer or multi-layer composite material, such as Si / SiO2, SiO2 / Si, Si / SiNx, SiNx / Si / SiO2, etc. In this embodiment, the cantilever beam 821 in the MEMS device is selected to be made of Si or SiO2 / SiNx, and the mass element 3522 is selected to be made of Si. In MEMS device fabrication, in some embodiments, the cantilever beam 3521 has a length of 500 μm to 1500 μm; in some embodiments, the thickness of the cantilever beam 3521 can be 0.5 μm to 5 μm; in some embodiments, the side length of the mass element 3522 can be 50 μm to 1000 μm; and in some embodiments, the height of the mass element 5322 can be 50 μm to 5000 μm. In some embodiments, the cantilever beam 5321 has a length of 700 μm to 1200 μm and a thickness of 0.8 μm to 2.5 μm; the mass element 3522 has a side length of 200 μm to 600 μm and a height of 200 μm to 1000 μm.

[0251] In macroscopic devices, the cantilever beam 3521 can be made of inorganic non-metallic materials, such as aluminum nitride, zinc oxide, lead zirconate titanate, etc., or metallic materials, such as copper, aluminum, tin, or other alloys, or combinations thereof. The mass element 3522 is generally required to possess a certain mass within a small volume, therefore requiring a high density. Its material can be copper, tin, or other alloys, or ceramic materials. Preferably, the cantilever beam 3521 is made of aluminum nitride or copper, and the mass element 3522 is made of tin or copper. In macroscopic devices, the length of the cantilever beam 3521 can be 1 mm to 20 cm, and the thickness can be 0.1 mm to 10 mm; in some embodiments, the side length of the mass element 3522 can be 0.2 mm to 5 cm, and the height can be 0.1 mm to 10 mm. In some embodiments, the length of the cantilever beam 3521 can be 1.5 mm to 10 mm, and the thickness of the cantilever beam 3521 can be 0.2 mm to 5 mm; the side length of the mass element 3522 can be 0.3 mm to 5 cm, and the height of the mass element 3522 can be 0.5 mm to 5 cm.

[0252] In some embodiments, two mass elements may be disposed on the cantilever beam of the vibration assembly, and the two mass elements have different heights in the vibration direction. In some embodiments, the height of the mass element near the free end of the cantilever beam may be lower than the height of the mass element far from the free end. In some embodiments, the mass element near the free end of the cantilever beam may be higher than the mass element far from the free end. It should be noted that even if the other structural parameters of the two mass elements are the same, due to the different positions of the mass elements in the above two cases, the two cases may have two different forms of resonance peaks in some embodiments.

[0253] In some embodiments, the mass elements on the cantilever beam may include one or four. The four mass elements disposed on the cantilever beam may have the same structural parameters, may be partially different, or may all be different.

[0254] Figure 31 This is a schematic diagram of the frequency response curves of the vibration component in the vibration sensor 3600 according to some embodiments of this specification under different numbers of mass elements.

[0255] like Figure 31 As shown, in some embodiments, the frequency response curve of the vibration sensor 3600 under the action of the cantilever beam and mass element has one or more resonance peaks. Figure 31The data includes three frequency response curves: 3610, 3620, and 3630. Curve 3610 represents the frequency response of the vibration sensor when one mass element is placed on the cantilever beam; curve 3620 represents the frequency response when two mass elements are placed on the cantilever beam; and curve 3630 represents the frequency response when three mass elements are placed on the cantilever beam. As can be seen from the figures, frequency response curve 3610 has one resonance peak, frequency response curve 3620 has two resonance peaks, and frequency response curve 3630 has three resonance peaks.

[0256] In some embodiments, the arrangement of the mass elements on the cantilever beam can refer to the method described above; the arrangement of three mass elements can refer to... Figure 30 As shown in the figure, with only one mass element, the vibration sensor's resonant peak is around 10 kHz. With two resonant peaks, the sensor forms peaks at 3 kHz and 13 kHz. Using two mass elements significantly improves the sensitivity within the target frequency range (e.g., 2 kHz to 15 kHz) near these two frequencies. When three mass elements are placed on the same cantilever beam, the vibration sensor forms three resonant peaks: 2250 Hz, 7600 Hz, and 15700 Hz. This significantly improves the sensitivity within the target frequency range (e.g., 1 kHz to 20 kHz) near these three frequencies and naturally divides the frequency response curve into three different frequency bands, which is beneficial for subsequent signal processing. Furthermore, as can be seen from the figure, the overall sensitivity of the vibration sensor is improved as the number of mass elements increases. For example, in the low-frequency band (such as below 1 kHz), the sensitivity of frequency response curve 3630 is still higher than that of frequency response curve 3610. It can be seen that by reasonably setting the plate structure and mass elements, the bandwidth of the frequency band with higher sensitivity can be broadened and the sensitivity within the target frequency band can be improved.

[0257] Figure 32 This is a schematic diagram of the structure of a vibration sensor according to some embodiments of this specification. For example... Figure 32As shown, the vibration sensor 3700 may include a housing 3711, a vibration assembly 3712, and an acoustic transducer 3720. In some embodiments, the housing 3711 may be connected to the acoustic transducer 3720 to form a structure having an acoustic cavity 3713. The connection between the housing 3711 and the acoustic transducer 3720 may be a physical connection. In some embodiments, the vibration assembly 3712 may be located within the acoustic cavity 3713. In some embodiments, the vibration assembly 3712 may divide the acoustic cavity 3713 into a first acoustic cavity 37131 and a second acoustic cavity 37132. For example, the vibration assembly 3712 may form a second acoustic cavity 37132 with the housing 3711; the vibration assembly 3712 may form a first acoustic cavity 37131 with the acoustic transducer 3720. It should be noted that the housing 3711 here is a housing structure that is independent of the acoustic transducer 3720. In some embodiments, the housing 3711 can also be the housing structure of the entire vibration sensor 3700, in which case the vibration component 3712 and the acoustic transducer 3720 can be located in the internal space of the housing 3711.

[0258] In some embodiments, the first acoustic cavity 37131 may be acoustically connected to the acoustic transducer 3720. By way of example only, the acoustic transducer 3720 may include a pickup hole 3721, through which the acoustic transducer 3720 may be acoustically connected to the first acoustic cavity 37131. It should be noted that, as Figure 32 The description of the single pickup port 3721 shown is for illustrative purposes only and is not intended to limit the scope of the invention. It should be understood that the vibration sensor 3700 may include more than one pickup port. For example, the vibration sensor 3700 may include multiple pickup ports arranged in an array.

[0259] In some embodiments, the vibration unit 3712 may include a mass element 37121 and an elastic element 37122. In some embodiments, the mass element 37121 and the elastic element 37122 may be physically connected, for example, by adhesive bonding. As an example only, the elastic element 37122 may be a material with a certain degree of viscosity, directly bonded to the mass element 37121. In some embodiments, the elastic element 37122 may be a high-temperature resistant material, allowing it to maintain its performance during the manufacturing process of the vibration sensor 3700. In some embodiments, when the elastic element 37122 is exposed to an environment of 200°C to 300°C, its Young's modulus and shear modulus show no change or very small changes (e.g., changes within 5%), wherein the Young's modulus can be used to characterize the deformation capacity of the elastic element 37122 under tension or compression, and the shear modulus can be used to characterize the deformation capacity of the elastic element 37122 under shear. In some embodiments, the elastic element 37122 may be a material with good elasticity (i.e., prone to elastic deformation), such that the vibration assembly 3712 can vibrate in response to the vibration of the housing 3711. By way of example only, the material of the elastic element 37122 may include silicone rubber, silicone gel, silicone sealant, or any combination thereof.

[0260] In some embodiments, the elastic element 37122 may surround and be connected to the sidewall of the mass element 37121. The inner side of the elastic element 37122 is connected to the sidewall of the mass element 37121. The inner side of the elastic element 37122 may refer to the side of the space surrounded by the elastic element 37122. The sidewall of the mass element 37121 may refer to the side of the mass element 37121 that is parallel to the vibration direction. The upper and lower surfaces of the mass element 37121 are approximately perpendicular to the vibration direction and are used to define the second acoustic cavity 37132 and the first acoustic cavity 37131, respectively. Since the elastic element 37122 surrounds and is connected to the sidewall of the mass element 37121, during the vibration of the vibrating assembly 3712 along the vibration direction, the momentum of the mass element 37121 is converted into a force on the elastic element 3722, causing the elastic element 37122 to undergo shear deformation. Compared to tensile and compressive deformation, shear deformation reduces the spring coefficient of the elastic element 37122, which reduces the resonant frequency of the vibration sensor 3700, thereby increasing the vibration amplitude of the mass element 37121 during the vibration of the vibration unit 3712 and improving the sensitivity of the vibration sensor 3700.

[0261] In some embodiments, the shape of the elastic element 37122 may be adapted to the shape of the mass element 37121. For example, the elastic element 37122 may be a tubular structure, the open end of which has the same cross-sectional shape as the mass element 37121 in a section perpendicular to the vibration direction of the mass element 37121. The open end of the elastic element 37122 may be the end connected to the mass element 37121. The mass element 37121 may be quadrilateral in shape in a section perpendicular to the vibration direction of the mass element 37121, and the area surrounded by the elastic element 37122 may be tubular, with a quadrilateral hole in a section perpendicular to the vibration direction of the mass element 37121. By way of example only, the shape of the mass element 37121 in a section perpendicular to the vibration direction of the mass element 37121 may also include regular shapes (e.g., circles, ellipses, sectors, rounded rectangles, polygons) and irregular shapes. Accordingly, the shape of the tubular shape surrounding the elastic element 37122 in a cross-section perpendicular to the vibration direction of the mass element 37121 may include a tubular shape with a regular or irregular orifice. This specification does not limit the shape of the tubular elastic element 37122. The outer side of the elastic element 37122 may be the side opposite to the inner side 37124 of the elastic element 37122. For example, the shape of the outer side of the tubular elastic element 37122 may include a cylinder, an elliptical cylinder, a cone, a rounded rectangular cylinder, a rectangular cylinder, a polygonal cylinder, an irregular column, or any combination thereof.

[0262] In some embodiments, the elastic element 37122 may extend toward and be directly or indirectly connected to the acoustic transducer 3720. For example, one end of the elastic element 37122 extending toward the acoustic transducer 3720 may be directly connected to the acoustic transducer 3720. The connection between the elastic element 37122 and the acoustic transducer 3720 may be a physical connection, such as adhesive bonding. In some embodiments, the elastic element 37122 and the housing 3711 may be in direct contact or separated. For example, as... Figure 32 As shown, there may be a gap between the elastic element 37122 and the housing 3711. The size of this gap can be adjusted by the designer according to the size of the vibration sensor 3700.

[0263] In some embodiments, the mass element 37121 may have at least one first hole 37123. The first hole 37123 can penetrate the mass element 37121, allowing gas flow between the first acoustic cavity 37131 and the second acoustic cavity 37132. This balances the pressure changes inside the first acoustic cavity 37131 and the second acoustic cavity 37132 caused by temperature changes during the fabrication process of the vibration sensor 3700 (e.g., reflow soldering), reducing or preventing damage to components of the vibration sensor 3700 caused by these pressure changes, such as cracking or deformation. In some embodiments, the elastic element 37122 may also have a first hole 37123, which penetrates the sidewall of the elastic element 37122, allowing communication between the first acoustic cavity 37131 and the second acoustic cavity 37132. In some embodiments, both the mass element 37121 and the elastic element 37122 may have the first hole 37123.

[0264] In some embodiments, the housing 3711 may be provided with at least one second hole 37111 (or a third hole), the second hole 37111 being able to penetrate the housing 3711. When the mass element 37121 vibrates, the second hole 37111 can be used to reduce the damping generated by the gas inside the second acoustic cavity 37332.

[0265] In some embodiments, the first aperture 37123 or the second aperture 37111 can be a single aperture. Taking the second aperture 37111 as an example, in order to reduce the damping generated by the gas inside the second acoustic cavity 37332 and reduce the resistance when the vibrating component 3712 vibrates, in some embodiments, the diameter of the single aperture can be greater than 1 μm. In order to improve the isolation capability of the second aperture 37111 and thus better prevent the entry of external moisture, dust and other substances, in some embodiments, the diameter of the second aperture 37111 can be less than 50 μm. In order for the second aperture 37111 to better reduce the resistance when the vibrating component 3712 vibrates, while ensuring the waterproof and dustproof effect of the second aperture 37111, in some embodiments, the diameter of the single aperture can be 2-45 μm. To facilitate the opening of the second aperture 37111, the diameter of the single aperture can be 7-10 μm. In some embodiments, the first aperture 37123 or the second aperture 37111 can be an array composed of a certain number of micropores. As an example only, the number of micropores can be 2-10. To reduce the damping generated by the gas inside the second acoustic cavity 37332 and the resistance during vibration of the vibrating component 3712, in some embodiments, the diameter of each micropore can be greater than 0.1 μm. To improve the isolation capability of the second aperture 37111, thereby better preventing the entry of external moisture, dust, and other substances, in some embodiments, the diameter of each micropore can be less than 25 μm. To enable the second aperture 37111 to effectively reduce the resistance during vibration of the vibrating component 3712, while ensuring the waterproof and dustproof effect of the second aperture 37111, in some embodiments, the diameter of each micropore can be 0.5-20 μm. To facilitate the opening of the second aperture 37111, the diameter of each micropore can be 0.5-15 μm.

[0266] In some embodiments, ambient airborne sound may affect the performance of the vibration sensor 3700. To reduce the impact of ambient airborne sound, after the vibration sensor 3700 is manufactured, for example after reflow soldering, at least one second hole 37111 on the housing 3711 can be sealed with a sealing material. By way of example only, the sealing material may include epoxy resin, silicone sealant, or any combination thereof.

[0267] In some embodiments, the housing 3711 and the mass element 37121 may not have holes. In some embodiments, when the housing 3711 and the mass element 37121 do not have second holes, the components of the vibration sensor 3700 can be prevented from being damaged by changes in air pressure inside the first acoustic cavity 37131 and the second acoustic cavity 37332 by increasing the connection strength between the components of the vibration sensor 3700 (e.g., increasing the connection strength of the adhesive connecting the components).

[0268] It should be noted that the above description of the vibration sensor 3700 and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and alterations to the vibration sensor 3700 under the guidance of this specification. In some embodiments, the acoustic transducer 3720 may have at least one aperture that communicates with the acoustic cavity 3713 through a pickup hole 3721 and a first aperture 37123. These modifications and alterations are still within the scope of this specification.

[0269] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

Claims

1. A vibration sensor, comprising: Acoustic transducers and vibration components; as well as The housing is configured to house the acoustic transducer and the vibration assembly, and to generate vibration based on an external vibration signal; The vibration assembly includes an elastic element and a mass element. The mass element is connected to the acoustic transducer through the elastic element. The housing, the mass element, the elastic element, and the acoustic transducer form a plurality of acoustic cavities including a first acoustic cavity. The first acoustic cavity is in communication with the acoustic transducer. The vibration assembly responds to the vibration of the housing to cause a change in the sound pressure of the first acoustic cavity. The acoustic transducer generates an electrical signal based on the change in the sound pressure of the first acoustic cavity. The mass element or the elastic element includes a first hole. The first acoustic cavity is connected to other acoustic cavities through the first hole. The elastic element is a tubular structure and is configured to undergo shear deformation during the vibration of the vibration assembly along the vibration direction. One end of the elastic element is connected to the mass element, and the other end is directly connected to the acoustic transducer. The elastic element is connected around the side wall of the mass element, and there is a gap between the elastic element and the housing.

2. The vibration sensor according to claim 1, wherein, The elastic element or the mass element is made of a breathable material.

3. The vibration sensor according to claim 1, wherein, The housing includes a second opening through which the first acoustic cavity, the other acoustic cavities, and the acoustic transducer communicate with the outside.

4. The vibration sensor according to claim 3, wherein, When the vibration sensor is in operation, the second hole is closed.

5. The vibration sensor according to claim 1, wherein, The housing includes a third hole located at the housing corresponding to the acoustic cavity formed by the housing and the vibration assembly.

6. The vibration sensor according to claim 5, wherein, The third hole is offset from the first hole in a direction perpendicular to the vibration direction of the vibration component.

7. The vibration sensor according to claim 5, wherein, The diameter of the third aperture ranges from 5µm to 20µm.

8. The vibration sensor according to claim 1, wherein, The acoustic transducer includes a substrate, the elastic element and the housing are connected to the substrate, the substrate includes a pickup hole, and the first acoustic cavity is connected to the acoustic transducer through the pickup hole.

9. The vibration sensor according to claim 8, wherein, The acoustic transducer includes a diaphragm located at the pickup hole, the diaphragm vibrating in response to changes in sound pressure in the first acoustic cavity, and the diaphragm including a fourth hole.

10. The vibration sensor according to claim 9, wherein the diaphragm is made of a breathable material.

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