LED luminaire with VOC barrier
Patent Information
- Authority / Receiving Office
- HK · HK
- Patent Type
- Applications
- Current Assignee / Owner
- DIALIGHT CORP
- Filing Date
- 2026-05-12
- Publication Date
- 2026-07-10
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
Abstract This disclosure relates to embodiments of a light-emitting diode (LED) device. In one embodiment, the LED device includes a printed circuit board (PCB), at least one LED chip electrically connected to the PCB, an LED package for encapsulating the at least one LED chip, and at least one volatile organic compound (VOC) barrier layer coated on the LED package.
Claims
What is claimed is:1 . A light emitting diode (LED) device, comprising: a printed circuit board (PCB); at least one LED chip electrically coupled to the PCB; a LED package to encapsulate the at least one LED chip; and at least one volatile organic compound (VOC) barrier layer coating the LED package.
2. The LED device of claim 1 , wherein the at least one VOC barrier layer coats the entire LED package.
3. The LED device of claim 1 , wherein the at least one VOC barrier layer comprises a cross-linked polymer.
4. The LED device of claim 3, wherein the cross-linked polymer comprises an acrylic polymer.
5. The LED device of claim 4, wherein the acrylic polymer is suspended in a mixture with N-butyl acetate.
6. The LED device of claim 1 , wherein the at least one VOC barrier layer comprises an ethylene-polymer coating or a liquid silicone dioxide coating.
7. The LED device of claim 1 , wherein the at least one VOC barrier layer has a thickness of between approximately 25 microns to approximately 100 microns.
8. The LED device of claim 7, wherein the at least one VOC barrier layer has a thickness of between approximately 35 microns to approximately 75 microns.
9. The LED device of claim 1 , further comprising:a coating layer on top of the at least one VOC barrier layer.
10. The LED device of claim 9, wherein the coating layer comprises a blend of acrylic and urethane polymers.
11. A light emitting diode (LED) device, comprising: a printed circuit board (PCB); a plurality of arrays of LED chips electrically coupled to the PCB; a LED package to encapsulate the plurality of arrays of LED chips; a first layer of a VOC barrier layer deposited in a direction parallel to a mid-line of the plurality of arrays of LED chips; and a second layer of the VOC barrier layer deposited in a direction perpendicular to the first layer.
12. The LED device of claim 11 , wherein the VOC barrier layer comprises an acrylic polymer suspended in a mixture with N-butyl acetate.
13. The LED device of claim 11 , wherein the second layer of the VOC barrier layer has a thickness that is approximately 1 .5 times a thickness of the first layer of the VOC barrier layer.
14. The LED device of claim 11 , further comprising: a third layer of the VOC barrier layer deposited in a direction that is 45 degrees off axis relative to the first layer of the VOC barrier.
15. The LED device of claim 14, wherein the third layer of the VOC barrier layer has a thickness that is greater than 25 microns.
16. The LED device of claim 14, further comprising: a coating layer on top of the third layer of the VOC barrier layer, wherein the coating layer comprises a blend of acrylic and urethane polymers.
17. The LED device of claim 16, wherein the coating layer has a thickness less than 25 microns.
18. A method, comprising: providing a light emitting diode (LED) device, wherein the LED device comprises at least one LED chip and an encapsulating LED package to enclose the at least one LED chip; applying at least one volatile organic compound (VOC) barrier coating over the entire encapsulating LED package of the LED device; and curing the at least one VOC barrier coating.
19. The method of claim 18, wherein the at least one VOC barrier coating comprises a suspended mixture of approximately 40 percent acrylic polymer and 60 percent n-butyl acetate.
20. The method of claim 18, wherein the applying comprises: masking the LED device to only expose portions of the LED device that are to receive the at least one VOC barrier coating; and spray coating the at least one VOC barrier coating onto the portions of the LED device that are exposed by the masking.