Stamping method for producing a coin
The stamping method efficiently produces high-relief coins with improved quality by pre-forming reliefs on both sides of the coin blank and re-stamping, addressing the inefficiencies of traditional manufacturing methods.
Patent Information
- Application Number
- HK42026124177
- Authority / Receiving Office
- HK · HK
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-02
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-31
AI Technical Summary
Existing methods for manufacturing coins struggle to produce high-relief coins with good quality efficiently and without requiring large-scale material transport during the stamping process.
A stamping method involving pre-forming reliefs on a coin blank using milling processes and re-stamping with punches, allowing for high-relief coins to be manufactured on both sides with improved quality and efficiency.
The method enables the production of coins with high relief and anti-counterfeiting features, simplifying the manufacturing process by reducing material transport and enhancing the quality through efficient pre-forming and re-stamping techniques.
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Abstract
Description
(19) State Intellectual Property Office (12) Invention Patent Application (10) Application Publication Number (43) Application Publication Date (21) Application Number 202510901258.7 (22) Application Date 2025.07.01 (30) Priority Data 102024118690.9 2024.07.02 DE (71) Applicant BH Meyer Art Mint Co., Ltd. Address Karlsfeld, Germany (72) Inventor Christian Stefan (74) Patent Agency Chengdu Fandian Intellectual Property Agency Co., Ltd. 51258 Patent Attorney Shi Ermei (51) Int.Cl. B44B 5 / 00 (2006.01) B44B 5 / 02 (2006.01) (54) Invention Title: Imprinting Method for Manufacturing Coins (57) Abstract: This invention relates to an imprinting method for manufacturing coins (100), comprising the following steps: pre-forming a relief (105-1, 105-2) for the coin (100); and re-imprinting the relief (105-1, 105-2) using an imprinting punch (107-1, 107-2). Claims 1 page, Description 3 pages, Drawings 2 pages, CN 121268440 A 2026.01.06 CN 1 21 26 84 40 A 1. A pressing method for manufacturing a coin (100), the pressing method comprising the steps of: - pre-forming a relief (105-1, 105-2) for the coin (100) (S101); and - re-pressing the relief (105-1, 105-2) using pressing punches (107-1, 107-2) (S102). 2. The pressing method according to claim 1, wherein the relief (105-1, 105-2) is pre-formed by means of a milling process. 3. The stamping method according to any one of the preceding claims, wherein a first relief (105-1) is pre-formed on one side (109-1) and a second relief (105-2) is pre-formed on the opposite side (109-2). 4. The stamping method according to any one of the preceding claims, wherein the first relief (105-1) is re-pressed on one side (109-1) by a first stamping punch (107-1) and / or the second relief (105-2) is re-pressed on the opposite side (109-2) by a second stamping punch (107-2). 5. The stamping method according to any one of the preceding claims, wherein the reliefs (105-1, 105-2) have a height at least 200% of the thickness of the coin blank (103). 6. The embossing method according to any one of the preceding claims, wherein the relief (105-1, 105-2) is pre-formed in a flat plate (111).7. The stamping method according to any one of the preceding claims, wherein a first side (109-1) and / or a second side (109-2) of the plate (111) is planar milled. 8. The stamping method according to claim 6 or 7, wherein a coin blank (103) is cut from the plate (111). 9. The stamping method according to any one of the preceding claims, wherein the pre-formed relief (105-1, 105-2) is heated before the re-stamping is performed. 10. The stamping method according to any one of claims 7 to 9, wherein the relief (105-1, 105-2), the coin blank (103), or the plate (111) is made of gold, silver, copper, platinum, non-ferrous metals, or alloys. Claims 1 / 1 page 2 CN 121268440 A Stamping method for manufacturing coins Technical Field
[0001] The present invention relates to a stamping method for manufacturing coins.
[0002] The technical objective of this invention is to manufacture coins with particularly high relief and good quality.
[0003] This technical objective is achieved by the subject matter according to the independent claims. Technically advantageous embodiments are the subject matter of the dependent claims, the specification, and the drawings.
[0004] According to a first aspect, this technical objective is achieved by a stamping method for manufacturing coins, the stamping method comprising the steps of: pre-forming a relief for the coin; and re-stamping the relief using a stamping punch. The technical advantage achieved by this method is that coins with high relief can be manufactured with particularly good quality. Since the subject of the relief is already present in the coin blank, no large-scale material transport is required during the subsequent stamping process.
[0005] In one technically advantageous embodiment of this stamping method, the relief is pre-formed by means of a milling process. The technical advantage achieved therefrom is, for example, the ability to pre-form the relief particularly efficiently.
[0006] In another technically advantageous embodiment of this stamping method, a first relief is pre-formed on one side and a second relief is pre-formed on the opposite side. The resulting technical advantage is, for example, the ability to manufacture coins with particularly high relief on both sides.
[0007] In another technically advantageous embodiment of this stamping method, the first relief on one side is re-pressed by a first stamping punch, and / or the second relief on the opposite side is re-pressed by a second stamping punch. The resulting technical advantage is, for example, the ability to efficiently manufacture coins with particularly high relief on both sides.
[0008] In another technically advantageous embodiment of this stamping method, the relief has a height of at least 100% of the thickness of the coin blank, preferably, the relief has a height of at least 150% or 200% of the thickness of the coin blank. The resulting technical advantage is, for example, the manufacture of coins with particularly high anti-counterfeiting features.
[0009] In another technically advantageous embodiment of the stamping method, the relief is pre-formed within a plate. The plate may have dimensions from which multiple side-by-side reliefs can be pre-formed for each coin. The resulting technical advantage is, for example, that the manufacture of the reliefs is simplified and multiple coin blanks can be manufactured quickly and easily through a single cutting process on the plate.
[0010] In another technically advantageous embodiment of the stamping method, a first side and / or a second side of the plate is planar milled. The resulting technical advantage is, for example, that unevenness or deviation of the plate can be compensated for and the quality of the stamping improved.
[0011] In another technically advantageous embodiment of the stamping method, coin blanks are cut from the plate. The resulting technical advantage is, for example, that the manufacture of coin blanks is simplified.
[0012] In another technically advantageous embodiment of the stamping method, the pre-formed relief is heated before re-stamping. Heating the blank increases the deformability of the coin blank. The resulting technical advantage is, for example, that a higher profile can be manufactured by hot molding, thereby improving the quality of the coin.
[0013] In another technically advantageous embodiment of this stamping method, the relief, coin blank, or plate is made of gold, silver, copper, platinum, non-ferrous metals, or alloys. The resulting technical advantage is, for example, that a particularly suitable material is used to manufacture the coin. (Page 1 / 3 of the specification, CN 121268440 A) Brief Description of the Drawings
[0014] Embodiments of the invention are shown in the accompanying drawings and described in detail below.
[0015] Wherein: FIG1 shows a schematic diagram of the stamping method; FIG2 shows a schematic diagram of a method for manufacturing a coin blank having a pre-formed relief; FIG3 shows a schematic diagram of a method for manufacturing a coin blank by means of planar milling; and FIG4 shows a block diagram of the stamping method for manufacturing a coin. Detailed Description
[0016] FIG1 shows a schematic diagram of the stamping method. First, reliefs 105-1 and / or 105-2 are pre-formed on one or both sides of the coin blank 103. Reliefs 105-1 or 105-2 protrude from the coin blank 103. Reliefs 105-1 or 105-2 are three-dimensional representations of the subject. The coin blank 103 is, for example, a circular blank. Reliefs 105-1 and 105-2 can be pre-formed into the desired three-dimensional shape, for example, by means of a cutting process (e.g., by means of milling).
[0017] Subsequently, the coin blank 103 with the reliefs is re-pressed by means of an embossing method. For this purpose, the coin blank 103 with the pre-formed reliefs 105-1 and 105-2 is positioned between two embossing punches 107-1 and 107-2. The pre-formed reliefs 105-1 and 105-2 are re-pressed by the stamping punches 107-1 and 107-2 to give the coin 100 its final shape.The stamping punches 107-1 and 107-2 have recesses for further processing and shaping of the reliefs 105-1 and 105-2 for this purpose.
[0018] Figure 2 shows a schematic diagram of a method for manufacturing a coin blank 103 with pre-formed reliefs 105-1 and / or 105-2. First, a plate 111 is used as a substrate for manufacturing the coin blank 103. The plate 111 has a thickness of, for example, 3 mm and is made of gold, silver, copper, platinum, non-ferrous metals or alloys. The plate 111 can be large enough to manufacture multiple coin blanks 103 from the plate. Multiple reliefs 105-1 are milled side by side from the plate 111.
[0019] Within the plate 111, the three-dimensional reliefs 105-1 are pre-formed into desired shapes at multiple locations, for example by means of CNC processes. This shape approximately corresponds to the shape of the reliefs 105-1 after the subsequent stamping process. Reliefs 105-1 and 105-2 can be pre-formed on one or both sides of the flat plate 111. The manufactured three-dimensional coin blank 103 already reflects the subsequent pattern. The side-by-side reliefs 105-1 have a spacing between them within the flat plate 111.
[0020] If reliefs 105-1 and 105-2 have been pre-formed within the flat plate 111, the individual coin blanks 103 are cut from the flat plate 111. This can be done by cutting the spacer areas 113 using a slot milling machine. The coin blanks 103 are, for example, circular and have a diameter of 11 mm to 120 mm. The coin blanks 103 are then ready for the re-pressing process.
[0021] Figure 3 shows a schematic diagram of a method for manufacturing coin blanks 103 by means of planar milling. The flat plate 111 is used as the substrate for manufacturing coin blanks 103. First, the plate 111 is planar milled on one or both sides, thereby giving the plate 111 a uniform thickness, for example, a depth of about 0.1 mm. The planar milling is performed continuously in a spiral manner to prevent milling edges. The uniform thickness of the plate 111 can improve the quality of the stamping.
[0022] Multiple reliefs 105-1 are then milled out side by side from the plate 111 after planar milling. In the region 115 opposite to the reliefs 105-2, the plate 111 is punched. The region 115 opposite to the reliefs 105-2 is uniformly reduced by means of a milling tool. This produces a circular recess with a face corresponding to the reliefs 105-2 on the opposite side. Specification 2 / 3 pages 4 CN 121268440 A
[0023] When the reliefs 105-2 have been pre-formed in the plate 111, individual coin blanks 103 are punched out from the plate 111. This can be done by using a slot milling cutter to punch the interval area 113. The coin blank 103 is then, for example, round and has a diameter of 11 mm to 120 mm.
[0024] Figure 4 shows a block diagram of a stamping method for manufacturing coins. The stamping method includes a step S101 of pre-forming reliefs 105-1 and 105-2 for coin 100. The coin blank 103 can be structurally adjusted to produce a perfect stamp (angle, convexity, shading). Then, in step S102, the reliefs 105-1 and 105-2 are re-stamped using stamping punches 107-1 and 107-2. This stamping method can produce coins with particularly high and raised reliefs 105-1 and 105-2. The height of the reliefs 105-1 and 105-2 is, for example, 200% of the thickness of the coin blank 103.
[0025] For example, the three-dimensional coin blank 103 is stamped with PP-grade quality (PP: polished plate) by means of stamping punches 107-1 and 107-2. The embossing can achieve up to 200% relief on each side, with the highest level of detail and mirror-like finish on each side. The degree of deformation can reach 200% of the thickness of the coin blank 103 on one side or 200% of the thickness of the coin blank 103 on both sides.
[0026] The thickness of the coin blank 103 can be calculated using the following formula: X = Rg * 4 / (Sg * π * D * D). Where X is the thickness of the coin blank, Rg = nominal weight of the coin blank, Sg is the specific gravity of the material, and D is the diameter of the stamping punch 107.
[0027] If the nominal weight is 31.1g, the specific gravity is 0.0105g / mm3, and the diameter is 38.35mm, then the thickness X of the coin blank 103 is 2.565mm. The 200% relief therefore has a height of 5.13 mm based on the thickness of the coin blank 103. The 400% relief has a height of 10.26 mm based on the thickness of the coin blank 103.
[0028] All features described and shown in conjunction with the various embodiments of the invention can be arranged in different combinations in the subject matter of the invention to simultaneously achieve their advantageous effects.
[0029] All method steps can be implemented by a device suitable for performing the various method steps. All functions implemented by the subject features can be method steps of the method.
[0030] The scope of protection of the invention is defined by the claims and is not limited to the features set forth in the specification or shown in the drawings.
[0031] List of reference numerals 100 coin 103 coin blank 105 relief 107 stamping punch 109 side 111 plate 113 spacer area 115 area.Instruction Manual 3 / 3 Page 5 CN 121268440 A Figure 1 Figure 2 Instruction Manual Drawings 1 / 2 Page 6 CN 121268440 A Figure 3 Figure 4 Instruction Manual Drawings 2 / 2 Page 7 CN 121268440 A Abstract The present invention relates to a stamping method for producing a coin (100), comprising the following steps: preforming a relief (105-1, 105-2) for the coin (100); and subsequently stamping the relief (105-1, 105-2) with a stamping die (107-1, 107-2).
Claims
1. A coining method for manufacturing a coin (100), the coining method comprising the steps of: - pre-forming (S101) a relief (105-1, 105-2) for the coin (100); and - re-coining (S102) the relief (105-1, 105-2) with a coining punch (107-1, 107-2).
2. The embossing method according to claim 1, wherein, The relief (105-1, 105-2) is pre-formed by means of a milling process.
3. The embossing method according to any of the preceding claims, wherein, The first relief (105-1) is pre-formed on one side (109-1) and the second relief (105-2) is pre-formed on the opposite side (109-2).
4. The embossing method according to any of the preceding claims, wherein, The first relief (105-1) is re-coined on one side (109-1) by means of a first coining punch (107-1) and / or the second relief (105-2) is re-coined on the opposite side (109-2) by means of a second coining punch (107-2).
5. The embossing method according to any of the preceding claims, wherein, The relief (105-1, 105-2) has a height of at least 200% of the thickness of the coin blank (103).
6. The embossing method according to any of the preceding claims, wherein, The relief (105-1, 105-2) is pre-formed in a plate (111).
7. The embossing method according to any of the preceding claims, wherein, The first side (109-1) and / or the second side (109-2) of the plate (111) is plane milled.
8. The embossing method according to claim 6 or 7, wherein, The coin blank (103) is punched out of the plate (111).
9. The embossing method according to any of the preceding claims, wherein, The pre-formed relief (105-1, 105-2) is heated before the re-coining is performed.
10. The embossing method according to any one of claims 7 to 9, wherein, The relief (105-1, 105-2), the coin blank (103) or the plate (111) is made of gold, silver, copper, platinum, non-ferrous metal or an alloy.