Di metal transaction devices and processes for the manufacture thereof

Abstract

A transaction device comprising: a metal layer having a front surface, a back surface, a periphery, and one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; a first non-metal, reinforcing layer disposed over the front surface of the metal layer; a booster antenna disposed over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations isolated from the metal layer; a second non-metal, reinforcing layer disposed over the back surface of the metal layer; an opening in the metal layer extending through the first non-metal, reinforcing layer; a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna forming a portion of a payment circuit configured for wireless communication with a device reader.

Description

(19) *EP004651020A2* (11) EP 4 651 020 A2 (12) EUROPEAN PATENT APPLICATION (43) Date of publication: 19.11.2025 Bulletin 2025 / 47 (21) Application number: 25206903.4 (22) Date of filing: 05.02.2021 (51) International Patent Classification (IPC): G06K 19 / 02 (2006.01) (52) Cooperative Patent Classification (CPC): G06K 19 / 07794; G06K 19 / 02; G06K 19 / 07722 (84) Designated Contracting States: AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR (30) Priority: 07.02.2020 US 202062971439 P (62) Document number(s) of the earlier application(s) in accordance with Art. 76 EPC: 21709239.4 / 4 100 880 (71) Applicant: Composecure LLC Somerset, NJ 08873 (US) (72) Inventors: • LOWE, Adam Somerset, 08873 (US) • ESAU, John Marlboro, 07746 (US) (74) Representative: Impuls legal PartG mbB Goethestraße 21 80336 München (DE) Remarks: This application was filed on 06.10.2025 as a divisional application to the application mentioned under INID code 62. (54) DI METAL TRANSACTION DEVICES AND PROCESSES FOR THE MANUFACTURE THEREOF (57) A transaction device comprising: a metal layer having a front surface, a back surface, a periphery, and one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to thebacksurface, including at least one discontinuity extending to the per- iphery of the metal layer; a first non-metal, reinforcing layer disposed over the front surface of the metal layer; a booster antenna disposed over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations isolated from the metal layer; a second non-metal, reinforcing layer disposed over the back surface of the metal layer; an opening in the metal layer extending through the first non-metal, reinforcing layer; a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna forming a portion of a payment circuit configured for wireless communication with a device reader. EP 4 65 1 02 0 A 2 Processed by Luminess, 75001 PARIS (FR) Description CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Provisional Application Ser. No. 62 / 971,439, filed February 7, 2020, titled DIMETALTRANSACTIONDEVICESANDPROCESSESFORTHEMANUFACTURETHEREOF, incorporatedhereinby reference. FIELD OF THE INVENTION

[0002] This invention relates to transaction cards with electronic components and methods for producing the same. BACKGROUND OF THE INVENTION

[0003] Metal payment cards present unique challenges when including electronic components, such as inductive coupling payment modules, RF electronics, and standalone electronic inlays. To accommodate these components, the metal is machined into various geometries, then the component is placed in the cavity and left exposed or hidden under a printed sheet of plastic or other decorative element. The decorative elementmay be affixed to the card through a variety of processes suchasplaten lamination, contact adhesive, curableadhesives, or "pushfit" or any joiningmethodknown to the art. RF shielding is often required in the cavity, further complicating card assembly whilemaintaining the desired aesthetic of the card.

[0004] Someof these requiredmachininggeometries removesignificant amountsofmetal or leaveslits or holes through the card which weaken its strength and are undesirable aesthetically. In order to strengthen the card and provide a desirable surface, overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the cards and strengthen the card geometries. Furthermore, this development has improved RF performance over existing designs because it enablesmoremetal removal in critical RF transmission and receiving areaswhilemaintaining structural rigidity and desired appearance. SUMMARY OF THE INVENTION

[0005] Aspects of the invention relate to transaction devices, processes for manufacturing transaction devices, as well as transaction devices produced according to the disclosed processes.

[0006] One aspect of the invention is a transaction device comprising a metal layer having a front surface, a back surface, a periphery, an opening in the metal layer, a transponder chip module disposed in the opening, and a booster antenna in communication with the transponder chip module. The transponder chip module and the booster antenna are components in a circuit configured for wireless communication with a device reader. The metal layer has one or more discontinuities, eachdiscontinuity comprising a gap in themetal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. Themetal layer is not part of the booster antenna or a component in the circuit.

[0007] A non-metal molding material may be disposed in the one or more discontinuities in the metal layer. In some embodiments, a reinforcing layer is disposed over themetal layer, such as a layer comprising fiberglass,more particularly a fiber-reinforced epoxy laminate material. A fiber-reinforced epoxy laminate material layer may be disposed on at least one of the front surface and the back surface of the metal layer, and in some embodiment, the metal layer is sandwiched between opposite fiber-reinforced epoxy laminate material layers.

[0008] Another aspect of the invention comprises a transaction device having a metal layer with one or more discontinuities in the metal layer, a first non-metal, reinforcing layer disposed over the front surface of the metal layer, a booster antenna disposed over the back surface of themetal layer, a second non-metal, reinforcing layer disposed over the back surface of the metal layer, an opening in the metal layer extending through the first non-metal, reinforcing layer, and a transponder chip module disposed in the opening. The booster antenna comprises a plurality of metallizations electrically isolated from themetal layer. The transponder chip module is in communication with the booster antenna and together with the booster antenna comprises a payment circuit configured for wireless communication with a device reader. The first non-metal layer and the second non-metal layer each may comprise fiber-reinforced epoxy laminate material.

[0009] The one or more discontinuities may include a discontinuity extending from the periphery to the opening in the metal layer, a discontinuity extending from theperiphery to anendpoint not in the opening in themetal layer, a discontinuity extending froman intersection with the first discontinuity to and endpoint that is neither in the opening nor at the periphery, or acombination thereof. Themetal layermaybeelectrically isolated from thepayment circuit or part of thepaymentcircuit.

[0010] Another aspect of the invention comprises a transaction device comprising ametal layer, an opening in themetal 2 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 layer extending from the metal layer to a top surface of the device, one or more discontinuities in the metal layer, a back fiber-reinforced epoxy laminatematerial layer disposed over the back surface of themetal layer, a booster antenna, and a transponder chipmoduledisposed in theopeningandhavinga topsurfaceaccessible from the topsurfaceof thedevice.At least one discontinuity extends between the periphery of the metal layer and the opening in the metal layer. The transponder chip module in communication with the booster antenna together comprise a payment circuit configured forwireless communicationwith adevice reader. Thebooster antennamaycomprise themetal layer, or itmaybeseparate from the metal layer, with the metal layer electrically isolated from the payment circuit. A front fiber-reinforced epoxy laminatematerial layermaybe disposed over the front side of themetal layer. The front and / or back fiber-reinforced epoxy laminate material layers may each be bonded directly to the metal layer by the epoxy of the respective fiber-reinforced epoxy laminate material layers. In embodiments in which the metal layer is electrically isolated from the payment circuit and the booster antenna, the booster antennamay comprise a plurality ofmetallizations on or embedded in the back fiber- reinforced epoxy laminate material layer. In embodiments in which the plurality of metallizations are disposed on a back surfaceof the back fiber-reinforcedepoxy laminatematerial layer, the devicemay include anon-metal layer disposedover the plurality of metallizations. The respective fiber-reinforced epoxy laminate material layers may be disposed over the front side andback side of themetal layer as discrete layers bonded to themetal layer by an adhesive other than the epoxy of the respective fiber-reinforcedepoxy laminatematerial layers. In someembodiments, at least a portion of the plurality of booster antenna metallizations may be disposed on a front surface of the back fiber-reinforced epoxy laminate material layer and separated from the metal layer by a non-metal layer disposed between the fiber-reinforced epoxy laminate material layer and the metal layer.

[0011] Other aspects of the invention comprise processes for manufacturing transaction devices as described herein. One such process comprises providing a metal layer, forming one or more discontinuities in the metal layer, disposing a booster antennaover thebacksurfaceof themetal layer, disposingafirst fiberglass layerover the front surfaceof themetal layer, disposing a second fiberglass layer over the back surface of the metal layer, forming an opening in the metal layer extending through the first fiberglass layer to a top surface of the device, and disposing a transponder chip module in the opening. The opening in the metal layer may be created in the same step as the discontinuities in the metal layer.

[0012] The process may include disposing the booster antenna layer over the back surface of the metal layer with metallizations of the booster antenna electrically isolated from the metal layer, and configuring the device with the metal layer not included in thepayment circuit. Thestepof disposing thebooster antennaover theback surfaceof themetal layer may comprise forming the plurality of metallizations on or embedded in the second fiberglass layer, and optionally, disposing an additional non-metal layer over the metallizations.

[0013] In one process embodiment, the steps of disposing the first and second fiberglass layers over the front and back surfaces of themetal layer comprise casting the first and second fiberglass layerswith epoxy to formfirst and second fiber- reinforced epoxy laminate material layers bonded directly to the metal layer.

[0014] In another process embodiment, the steps of disposing the first and second fiberglass layers over the front and back surfaces of themetal layer comprise attaching a first cured fiber-reinforced epoxy laminatematerial layer to the front surface of themetal layerwith a first adhesive layer and attaching a second cured fiber-reinforced epoxy laminatematerial layer to the back surface of the metal layer with a second adhesive layer. In embodiment that include forming the booster antenna over the back surface of the metal layer, the plurality of metallizations may be formed on or embedded in the second cured fiber-reinforced epoxy laminate material layer. One such process includes disposing ametal layer over the second cured fiber-reinforced epoxy laminate material layer, and etching away a portion of the metal layer to leave the metallizations. In a process including forming a plurality of metallizations on an inside surface of the second cured fiber- reinforced epoxy laminate material layer facing the metal layer, the second adhesive layer may includes a non-metal substrate layer. in a process including forming the plurality of metallizations on an outside surface of the second cured fiber-reinforced epoxy laminatematerial layer facing away from themetal layer, the processmay include disposing a non- metal layer over the outside surface of the second cured fiber-reinforced epoxy laminate material and the plurality of metallizations disposed thereon.

[0015] In another aspect of the invention, a process for manufacturing a transaction device comprises providing a premade laminatecomprisedofametal layer, a first curedfiber-reinforcedepoxy laminate layerbonded to the front surface of themetal layer, and a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of themetal layer. One ormore discontinuities are formed in themetal layer of the premade laminate, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer. Each of the one or more discontinuities also extending through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer. A booster antenna is disposed over an outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber- reinforced epoxy laminate layer. An opening in themetal layer is formed extending through the first fiberglass layer to a top surface of the device, and a transponder chipmodule is disposed in the opening. The booster antennamay be created by forming a plurality ofmetallizations on the outer surface of or embeddedwithin one of the first cured fiber-reinforced epoxy laminate layer or thesecondcuredfiber-reinforcedepoxy laminate layer.Theprocessmay further includedisposinganon- 3 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 metal layer over the outside surface of the respective cured fiber-reinforced epoxy laminate material and the plurality of metallizations disposed thereon. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The invention is best understood from the following detailed description when read in connection with the accompanying drawings, with like elements having the same reference numerals. When a plurality of similar elements is present, a single reference numeral may be assigned to the plurality of similar elements with a small letter designation referring to specific elements.When referring to the elements collectively or to a non-specific one ormore of the elements, the small letter designationmay be dropped. This emphasizes that according to common practice, the various features of the drawings are not drawn to scale unless otherwise indicated. On the contrary, the dimensions of the various features may be expanded or reduced for clarity. Included in the drawings are the following figures: FIG.1 isa flowdiagramof selectedstepsof aprocess formanufacturinga transactioncard inaccordancewithaspects of the present invention; FIG. 2A is a photograph depicting an electronic component before overmolding in accordance with aspects of the present invention; FIG. 2B is a photograph depicting an electronic component after overmolding in accordance with aspects of the present invention; FIG.3A isaschematic illustrationof the frontof a transactioncardprior to insertionmolding inaccordancewithaspects of the present invention; FIG. 3B is a schematic illustrationof the rear of a transaction card prior to insertionmolding in accordancewith aspects of the present invention; FIG.3C isaschematic illustrationof the frontof a transactioncardafter to insertionmolding inaccordancewithaspects of the present invention; and FIG. 3D is a schematic illustrationof the rear of a transactioncard after to insertionmolding inaccordancewith aspects of the present invention. FIGS. 4A and 4B are schematic illustrations of selected steps of an over molding process for manufacturing a transaction card in accordance with aspects of the present invention. FIG. 5A is an image depicting the front side of an exemplary card having an encapsulated antenna surrounding the payment module. FIG. 5B is an image depicting the back side of the exemplary card of FIG. 5A. FIG. 5C is an perspective view of an isolated exemplary encapsulated antenna module prior to insertion of the payment module therein. FIG.6A isaschematic illustrationplanviewof anexemplary contactlessRFIDdevice inaccordancewithoneaspect of the invention, prior to encapsulating a chip layer within the opening in the frame. FIG. 6B is a schematic illustration view of an exemplary contactless RFID device of FIG. 6A in cross-section through line 6B‑6B, after encapsulating the chip layer. FIG. 6C is a schematic illustration end view of the exemplary contactless RFID device of FIG. 6B. FIG. 7A is a schematic illustration plan view of an exemplary contactless RFID device in accordance with another aspect of the invention, prior to encapsulating a chip layer within the opening in the frame. FIG. 7B is a schematic illustration view of the exemplary contactless RFID device of FIG. 7A in cross-section through line 7B‑7B, after encapsulating the chip layer. FIG. 7C is a schematic illustration end view of the exemplary contactless RFID device of FIG. 7B. FIG. 8A is a schematic illustration plan view of an exemplary DI RFID device in accordancewith another aspect of the invention, prior to encapsulating a chip layer within the opening in the frame. FIG.8B isaschematic illustrationviewof theexemplaryDIRFIDdeviceofFIG.8A incross-section through line8B‑8B, after encapsulating the chip layer. FIG. 8C is a schematic illustration end view of the exemplary DI RFID device of FIG. 8B. FIG. 9A is a schematic plan view illustration of a front side of an exemplary transaction card comprising a plurality of discontinuities. FIG. 9B is a schematic plan view illustration of a back side of the exemplary transaction card of FIG. 9A. FIG. 9C is a schematic cross-sectional view illustration of the exemplary transaction card of FIG. 9A. FIG.9D isaschematic cross-sectional view illustrationofanother exemplary transactioncard, formed fromapremade FR‑4 / metal laminate. FIG. 9E is a is a schematic cross sectional view illustration of a portion of a transaction card comprising discrete FR‑4 layers adhesively attached to the metal layer, with a metallization disposed on an inside surface of one of the FR‑4 4 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 layers. FIG. 9F is a schematic cross-sectional view illustration of a portion of a transaction card comprising FR‑4 layers directly bonded to themetal layer, with ametallization etchedonto anoutside surfaceof oneof theFR‑4 layers, andan additional layer covering the metallization. FIG. 10 depicts an exemplary process for making a transaction card. DETAILED DESCRIPTION OF THE INVENTION

[0017] Aspects of the invention relate to transaction cards, processes for manufacturing transaction cards, as well as transaction cards produced according to the disclosed methods.

[0018] In FIG. 1, a flow diagram depicting selected steps of a process 100 for producing a transaction card according to aspects of the invention is shown. It should be noted that, with respect to the processes described herein, it will be understood from the description herein that one or more steps may be omitted and / or performed out of the described sequence of the process while still achieving the desired result.

[0019] In step 110, an opening is formed in the card body of the transaction card. The opening may be sized to accommodate one or more molded electronic components. The opening may extend partially (thereby forming, e.g., a pocket) or completely (thereby forming a hole) through the card body. In some embodiments, a hole formed through the card body may then be fully or partially covered on one side, such as with an applied material, such as an adhesively bonded plastic material, such as element 307c, shown in FIG. 3D. As depicted in FIG. 3D, element 307c overlaps an area surrounding the hole, to forma pocket bounded on the periphery by the edges of the hole in the card body and on a bottom end by the applied material 307c. The applied material may be a material that is the same or that is compatible with the molded material later to be filled in the pocket. In some embodiments, as shown in FIG. 3D, the applied material 307c overlapping the area surrounding the hole in the card body, may have a through-hole 308 having an area smaller than the hole in the card body, so as to provide a "ledge" 309 of applied material inside the periphery of the hole in the card body.

[0020] The card body of the present invention may be comprised of any suitable material including any suitable metal, such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or anyalloywhich gives the cardmost of its body (structure) andweight. Additionally, or alternatively, the cardbodydescribed herein may be comprised of any suitable polymeric (e.g., polycarbonate, polyester) or inorganic (e.g., glass, ceramic) material, or any combination of any of the foregoing materials.

[0021] In step 120, an electronic component is inserted into the opening of the card body.

[0022] In step 130, a molding material is molded about the electronic component. It should be noted that the order of steps 120 and 130 may be varied depending on the particular application.

[0023] In one embodiment, step 130 includes an overmolding process. During the overmolding process, a molding material is molded about (and typically over) an electronic component such that the molding material covers at least a portion of a surface of the electronic component. Overmolding of electronic components may be accomplished using conventional and commercially available equipment, such as the ENGLE insert (Engel Austria GmbH, Austria) and the Cavist MoldManTM (Reno, NV).

[0024] An electronic component 201 is shown before (in FIG. 2A) and after (in FIG. 2B) an overmolding process. While the overmolded component 200 is depicted as having molding material 205 completely covering electronic component 201, one of ordinary skill in the art will understand that varying degrees of overmolding can achieve the desired structural rigidity, functionality, andaestheticof the transactioncard. Inparticular, as shown inFIGS.2Aand2B,electrical contacts, in the form of wires 210 and 220 connected to component 200, each have an unencapsulated end that protrudes from the overmolding to permit electrical connection to the component. It should be understood, that, although depicted aswires in FIGS. 2A and 2B, the electrical contacts or other unencapsulated portions not limited to electrical contacts, may take any shape or form. It should be further understood that in certain embodiments, such as embodiments in which a technically desirable degree of coupling between unencapsulated and encapsulated components can be made through the encapsulation layer, the component may be completely encapsulated.

[0025] Returning to FIG. 1, where an overmolding process is employed, step 130may be performed prior to performing step 120. That is, the electronic component may be separately overmolded prior to insertion into the opening of the card body. Prior to the insertion of the overmolded electronic component, the overmolded componentmay be furthermachined to remove excess molding material and / or to create features in the molding material which may be used to secure the overmolded electronic component into the opening of the card body. For example, with reference to FIG. 2B, a lip may be machined into molding material 205 so that overmolded component 200 may be secured into the opening of a card body.

[0026] Alternatively, overmolding in step 130 may be performed after performing step 120. In this embodiment, the electronic component is inserted into theopeningof the card body.Subsequently,moldingmaterial is forced to flow into the opening of the card body and form over one ormore exposed surfaces, including at least the top surface, of the electronic component. One of ordinary skill in the art will understand that when molding material flows into the opening of the card body, the card body material may be selected so as to withstand the pressure and heat associated with overmolding 5 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 without substantially deforming.

[0027] Where an insert molding process is employed, step 130 may be performed before performing step 120. Conventional insert molding processes include inserting the electronic component into a mold, followed by the injection of moldingmaterial into themold cavity to form themolded electronic component. Themolded electronic componentmay be fully or partially encapsulated by molding material following an insert molding process.

[0028] Turning to FIGs 3A-D, schematic illustrations of selected steps of an insert molding process for manufacturing a transaction card in accordance with aspects of the present invention are depicted. In the figures, areas 305 and 308 in FIGS. 3A‑3D represent holes through the cards. Area 307a,b in FIG. 3A and area 307c in FIGS. 3B and 3D represent partially covered holes (pockets) in the card body for the molding material to bind and find purchase. Fig. 3B depicts the completedmoldedcard inwhich the insertmoldedmaterial ofmoldedcomponent310 is visible.Although the insertmolded material is shown contrastingwith the background cardmaterials for purposes of illustration, themolded component is not limited to any particular degree of contrast in coloration or shading relative to the background card, andmay comprise the same materials as the front of the card or may comprise materials selected to have a coloration or shading selected to match the coloration or shading of the front side of the card so as tominimize its visibility in a completed card. For example, in a card body comprising materials different than the molding materials (e.g. a metal or ceramic body and thermoplastic resin molding materials), the coloration of the molding materials may be selected have a color and tone that matches as closely as possible the material of the body, including using constituents in the molding materials that are the same or similar to the card bodymaterials (e.g. inclusion of a powderedmetal in themoldingmaterials that is the sameas themetal of the body). In other embodiments,moldingmaterials that contrast with the body of the cardmay beused. FIG. 3Adepicts the front sideof a transactioncard300 includinganopening305whichextendsentirely throughacardbody302.Aplurality of securing features 307a, b provide areas to which the molding material can adhere or otherwise bind. In the depicted embodiment, securing features 307a,b are blind holes (e.g., pockets). A similar set of securing features 307c are found on the opposing rear side of transaction card 300 in FIG. 3B. The geometries of opening 305 and securing features 307a, b, c were selected to improve the RF performance of the metal transaction card 300. Securing features 307a, b, c may comprise a material that is the same or otherwise compatible with the molding material, and different than the card body material, such that the molding material and the materials of the securing features melt or otherwise join together with a bond that is relatively stronger than any bond created between the molding material and the card body.

[0029] FIG. 3C depicts the front side of the transaction card 300 after an insert molded electronic component 310 has been placed into opening 305. In the depicted embodiment, molded electronic component 310 would be visible on transaction card 300. The geometry of molded electronic component 310 permits molded electronic component 310 to become secured to transaction card 300 through a biasing action created by securing features 307a,b,c. Alternatively, or additionally, molded electronic component 310 may be adhered to opening 305 of transaction card 300 using an epoxy resin such as Bisphenol, Novolac, Aliphatic, and Glycidylamine.

[0030] Excessmoldingmaterialmay be removed frommolded electronic component 310 (by, e.g.,milling ormachining) to incorporate additional electronic components or other desired components.

[0031] FIG. 4A depicts an exemplary overmolding process in which a pocket 403 is machined into card body 402 for receiving an electronic component 405. In the depicted embodiment electronic component 405 is a printed circuit board (PCB), specifically anRFIDmodule.Whilepocket 403 isdepictedas traversingasubstantial portionof the rear faceof card body 402, one of ordinary skill in the art will understand the smaller openings of varying geometries may be suitable depending upon the electronic component to be incorporated.

[0032] Pocket 403 may be sized to receive and fix into position electronic component 405, or it may be sized to permit excess molding material between the inner lip of pocket 403 and the outer edge of electronic component 405. Electronic component 405 may additionally, or alternatively, be adhered to pocket 403 using an epoxy as described above.

[0033] Overmolded faceplate 410 creates the back face of transaction card 400. Overmolded faceplate 410 may completely or partially encapsulate electronic component 405. Overmolded faceplate 410 may be prepared separately and then attached to pocket 403 (using, e.g., a suitable epoxy as described above), or it may be formed by overmolding layers of molding material directly into pocket 403.

[0034] In an exemplary embodiment, themoldingmaterial used in overmolded faceplate is a plasticmaterial whichmay enhance RF transmission where transaction card 400 is comprised of a metal or other RF-interfering material.

[0035] As is known in the art, transaction cards with RFID chip modules for inductively coupling with a card reader of a point of sale (POS) terminal also typically have an embedded booster antenna structure configured that inductively couples theembeddedantenna to theRFIDchipmodule,with thecoupledantenna,RFIDmodule, andcard reader forming a circuit for transmitting information from the card to the card reader. Thus, in an exemplary embodiment inwhich theRFID module is the encapsulated or partially encapsulated component (or one of a plurality of electronic components that are processed as described herein), the antenna structure may be provided in any number of ways. In one embodiment, the antennastructuremaybeembedded ina layer that isapplied to thecardafter themoldingprocessesdescribedherein.The antenna-bearing layer may be laminated to the card using a non-heat process (such as with an adhesive), a heat lamination process conducted at a temperature, pressure, and duration that does not re-melt, deform, or otherwise 6 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 detrimentally disturb the molding over the electronic component(s), or a backing sheet (comprising metal or some other material not affected by the heat lamination) may be provided during such a heat lamination step to prevent any re-melt or deformation of themolding from protruding from the opposite surface upon which the lamination step is being performed.

[0036] In another embodiment, the molding step may comprise an overmolding step that covers not only the electronic component as described herein, but also at least the portion of the card surface into which the antenna structure is to be later disposed. For example, a flood overmolding step may be conducted that, in addition to encapsulating or partially encapsulating theRFIDmodule, also coversat least oneentire surface (typically back, but alsoor insteadmaybe the front) of the card in a layer having a desired thickness. The antennamay then be embedded, such as using ultrasonic processes known in the art, into that overmolded layer. Any content to be printed on the surface of the cardmay also be printed on the overmolded layer surface, or an additional printing layer may be attached, such as via adhesive or lamination. In other embodiments, the antennamay be printed on themolding surface, or applied as part of another layer that is attached over the molded surface, such as with adhesive or by lamination. The foregoing are non-limiting examples, and it should be understood that infinite possibilities exist for downstream processing of the resulting product of the processes described herein for providingamoldedelectronic component inacard, andcertainaspectsof the inventionarenot limited inanyway by later process steps.

[0037] In another embodiment, illustrated in FIGS. 5A‑5C, a booster antenna 502 for inductively coupling with the antennaof apaymentmodulemay take the formof anannularmetal frame that nearly surrounds thepaymentmodule (e.g. a dual interface (DI) RFID chip). As depicted in FIGS. 5A‑5C, the antenna has a discontinuity or slit 506 that extends from an inner edge to an outer edge of the annular antenna. Such an antenna has been generally described and characterized as an "amplifier" in United States Patent No. 8,608,082 (’082 Patent) to Le Garrec et al. and a "coupling frame" in United States Patent No. 9,812,782 (and others), to Finn et al., incorporated herein by reference. As described in the foregoing, and in U.S. Pat. App. Ser, No. 15 / 928,813 (the ’813Application), filedMarch 22, 2018, titledDICAPACITIVEEMBEDDED METALCARD, assigned to the common assignee of the present invention, and incorporated herein by reference, ametal card body itself may serve as such an antenna or amplifier, with a discontinuity (e.g. 504, as depicted in FIGS. 5A and 5B) extending from the periphery of the card to the pocket in which the payment module is mounted. The discontinuity may haveany geometry, including but not limited to the stepped shapedepicted inFIGS. 5Aand5B, anygeometry described in the ’813 Application and related applications, or any geometry disclosed in the foregoing references.

[0038] The ’813 Application also discloses reinforcing a card having discontinuities using a self-supporting layer on the back of the card, such as an FR‑4 material (a thermoset laminate made with epoxy resin and woven fiberglass) or polyimide. Printed layers, such as for the various indicia, magnetic stripe, etc., may be assembled with the FR‑4 layer or printed directly on the FR‑4 layer. For example, the ’813 Application describes one embodiment in which a relatively thin (e.g. 0.009 inches thick) stainless steel substrate is usedwith anFR‑4backing layer, and another embodiment comprising an 18 mil stainless steel layer having a 4 mil FR‑4 layer attached to the back side of the steel layer with a 2 mil adhesive layer, a5mil printedsheeton thebackof theFR‑4 layer (attachedviaanother2mil adhesive layer), anda2mil overlay layer comprising the magnetic stripe laminated to the back side of the print sheet layer. The ’813 Application discloses that referable self-supporting (e.g. FR‑4) layers have a rigidity of 80MPa·m3 to 40 GPa·m3.

[0039] In some embodiments, described in more detail herein later, a booster antenna may also be provided. In some embodiments, particularly those containing a booster antenna, the metal card body may be isolated from the payment circuit for communicating with a card reader, which circuit contains the transponder module and booster antenna. In such embodiments, the payment circuit may not serve as an antenna or amplifier. In other embodiments, the metal card body mayserve togetherwith the booster antennaaspart of thepayment circuit containing the transpondermodule. In still other embodiments, the metal card bodymay be part of a different circuit that harvests energy from the card reader, but may or may not actually communicate with the card reader, such as for example as discussed in more detail in U.S. Application Ser. No. 16 / 751,285, titled METAL, CERAMIC, OR CERAMIC-COATED TRANSACTION CARD WITH WINDOW OR WINDOW PATTERN AND OPTIONAL BACKLIGHTING, filed January 24, 2020, incorporated herein by reference.

[0040] As shown in FIG. 5C,metal antenna 502 is surrounded by the encapsulatingmaterials to form an outer surround 520andan inner region522,and theencapsulant alsofills theslit 506connecting the inner region to theouter surround.For illustrative purposes, the antenna is depicted in FIG. 5C without encapsulating materials covering it in the Z direction, so that the antenna remains visible in the depiction. In embodiments in which ametal body 500 of the card also is harnessed for signal amplification, the encapsulating material may also fills the slit 504 in the metal body. It should be understood, however, that slit 504may not be present in all embodiments. It should further be understood that the card bodymay have more than one slit. Exemplary alternative additional slit locations 554, 564, 574 are depicted in dashed lines. For example, in one embodiment, the combination of slits 504 and 554 intersecting with the chip pocket may form a bisection along the full lengthof thecard, or thecombinationof slits 564and574 intersectingwith thechippocketmay together formabisection along the fullwidthof thecard. It shouldbenotedhere that the term "bisect" is intended tomean that the linedivides thecard into two sections, but those sections are not necessarily equal in size. Although depicted generally centered on the antenna aligned to the same line on opposite sides of the antenna, the combined slits may have any relationship to the antenna and to each other, including a relationship wherein the slits on different sides of the antenna lie on parallel or non- 7 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 parallel lines, relationships in which the slits connect to adjacent rather than opposite sides of the antenna, relationships wherein the slits are not parallel to an edge of the card, or relationships wherein one or both of the slits are non-linear. For embodiments in which the card is bisected, the remaining pieces of the card may be bonded together by overmolding or other nonconductive adhesives or fillers. Although a preferred embodiment includes only a single bisection of the card body into two discrete portions, a plurality of body slits may divide the card into more than two discrete portions. Bisected arrangements, generally, may minimize eddy currents.

[0041] Thus, antenna502asencapsulatedasdepicted inFIG. 5Cdefinesametal containingplug550,whichmayeither be created in its entirety and then inserted inanopening in the cardbody, ormaybecreated in situ in theopening in the card body, suchasbyovermolding. After the plug is inserted in thepocket ormolded in situ,apocketmaybe created in the inner region 522 of the plug (e.g. by milling or any process known in the art) to receive the payment module. Among the advantages of such a design is that the metal card body may be formed with a through hole for receiving plug 550. Preferably, the through-holemay be formed bymethods other thanmilling, such as stamping, etching, laser cutting, or the like. Or, the card bodymay be formed initially with a through-hole, whichmay be particularly advantageous for a card body that is ceramic, cast metal, or metal-doped epoxy (such as is described in PCTApplication Ser. No . PCT / US2019 / 50592, filed 9 / 11 / 2019, claiming priority from U.S. Provisional Application Ser. No. 62 / 730,282, filed 9 / 12 / 2018, titled METAL- DOPED EPOXY RESIN TRANSACTION CARD AND PROCESS FOR MANUFACTURE, assigned to the common assignee of the present application, and incorporated herein by reference). Then, the milling step to create the pocket to receive thepaymentmodule needonly beperformed in a non-metal encapsulatingmaterial, which is easier and takes less time tomill thanmetal. As is known in the art, the pocket for receiving the paymentmodulemay be a stepped hole having a first, relatively greater areaon the front surfaceof the card, andasecond, relatively lesser areaon thebacksideof the card. By enlarging the area of the pocket in the card body intowhich the paymentmodule is inserted, the overall length of the slit 504 that must be cut into the metal card body (in embodiments in which the slit is present), can beminimized, also saving manufacturing time. The foregoing improvements foster increased output and efficiency.

[0042] In some embodiments, it may not be necessary or desired for the card body to serve as part of the booster antenna. In such embodiments, the opening in the card body may be relatively larger than as depicted in FIGS. 5A‑5C, such that outer surround 520has awidthWseparating themetal of the antenna 502 in the plug 550 from the card body that is operable to acceptably minimize electrical / magnetic interference from the card body. The geometry of the plug 550 in such embodimentsmay bemore rectangular, with the innermost edge 560 of the plug positionedmore towards the center of the card body 500 to guide some of the RF signal towards the center of the card, while the location of the DI payment module remains essentially unchanged as depicted, to conform to the relevant standard for the position of the contacts.

[0043] Although described herein in connection with a metal card body, similar geometries may be employed in non- metal cards. In addition to the methods of manufacture described herein, which are suitable for card bodies of any materials (althoughparticularlyadvantageous formetal, ceramic, andceramic-coated-metal bodies), antenna502maybe deployed in a plastic (e.g. PVC) card body, for example, by ultrasonically (or otherwise) embedding the metal component into the plastic as an inlaywithin the card, thus replacing copperwire or etched antenna inlays. The antenna geometry 502 as depicted can be described as a planar, annular member having a nearly closed periphery, with a slit 506 that connects the inner periphery with the outer periphery of the annulus. Although depicted in the exemplary embodiment as a single member, the antenna structure is not so limited and may comprise more than one member. By contrast, copper wire or etched antenna inlays typically create a spiral pattern of lines or wires with spaces radially separating the whorls of the spiral.

[0044] Oneof ordinary skill in theart will understand that suitablemoldingmaterialswill dependupon the type ofmolding process used in step 130. For example, where insert or overmolding is employed, thermoplastic materials such as TechnoMelt® meltable adhesive (Henkel), which may include one or more materials from the group consisting of: EVA, metallocene polyalphaolefins, polyolefins including atactic polyalphaolefins, block copolymers, polyurethane hot melts, epoxy, andpolyamidesand thermosetmaterials suchasfiberglass reinforcedpolyester, polyurethane,bakelite, duroplast, melamine,Diallyl-phthalate, andpolyimidemaybeused.Oneof ordinary skill in the art will understand that othermaterials which can be rendered flowable in an overmolding or insertmolding processmay be used aswell including, but not limited to, powdered metals such as Rhodium, Aluminum, Titanium, Magnesium, Copper, Brass, Nickel, Monel, Inconel, Steels and alloys of the above, including epoxy containing powdered metals including but not limited to any of the foregoing. Epoxies containing ceramic materials may also be used.

[0045] In another embodiment, the molding material used in the overmolding or insert molding process is a plastic material having a molding temperature range of approximately 150 - 300 C.

[0046] FIGS. 6A‑6C depict a particular embodiment 600 of a metal RFID device comprising a body in the form of metal frame 610 having an outer periphery 611, an opening in the card body that defines an inner periphery 612 of the metal frame. At least one body discontinuity 620 extends from the outer periphery to the inner periphery of the metal frame. At least one electronic component is disposed in the opening and layers of non-conductive material 640, 642 are disposed about the electronic component. The electronic component comprises an RFID chip 632 disposed in a substrate 634 with an antenna 636, also disposed in the substrate, connected to the RFID chip. Collectively, the RFID chip, antenna, and 8 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 substrate may be referred to as an RFID module. Thus, RFID device 600 comprises a metal frame 610 having opposite surfaces 614, 615, outer periphery 611 andan opening in themetal framedefining inner periphery 612 and extending from at least one of the opposite surfaces 614, 615 for a depth. As depicted in FIG. 6A‑6C, the opening has a depth coexistence with a thickness Tof the metal frame from upper surface 614 to lower surface 615. Chip layer 630 -‑ comprising a non- conductive substrate 634,RFID transponder chip 632mounted to substrate 634, andmodule antenna636 in the substrate connected to theRFID transponderchip -- isdisposed inside theopening.Themoduleantennamaybeetchedormayhave any construction known in the art for being disposed in the substrate. One or more fill layers 640, 642may be disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame. One or more layers 650, 652 may be laminated over at least one surface of themetal frame. A through-hole 660 extending between the top and bottom surfaces of the device, as depicted in FIG. 6B between the top surface of the top layer 650 and the bottom surface of the bottom layer 652, preferably aligned over a portion of the device located between the inner 611 and outer surfaces 612 of themetal layer. Although shown in FIGS. 6A‑6Cwith both antenna 636 in the chip layer and discontinuity 620 in themetal frame, it should be understood that some components may have only one or the other, but not both, whereas other embodiments may have both, as depicted.

[0047] One process of making device 600may comprise affixing layer 652 to the bottom surface 615 of themetal frame 610prior to stacking layers642, 630and640 in theopening, and thendisposing layer650over theopening, and laminating the stack such that layers 640and642 envelop chip layer 630. Themetal framemay be constructed by cutting the opening in a metal blank, by molding the metal in the desired shape, or by make slicing cross sections from an extruded bar. Althoughdepictedashavingdimensions that extend to the inner periphery 612ofmetal frame610, it shouldbeunderstood that chip layer 630may have a substantially smaller footprint, such that layers 640 and 642 completely envelop all sides of chip layer 630. Furthermore, it should be understood that an intermediate layer (not shown) of non-conductive material may be disposed between layers 640 and 642, with a cutout for accommodating the periphery of substrate 634, in constructions in which the outer periphery of substrate 634 is less than the inner periphery 612 of the frame.

[0048] Inanotherembodiment, depicted inFIGS.7A‑7C,RFIDdevice700comprisesametal frame710havingopposite surfaces 714, 715, outer periphery 711 andan opening in themetal framedefining inner periphery 712 and extending from surfaces 714 for a depth D. As depicted in FIG. 7A‑7C, the opening has a depth D that is less than the thickness Tof the metal frame from upper surface 714 to lower surface 715. Chip layer 730 -‑ comprising substrate 734, RFID transponder chip 732mounted to substrate 734, andmodule antenna 736 in the substrate connected to theRFID transponder chip -‑ is disposed inside the opening. Thus, the opening comprises a pocket having a bottom and a ferrite layer 742 disposed between the chip layer and thepocket bottomandfill layer 740 is disposed in thepocket between the chip layer 730and the top surface 714 of themetal frame. Layer 750 is laminated over top surface 714 of metal frame 710 and over fill layer 740.

[0049] Oneprocessofmakingdevice700maycomprisemaking thepocket opening inametal blank (bymilling, etching, laser) to define metal frame 710, stacking layers 742, 730 and 740 in the opening, disposing layer 750 over the opening, and laminating the stacked components together. As depicted in FIGS. 7A‑7C, RFID device 700 has a through-hole 760 extending between the top and bottom surfaces of the device, between the top surface of the top layer 750 and the bottom 715 surface of themetal layer as depicted in FIG. 7A, preferably aligned in the portion of the device between the inner 711 andouter surfaces 712of themetal layer. As further depicted inFIG. 7B (not shown inFIGS. 7Aor 7C to reduce clutter, and also applicable to the designsof FIGS. 6A‑6CandFIGS. 8A‑8C, but not shown), hole 760maybeparticularlywell suited to receive amember 780, such as a component of an apparatus configured to hold one or more keys, such as a key ring or a key chain. Thus, devices 600 and 700 may be a smaller size than that typically associated with a credit card, and more befitting of a size suitable to serve as a key fob or key tag.

[0050] While FIGS. 6A‑6C and 7A‑7C depict contactless-only RFID devices, it should be understood, that the RFID device in any of the foregoing may be a dual interface device capable of interfacing with both contactless and contact- based readers. Thus, as depicted in in FIGs. 8A‑8C, RFID device 800 comprises a metal frame 810 having opposite surfaces 814, 815, outer periphery 811 andan opening in themetal framedefining inner periphery 812 and extending from surface 814 for a depth.Chip layer 830 -‑ comprising substrate 834,RFID transponder chip 832mounted to substrate 834, andmodule antenna 836 in the substrate connected to theRFID transponder chip -‑ is disposed inside the opening. In the embodiment depicted in FIG. 8B in which the opening comprises a pocket having a bottom, a ferrite layer 842 is disposed between the chip layer and the pocket bottom, with fill layer 840 disposed in the pocket between the chip layer 830 and the topsurface814of themetal frame.Layer850 is laminatedover topsurface814ofmetal frame810andover fill layer840.DI chip, because it has contact-based functionality, extends to the top surface of upper layer 850.

[0051] Oneprocessofmakingdevice800maycomprisemaking thepocket opening inametal blank (bymilling, etching, laser) to define metal frame 810, stacking layers 842, 830 and 840 (having a cutout to accommodate chip 832) in the opening, disposing layer 850 (with a cutout to accommodate chip 832) over the opening, and laminating the stacked components together. Inanother embodiment, onlyantenna836maybepresent onsubstrate830when thestackof layers 842, 830, 840 and 850 are laminated together, and then a hole for receiving chip 832 is created and chip 832 is inserted. A subsequent laminationstepmaybeperformedat a temperaturesuitable to reflow themeltable layers toencapsulateall but the top contact surface of chip 832. 9 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55

[0052] Although depicted as a pocket with a depth less than the thickness of the metal frame in FIG 8B, it should be understood that DI chip (or contact only) designs may also be suitable for use with designs in which the opening extends the full thicknessof themetal frame, suchas theembodiment depicted inFIGS. 6A‑6C.Furthermore, permutationsof such embodiments include thosewithonly anantenna836, thosewithanantenna836andaslit similar to slit 620, and thosewith both an antenna and a slit.

[0053] To maintain functionality in standard card-readers meant for credit-card sized payment devices, the orientation (with short edge of the contact pad of chip 832 parallel to leading edge 870 of the device) of DI chip, location (left of center) of DI chip 832, and the dimensions of metal frame 810, are identical to that of the left-most portion of a standard DI credit card (viewed from the front or top surfaceof the card). Such a construction permits the device to be inserted in the direction of arrow P into a contact-based card reader, oriented leading edge 870 first, making device 800 indistinguishable from a standard credit card from the perspective of the card reader.

[0054] While none of the embodiments 600, 700, 800 are limited to any particular location for the through-hole for accommodating a component of a key carrier, it should be understood that in DI (or contact-only) devices, the hole should be located where it does not cause interferencewith insertion in the card reader.While a location in the upper left or upper right hand corners of the device (e.g. where hole 860a is shown in FIG. 8A), may be acceptable, the overall dimensions of thedevice in the card insertion directionmaybe reduced in constructions inwhich thehole is locatedonanappendage874 that protrudes from the trailing edge 872 of the card, such as in the location where hole 860b is depicted in FIG. 8A. Although semicircular in geometry as depicted in FIG. 8A, appendage 874may have any geometry desired. While only a single through-hole may be needed per device, some devices may have more than one. Although depicted with through- holes 660, 760, 860a, 860b in particular locations in the drawings, the hole may be in any location that does not interfere with the functional elements of the device (or intendedusesof the device, e.g., for use in a card reader, for contact inclusive modules). Locations in the metal corners of the frame, however, may be particular desirable.

[0055] Although depicted as rectangular, it should be understood that devices 600, 700, 800 may have any geometry desired (most particularly device 600 and 700 not depicted with contact function). Although device 800 requires a geometry for insertion in a card reader in relevant portions, its overall geometry is not limited.

[0056] Althoughdescribedherein in specific embodiments comprisinganopeningandnon-conductive laminated layers and / or substrate surrounding the RFID transceiver chip, it should be understood that the RFID chip and / or the antenna may be encapsulated using any of the techniques described herein. Furthermore, although the discussion of some embodiments herein refer to "cards" and others refer to "devices" suitable for use on a key holder, it should be understood that any of the designs as disclosed herein may be suitable for use in any size, not limited to either standard transaction card sizeor to smaller sizes intended for attachment to akeyholder.As is known in theart, a standard transactioncard (e.g. credit, debit, gift cards) conforms to the CR80 or ISO / IEC 7810:2003 standards, and has nominal dimensions of approximately 3.5 inches by 2 inches, or more specifically 3.37 inches (85.6 mm) by 2.125 (53.98 mm), 0.03125 inches (0.76 millimeters) thick, with rounded corners having a radius of 3.18 millimeters. As is understood by those in the art, the foregoing dimensions are nominal dimensions having a tolerance range for each. Although referred to herein as a "key holder," it should be understood that the devices with through-holes as discussed herein may be attached to any type of member suitable for passing through the hole, with or without keys attached to that samemember, including chains, rings, lanyards, ropes, necklaces, bracelets, posts, etc.

[0057] In yet another embodiment, depicted in FIGS. 9A‑9C, the card includes ametal layer 950, which may be formed fromametal foil, metal sheet, bulkmetal, or other knownmetal. Metal layer 950may comprise a plurality of discontinuities extending from the front surface 902 to the back surface 904 of the metal layer, including at least a first discontinuity 920 that definesapath from thecard periphery to opening912 in themetal layer for receiving the transponder chipmodule910. In the embodiment depicted in FIGS. 9A‑9C, other discontinuities 922, 924, 928 extend from the periphery to an endpoint that does not coincidewith the opening 912. Another discontinuity 926 extends froman intersectionwith discontinuity 920 to an endpoint that is neither in the opening nor at the periphery. Metal layer 950 may additionally comprise additional discontinuities, such as a second discontinuity that defines a path from the card periphery to opening (not shown in FIGS. 9A‑9C, but akin to the respective combinationsof slits 504and554or slits 564and574depicted inFIG. 5A)andbisects the card into two discrete portions. The discontinuities may have any shape, and may include discontinuities that are incorporated into aspects of the aesthetic design on one or both faces of the card, including in coordination with printed features, or formed in the shape of alphanumeric characters, symbols, or the like.

[0058] In the embodiment depicted inFIGS. 9C, a booster antenna layer 942 comprises aplurality ofmetallizations 940, 944onasubstrate (e.g. polyester) that formabooster antenna.Suitable booster antennasmayalso comprise ametalwire antenna disposed on a non-metal substrate. The metal portions of the antenna are isolated from the metal layer 950 by glue layer 952 separating the booster antenna and themetal layer. Booster antenna 942 is configured for communication with the transponder chip module 910, and the transponder chip module 910 and the booster antenna 942 both comprise components in a circuit configured for wireless communication with a card reader (not shown). The booster antennamay be connected to the transponder chip module inductively, or with physical connections (e.g. wires, traces, or contacts). In exemplary embodiments, booster antennal layer 942 comprises a solid polyester layer (e.g. approximately 25 microns 10 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 thick), which may be asymmetrically metalized on both sides, with vias through the polyester connecting respective metallizations disposed on opposite surfaces.

[0059] Reinforcing layer 982, such as fiberglass-reinforced epoxy laminate, such as FR‑4, is disposed over the front surface 902 ofmetal layer 950, and a reinforcing layer 984 of similar construction is disposed over the back surface 904 of the metal layer 950 and over the booster antenna layer 942. The reinforcing layer is not limited to any particular type of glass-reinforced epoxy laminatematerial, however, including both flame retardant (hence the designation "FR") and non- flame-retardant glass-reinforced epoxy laminates. The term "FR‑4" may be used herein as shorthand to refer to a reinforcing layer of any construction, including but not limited to flame retardant and non-flame-retardant fiber-reinforced epoxy laminates. The fibers in fiber-reinforced laminates may comprise fiberglass, polymeric fibers, or any other type of fiber known in the art for making fiber-reinforced structures. The term "fiber" as used herein may include any type of structure that includes fibers or filamentarymembers, includingmesh or grid structures, woven structures, structures with randomly oriented fibers, or the like, without limitation. The FR‑4 layers may be adhered to the respective layers by adhesive layers 981 and 983. The adhesive from the adhesive layers may penetrate and partially or entirely fill the discontinuities 924, 926, 928 during formation of the card. In someembodiments (not shown), antenna layer 942andFR‑4 layer 984may be inverted, with layer 984 as the outermost layer, with printedmatter printed directly onto the outer printed sheet layer. It should be understood that in embodiments in which the antenna layer is adjacent the metal layer, the metallizations of the antenna are disposed on the opposite surface of the antenna substrate from the metal layer, or an insulating material (e.g. adhesive and / or a non-metal layer, such as adhesive disposed on a non-metal substrate) is disposed between the metallizations and the metal layer. In other embodiments, the metallizations may be embedded in the FR‑4 layers, such as using ultrasound techniques.

[0060] Although the term "metallizations" may typically be understood to refer to coatings on the outside surface of a substrate, as used throughout this application, the term refers to any type of metal structure, and when referring to a booster antenna structure, refers to the metal construct of the antenna, regardless of form, including but not limited to structures created using etched films, coatings, depositions, printing, embedded wire, and the like.

[0061] Disposed above upper FR‑4 layer 982, such as adhered by adhesive layer 991, is disposed an optional, RF- friendly metal foil 990 (preferably configured with a metallic appearance), over which is adhered a plastic layer 994 (attached by adhesive 993). Notably, the adhesive layersmay be pre-formed together with the foil as a composite, and the foil composite hot stamped onto the FR‑4, or rolled onto the FR‑4. In embodiments in which the foil is rolled on, the foil composite may comprise a release layer that is them removed before attaching the next layer. Printed content 995 is disposed on plastic layer 994. In other embodiments, the printed content may be printed directly on the foil 990, and the plastic layer 994 / adhesive 993 omitted. Other printed content 996 and / or amagnetic stripe (not shown)may be disposed on lower FR‑4 layer 986. Embodiments in which the position of layers 994 and 990 in the stack are inverted relative to one another (e.g. in switched positions so that layer 900 is located relatively higher in the stack than layer 994) may also be provided.

[0062] In theembodiment depicted inFIG. 9C, opening912extends throughall of theupper layersof the composite card such that a contact surface 911 of transponder module 910 is accessible from the top surface of the card. Such a construction is preferred in embodiments in which the transponder module is has contacts configured to be physically contacted by a card reader, such as a dual interface (DI) module. Constructions incorporating contactless-only modules may also be provided, however, in which the opening 912 does not extend to the top surface of the card. Opening 912may befilledwithanon-metal plug913 that isolates the transpondermodule from themetal layer.Plug913mayhaveahole915 in the bottom for receiving a downward protruding region 914 of the transponder module having a relatively smaller periphery than the periphery of the widest portion of themodule. The configuration of the plug in themetal layer may be in accordance with the teachings in U.S. Pat. Ser. No. 9,390,366, titled "METAL SMART CARDWITH DUAL INTERFACE CAPABILITY" and / or 10,318,859, titled DUAL INTERFACE METAL SMART CARD WITH BOOSTER ANTENNA, or applications related thereto, incorporated herein by reference.

[0063] While not limited to any particular dimensions, an exemplary embodiment of the aspect of the invention depicted in FIG. 9C may include the exemplary thicknesses and compositions as set forth in Table 1: TABLE 1 Layer (Element number) Thickness (inches) Ink (995) 0.0005 - 0.002 Plastic (994) 0.001‑0.002 Adhesive (993) 0.001 - 0.003 Foil (990) ~0.0005 (1‑ 12 um) Adhesive (991)* 0.001 - 0.003 11 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 (continued) Layer (Element number) Thickness (inches) FR‑4 layer (982) 0.002‑0.004 Adhesive (981)* 0.001 - 0.003 Metal (950) 0.01 - 0.02 Adhesive (952)* 0.001 - 0.003 FR‑4 (984) 0.002‑0.004 Adhesive (985)* 0.001 - 0.003 Antenna (942) 0.001 - 0.003 Plastic (997) 0.001 - 0.007 Ink (996) Negligible - 0.002 *optional (see below)

[0064] Althoughdepicted inFIG. 9C, it should beunderstood that inmanyof the interfacesbetween layers, the adhesive layer may be optional (or may not be a discrete layer relative to the layers above or below). For example, as described herein, the FR‑4 layers may be cast directly onto the metal layer. Non-metal layers may be laminated together in a way in which thematerial of the layerbonds to theadjacent layer(s)withorwithout adhesive.Theantenna layermaybeadiscrete, self-supporting layer, or may comprise metallizations disposed directly on the FR‑4, such as via metal foil that is etched, printed with metal ink, or wire embedded (e.g. ultrasonically) into the FR‑4 layer, as described further herein. In embodiments in which foil 990 is a "transfer foil," adhesive layer 991 is optional or may represent an adhesive layer integral to thematrix of the transfer foil 990 that bonds directly to the underlying layer. The positions in the stack of antenna layer 942 and FR‑4 layer 984may be inverted relative to one another, in which case plastic layer 997may be omitted and ink layer 996 printed directly on FR‑4 layer 984. Notably, the foregoing expresses only one embodiment, and other embodiments may contain more or fewer layers.

[0065] In the embodiment depicted in FIGS. 9A‑9C, booster antenna layer 942 includes a plurality of nested semi- circular metallizations 944, which concentrate induction, for facilitating inductive coupling to transponder module 910. While shown with inductive coupling, in other arrangements, the booster antenna may have a physical connection to the transponder module.

[0066] Magnetic stripe 930 may be disposed over the bottom FR‑4 layer 984. Other card features, such as holograms, printing, 2-D codes (such as bar codes or QR codes) may also be incorporated in the card design, typically disposed over the bottom FR‑4 layer or on the top plastic layer.

[0067] Referring now to FIG. 10, an exemplary process for making a card as described herein, such as for example the embodiment depicted in FIGS. 9A‑9B, may include first providing a sheet of metal 1000 that serves as metal layer 950 in the cross-sections as illustrated herein. The sheet is sized to be cut into a plurality of cards along lines 1002, 1004, 1006, 1008.While FIG. 10 depicts only a portion of a sheet having only four cards, it should be understood that the sheetmay be sized for cutting into any number of cards.What is important, regardless of the number of cards per sheet, is that the size of the sheet is preferably greater than the size of the card or cards to be cut from the sheet, so that when the sheet is sliced to form the desired discontinuities, the sheet remains intact.

[0068] The sheet may be inserted into a mold with layers of fiberglass or plastic mesh disposed over the metal layers, and thenepoxyallowed tofill themold, therebycastingepoxyover the topand / orbottomsurfacesof themetal sheet to form FR‑4 layers 982, 984 directly bonded to the metal layer, such in the embodiment depicted in FIG. 9E. In other embodiments, pre-formed FR‑4 layers 982, 984 may be adhesively bonded to the top and / or bottom surfaces of the metal sheet, such as in the embodiment depicted in FIG. 9F.

[0069] More or fewer layers may be provided than are shown in FIGS. 9E and 9F, including but not limited to layers described with respect to other embodiments herein. Likewise, more or fewer layers may be provided for any of the other embodiments discussed in any section of this disclosure. Similar element numbers for the various layers shown in FIGS. 9E and 9F are intended to refer layers with the same function and / or constructions as those referenced by the same number inother drawings, but the functions, layers, and locations inanyof thedepictedembodiments, arenot limited to the arrangements shown.Thoseof skill in theartwill recognize that anumberof different arrangementsarepossible; however, certain of the embodiments as discussed hereinmay be particularly advantageous with respect to considerations of cost, durability, aesthetics, thickness minimization, or the like. The thicknesses of the layers as depicted in any of the figures should not be interpretedasan indication of relative thicknessof the layers in actual constructions, as certain featuresmay be highlighted or enhanced in the figures for illustration only. 12 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55

[0070] Metallization 940 for the booster antenna may be included in the stack as part of a discrete layer (e.g. 942) as depicted in FIGS. 9C and 9D, or may be disposed directly on or embedded beneath (not shown) one of the surfaces of the FR‑4 layers, as depicted in FIGS. 9Eand9F.Oneprocess formakingan etched booster antenna layer typically comprises adhesively attaching a metal (e.g. copper) foil layer to one surface of the FR‑4 layer, and then etching away unwanted portions of the foil to leave the desired antenna pattern. Other ways of disposing the antenna directly on or into the FR‑4 include pattern vapor deposition, printing with conductive ink, and embedding copper wire into the FR‑4 (such as using ultrasonic methods known in the art).

[0071] Inembodiments inwhichapre-formed layerofFR‑4 isadhesivelybonded to themetal layer, thedirectly-disposed antenna may be disposed on the inside surface of the FR‑4, and attached to the metal layer with a sufficient layer of adhesive (such as with layer 960, comprising adhesive layers 962, 964 disposed on opposite surfaces of a non-metal substrate 966) to insulate themetallizations 940 from themetal layer 950, as depicted in FIG. 9F. In embodiments inwhich the metallizations for the antenna comprise wire embedded in the FR‑4, such insulating layers may be omitted. In other embodiments, including those in which the FR‑4 layers are directly cast onto the metal layer, such as in the embodiment depicted in FIG. 9E, themetallizations 940 for the antennamay be formed on the outer surface of the FR‑4 layer 984, and covered with another non-metal layer 997e. Embodiments in which one FR‑4 layer is directly cast, and the other attached later may also be provided. Embodiments with a metallized FR‑4 layer added to the metal as a discrete layer, instead of directly cast to the metal, may have metallizations on both sides of the FR‑4 (optionally, connected with vias through the FR‑4 layer), inwhich case the construction as depicted in FIG. 9Fmay include additional layer 997eon theouter surface of layer 984, asdepicted inFIG. 9E.Thecovering layer 997e is typically anopaqueplastic layer, suchasplastic laminated (as depicted in FIG. 9F) or adhesively bonded to the FR‑4 layer (not shown), but the outer layer may have any construction, particularlywhenadhesivelybonded to theFR‑4, includingbutnot limited toadecorative layerof ceramic,wood, leather, or evenanother layer ofmetal, suchas anodizedmetal. In embodiments inwhich themetallizations for the antenna comprise wire embedded in the FR‑4, the additional non-metal layer 997 may be omitted. insulation may be omitted.

[0072] Openings 1010 for accommodating the transponder module (corresponding to opening 912 shown in other figures)may bemilled in part or in whole into themetal sheet depicted in FIG. 10 at any time during the assembly process. For example, the metal may be precut prior to a step of directly casting the metal layer in epoxy to form the FR‑4, so that epoxy fills the opening in the metal. In such configurations, the opening in the metal may be sufficiently larger than the transponder to form a plug that can be milled at a later step for receiving the module, with epoxy disposed between the transponder and the metal (and adhesive disposed between the transponder and the epoxy). In embodiments wherein pre-formed FR‑4 layers are adhered to the metal, the metal may be cut at the same time as the discontinuities, and the remaining layersmay have pre-cut holes that register with the holes in themetal, or the opening 1010 in themetal may be milled after the remaining layers are added, or the opening may be precut in the metal, and milled in the other layers in a later step.

[0073] The step of inserting the transponder in the opening may include inserting a plug of non-metal material in the opening that surrounds the transponder. The non-metal material plug may comprise adhesive, or a combination of adhesive and another non-metal substance. In one embodiment, the plug and transponder may be preassembled and adhesively bonded in the opening. In another embodiment, the plugmay be placed in the opening first, and thenmilled to accommodate the transponder. The transponder inferfacewith the opening and process for creating it is not limited to any particular construction.

[0074] After the stack of layers has been assembled and the transpondermodules inserted, the sheet of cardsmay then be cut into a plurality of individual card blanks, and the individual card blanks further processed, including personalization, as needed. It should be understood that the transaction card of any of the embodiments discussed herein may be of any shape and size, including in a key fob configuration, as described herein with respect to FIGS. 8A‑8B

[0075] It should be understood that although various concepts have been illustrated using specific exemplary embodiments, the features of each of the embodiments may be mixed and matched as desired by those of skill in the art. For example, theFR‑4andmulti-discontinuity architectureasdescribedwith respect toFIGS.9A‑9Cmaybeapplied to a keychain embodiment, such as that illustrated in FIGS. 6A‑8A. Likewise, aspects of the construction - in particular, the absence of the metal layer from the payment circuit -‑ as described herein with reference to FIGS. 9A‑9C in a fiber- reinforcedepoxyembodiment,mayalsobe featured inother constructionsknown in theart,without limitation, includingbut not limited to constructions using other types of overmolding materials or laminated layers, alone or in combination.

[0076] The foregoing embodiment is only an exemplary embodiment, and other embodiments may include fewer or more layers, stacked in a different order, and attached to one another by any way known in the art, not limited to adhesive connections. One or more of the functional layers may be formed from a sheet coated with adhesive and a peel-away release layer. In other embodiments, the glue layers may comprise glue disposed on both sides of a very thin sheet of polyester, with release layers disposed over both glue layers. In such embodiments, the relevant steps in a process for forming the card comprise removing a first release layer, attaching the exposed glue layer to an adjacent layer, and then removing the second release layer for attachment of a subsequent layer.

[0077] In the exemplary embodiment depicted in FIG. 9D, an exemplary card may be formed from a premade laminate 13 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 material comprising metal layer 950 with an upper FR‑4 layer 982 and a lower FR‑4 layer 984 attached to both surfaces thereof, such as may be formed by casting epoxy about a structural mesh placed over the metal layer. In one method for assembling the card, the premade laminate as described above is processed to create discontinuities 924, 926, and 928 and opening 912, from the bottom of the card. For example, a laser may be used for cutting from the lower FR‑4 984 layer through the metal layer 950 without penetrating the upper FR‑4 layer, thereby leaving the upper FR‑4 layer 982 with sufficient integrity to provide reinforcement for the card with the corresponding discontinuities. Additional layers may be added, as described herein in any embodiment, not limited to the stack depicted in FIG. 9D. For example, RF-friendly foil 990 may be disposed over the premade laminate by a rolling or hot-stamp process, as described herein above, the remaining non-ink layers (e.g. booster antenna layer 942, optional lower plastic layer 997, and any adhesive layers 983, 985, between adjacent layers) added, and then the stack laminated. Graphics layers 995 or 996 are printed on the outer surfaces of the laminated stack. The transponder module may be added before or after printing, including milling the opening912, inserting plug 913 in theopening912,milling anopening in theplug, and inserting themodule 910 in theplug. The plug and module may comprise a pre-made assembly, or may be assembled in situ. It should be understood that the combination, sequence of layers in a stack, and methods for attaching layers to one another (e.g. with adhesive, or by laminationwithout adhesive between certain adjacent layers, depending upon composition of the layers)may be varied in any way known in the art.

[0078] Onemethod of assembling the layers as depicted in the embodiments disclosed hereinmay include creating the metal layer with discontinues and the opening for receiving the transponder module and separately preparing an FR‑4 layer without metallizations, and an FR‑4 layer with an etchedmetallized antenna, and adhesively sandwiching themetal layer between the FR‑4 layers, resulting in the structure comprising layers 982, 960, 950, 960, 940, 984 as depicted in FIGS. 9F. TheFR‑4 layer disposed on the top surface of themetalmay have a pre-cut opening that alignswith the opening in themetal layer for the transpondermodule, or the FR‑4 layermay bemilled after attachment to themetal layer to extend the opening to the top surface of the FR‑4 layer. The plug is then disposed in the opening, other non-ink layers (e.g. plastic layers over one or both of the FR‑4 layers) are added, and the card is laminated together.

[0079] In another embodiment, the process may include providing a premade laminate of FR‑4 on both sides of metal (e.g. layers 982, 950, 984asdepicted inFIG. 9E), and thencreatingopening912andoneormorediscontinuities (e.g. 920, 922, 924, 926, and 928) in the premade laminate. If desired, the discontinuitiesmay be formed so that they penetrate only layer 984 and950, but not layer 982 (as shown in FIG. 9D). In still another embodiment, the processmay include providing themetal body950, creatingopening912andoneormorediscontinuities (e.g. 920, 922, 924, 926, and928), placingmesh layers on the opposite surfaces of the metal layer, then casting epoxy over the mesh layers to form FR‑4 layers 982, 984 bonded tometal layer 950. The resulting layers 982, 950, 984 formed by either of the foregoing processes are then further processed, such as by placing a copper foil on one side of the FR‑4, and unwanted portions etched away to form metallization940.Notably,whenstartingwith apremade laminatewith discontinuities penetratingonly oneFR‑4 layer and themetal layer (as depicted in FIG. 9D), the foil is preferably disposed on theFR‑4 layer that does not have discontinuities. In the alternative, the discontinuities may be filled (such as with a coating or another non-metal layer) prior to forming the metallizations. The foregoing preferencesmay bemore desirable for etched or printedmetallizations, to optimize integrity of the metallizations, than for embedded wire metallizations, which may be disposed in either FR‑4 layer with fewer technical concerns. Layer 997e is added to cover themetallization (particularly in embodiments in which themetallization is exposed on the outside of the FR‑4, resulting in the composition of layers 982, 950, 940, 984, 997e as depicted in FIG. 9E. Additional layers, including but not limited to layers 995 and 996 may optionally be included, as further described herein.

[0080] Although the invention is illustratedanddescribedhereinwith reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

[0081] The invention will become more apparent by the following itemized list: 1. A transaction device comprising: a metal layer having a front surface, a back surface, a periphery, an opening in the metal layer, and one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to thebacksurface, includingat least onediscontinuity that definesapath from thedeviceperiphery to the opening; a transponder chip module disposed in the opening in the metal layer; and a booster antenna in communication with the transponder chip module, the transponder chip module and the booster antenna comprising components in a circuit configured for wireless communicationwith a device reader, wherein the metal layer is neither part of the booster antenna nor a component in the circuit. 2. The device of item 1, comprising at least two body discontinuities defining respective paths from the device 14 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 periphery to the opening, wherein the at least two body discontinuities and the opening collectively bisect the device body into at least two discrete portions. 3. The device of items 1 or 2, further comprising a non-metal moldingmaterial in the one ormore discontinuities in the metal layer. 4. The device of item 3, wherein the non-metal molding material comprises an adhesive or an epoxy. 5. The device of item 3, further comprising a reinforcing layer disposed over the metal layer. 6. The device of item 5, wherein the reinforcing layer comprises fiberglass. 7. The device of item 6, wherein the reinforcing layer comprises a fiber-reinforced epoxy laminate material. 8.Thedeviceof item6, comprisingafiber-reinforcedepoxy laminatematerial layerdisposedonat least oneof the front surface and the back surface of the metal layer. 9. The device of item 8, wherein the metal layer is sandwiched between opposite fiber-reinforced epoxy laminate material layers. 10. The device of any one of items 1‑9, comprising at least one discontinuity in the metal layer extending from the device periphery to a location other than in the opening. 11.Thedeviceof anyoneof items1‑10,whereinat least twoof theplurality of discontinuities in themetal layer intersect with one another. 12.Thedeviceof item11,wherein the intersectingdiscontinuities compriseafirst discontinuity definingapath from the deviceperiphery to theopeningandaseconddiscontinuity extending froman intersectionwith the first discontinuity to an endpoint that is neither in the opening nor at the periphery. 13. Thedevice of anyoneof items1‑12,wherein thebooster antenna comprisesabooster antenna layer comprising a plurality of metallizations. 14. The device of item 13, each of the plurality of metallizations is electrically isolated from the metal layer. 15. The device of any one of items 1‑14, comprising a magnetic stripe disposed on a back layer of the device. 16. The device of any one of items 1‑15, comprising a first fiber-reinforced epoxy laminate material layer over a top surface of the metal layer, but not over the transponder chip module in the opening. 17. Thedevice of item16, comprisinga secondfiber-reinforcedepoxy laminatematerial layer over abottomsurfaceof the metal layer, including over the opening and over the booster antenna. 18. The device of item 17, further comprising a magnetic stripe disposed over the booster antenna. 19. The device of any oneof items1‑18, wherein the device comprises a transaction card conforming to at least one of CR80 or ISO / IEC 7810:2003 standards. 20. The device of any one of items 1‑18, further comprising a hole extending between a top surface and a bottom surface of the device, the hole sized to receive a ring member configured for holding one or more keys. 21. Thedeviceof item20,wherein thedevice comprises a component of a key ringor key chain, further comprising the ring member disposed in the hole. 22. The device of any one of items 1‑21, wherein the transponder chip module comprises a dual interface module. 23. The device of any one of items 1‑22, further comprising a layer of RF-friendly metal foil layer disposed over the metal layer. 24. The device of item 9, further comprising a layer of RF-friendly metal foil layer disposed over one of the fiber- reinforced epoxy laminate material layers. 25. The device of item24, further comprising the booster antenna layer disposed over the other of the fiber-reinforced epoxy laminate material layers or disposed between the metal layer and the other of the fiber-reinforced epoxy laminate material layers. 26. The device of item 25, further comprising ink on at least one of the outer surfaces of the device. 27. A transaction device comprising: ametal layer havinga front surface, a backsurface, a periphery, andoneormorediscontinuities in themetal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; a first non-metal, reinforcing layer disposed over the front surface of the metal layer; a booster antennadisposedover the back surfaceof themetal layer, the booster antenna comprising aplurality of metallizations isolated from the metal layer; a second non-metal, reinforcing layer disposed over the back surface of the metal layer; an opening in the metal layer extending through the first non-metal, reinforcing layer; a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna comprising a payment circuit configured for wireless communication with a device reader. 28.The transactiondeviceof item27,whereinat least afirst oneof thediscontinuitiesextends from theperiphery to the 15 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 opening in the metal layer. 29. The transaction device of item28,wherein at least second one of the discontinuities extends from the periphery to an endpoint not in the opening in the metal layer. 30. The transaction device of item 29, wherein at least a third one of the discontinuities extends from an intersection with the first discontinuity to and endpoint that is neither in the opening nor at the periphery. 31. The transaction device of any oneof items 27 - 30,wherein themetal layer is electrically isolated from the payment circuit. 32. The transaction device of any one of items 27 - 30, wherein the metal layer is part of the payment circuit. 33. The transaction card of any one of items 27 - 30, wherein the first non-metal layer and the second non-metal layer each comprise fiber-reinforced epoxy laminate material. 34. A transaction device comprising: a metal layer having a front surface, a back surface, and a periphery; an opening in the metal layer extending from the metal layer to a top surface of the device; one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending between the periphery of the metal layer and the opening in the metal layer; a back fiber-reinforced epoxy laminate material layer disposed over the back surface of the metal layer; a booster antenna; a transponder chip module disposed in the opening and having a top surface accessible from the top surface of thedevice, the transponder chipmodule in communicationwith thebooster antennaand togetherwith thebooster antenna comprising a payment circuit configured for wireless communication with a device reader. 35. The device of item 34, wherein the booster antenna comprises the metal layer. 36. The device of item 34, comprising a booster antenna separate from the metal layer, wherein the metal layer is isolated from the payment circuit. 37. The device of any one of items 34 - 36, further comprising a front fiber-reinforced epoxy laminate material layer disposed over the front side of the metal layer. 38. Thedevice of item37,wherein the front and back fiber-reinforcedepoxy laminatematerial layers are eachbonded directly to the metal layer by the epoxy of the front and back fiber-reinforced epoxy laminate material layers. 39. The device of any one of items 34‑38, wherein themetal layer is isolated from the payment circuit and the booster antenna and comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer. 40. The device of item 39, wherein the plurality of metallizations are disposed on a back surface of the back fiber- reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations. 41. The device of item 37, wherein the respective fiber-reinforced epoxy laminate material layers disposed over the front side and back side of the metal layer are discrete layers that are bonded to the metal layer by an adhesive other than the epoxy of the fiber-reinforced epoxy laminate material layers. 42. The device of item 41, wherein the metal layer is electrically isolated from the payment circuit and the booster antenna comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer. 43. The device of item 42, wherein at least a portion of the plurality ofmetallizations are disposed on a back surface of the back fiber-reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations. 44. The device of item 42, wherein at least a portion of the plurality of metallizations are disposed on a front surface of the back fiber-reinforced epoxy laminate material layer and separated from the metal layer by a non-metal layer disposed between the fiber-reinforced epoxy laminate material layer and the metal layer. 45. The device of item 44, wherein the non-metal layer comprises a substrate of an adhesive layer. 46. A process for manufacturing a transaction device, the process comprising steps of: (a) providing a metal layer having a front surface, a back surface, and a periphery; (b) forming one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to thebacksurface, includingat least onediscontinuity extending to theperiphery of the metal layer; (c) disposing a booster antenna over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations; (d) disposing a first fiberglass layer over the front surface of the metal layer; 16 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 (e) disposing a second fiberglass layer over the back surface of the metal layer; (f) forming an opening in themetal layer extending through the first fiberglass layer to a top surface of the device; (h) disposing a transponder chip module in the opening. 47. Theprocessof item46, comprising configuring the transponder chipmodule to be in electrical communicationwith the booster antenna to together form a portion of a payment circuit configured for wireless communication with a device reader. 48. The process of item46, including disposing the booster antenna layer over the back surface of themetal layerwith themetallizationselectrically isolated from themetal layer, andconfiguring thedevicewith themetal layer not included in the payment circuit. 49. The process of item46,wherein the step of disposing the booster antenna over the back surface of themetal layer comprises forming the plurality of metallizations on or embedded in the second fiberglass layer. 50. The process of item 49, further comprising disposing an additional non-metal layer over the metallizations. 51. The process of any one of items 46‑50, wherein the steps of disposing the first and second fiberglass layers over the front andbacksurfacesof themetal layer comprise casting thefirst andsecondfiberglass layerswithepoxy to form first and second fiber-reinforced epoxy laminate material layers bonded directly to the metal layer. 52. The process of any one of items 46‑50, wherein the steps of disposing the first and second fiberglass layers over the front and back surfaces of themetal layer comprise attaching a first cured fiber-reinforced epoxy laminatematerial layer to the front surface of the metal layer with a first adhesive layer and attaching a second cured fiber-reinforced epoxy laminate material layer to the back surface of the metal layer with a second adhesive layer. 53. The process of item52, further comprising forming the booster antenna over the back surface of themetal layer by forming a plurality of metallizations on or embedded in the second cured fiber-reinforced epoxy laminate material layer. 54. The process of item 52, wherein forming the plurality of metallizations comprises embedding wire in the second cured fiber-reinforced epoxy laminate material. 55. The process of item 52, wherein forming the plurality of metallizations comprises printing metallized ink on a surface of the second cured fiber-reinforced epoxy laminate material. 56. The process of item 52, wherein forming the plurality of metallizations comprises disposing ametal layer over the second cured fiber-reinforcedepoxy laminatematerial layer, and etching awayaportion of themetal layer to leave the metallizations. 57. The process of items 55 or 56, comprising forming the plurality ofmetallizations on an inside surface of the second cured fiber-reinforced epoxy laminate material layer facing the metal layer. 58. The process of item 57, wherein the second adhesive layer includes a non-metal substrate layer. 59. The process of items 55 or 56, comprising forming the plurality of metallizations on an outside surface of the second cured fiber-reinforced epoxy laminate material layer facing away from the metal layer. 60. Theprocess of item59, comprising disposing anon-metal layer over the outside surfaceof the second cured fiber- reinforced epoxy laminate material and the plurality of metallizations disposed thereon. 61. The process of any one of items 46‑60, wherein the opening in the metal layer is created in the same step as the discontinuities in the metal layer. 62. A process for manufacturing a transaction device, the process comprising steps of: (a) providing a premade laminate comprising a metal layer having a front surface, a back surface, and a periphery; a first cured fiber-reinforced epoxy laminate layer bonded to the front surface of the metal layer; a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of the metal layer; (b) formingoneormorediscontinuities in themetal layerof thepremade laminate, eachdiscontinuity comprisinga gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer, each of the one or more discontinuities also extending through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer; (c) disposing a booster antenna over an outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer, the booster antenna comprising a plurality of metallizations; (d) forming an opening in themetal layer extending through the first fiberglass layer to a top surface of the device; (h) disposing a transponder chip module in the opening. 17 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 63. The process of item 62, further comprising forming the booster antenna by forming a plurality of metallizations on theouter surfaceofor embeddedwithinoneof thefirst curedfiber-reinforcedepoxy laminate layer or thesecondcured fiber-reinforced epoxy laminate layer. 64. The process of item 62, wherein forming the plurality of metallizations comprises disposing a metal layer on the outside surface of the respective cured fiber-reinforced epoxy laminate material layer, and etching away a portion of the metal layer to leave the metallizations. 65. The process of item 62, comprising disposing a non-metal layer over the outside surface of the respective cured fiber-reinforced epoxy laminate material and the plurality of metallizations disposed thereon. 66. Theprocessof item62,wherein forming theplurality ofmetallizations comprises embeddingwire in the respective first or second cured fiber-reinforced epoxy laminate layer. Claims 1. A transaction device comprising: ametal layer havinga front surface, a backsurface, a periphery, andoneormorediscontinuities in themetal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; a first non-metal, reinforcing layer disposed over the front surface of the metal layer; a booster antennadisposedover the back surfaceof themetal layer, the booster antenna comprising aplurality of metallizations isolated from the metal layer; a second non-metal, reinforcing layer disposed over the back surface of the metal layer; an opening in the metal layer extending through the first non-metal, reinforcing layer; a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna forming a portion of a payment circuit configured for wireless communication with a device reader. 2. The transaction device of claim 1, wherein at least a first one of the discontinuities extends from the periphery to the opening in the metal layer. 3. The transaction device of claim 2, wherein at least second one of the discontinuities extends from the periphery to an endpoint not in the opening in the metal layer. 4. The transaction device of claim 3, wherein at least a third one of the discontinuities extends from an intersection with the first discontinuity to and endpoint that is neither in the opening nor at the periphery. 5. The transaction device of any one of claims 1‑4, wherein the metal layer is electrically isolated from the payment circuit. 6. The transaction device of any one of claims 1‑4, wherein the metal layer is part of the payment circuit. 7. The transaction card of any one of claims 1‑4, wherein the first non-metal layer and the second non-metal layer each comprise fiber-reinforced epoxy laminate material. 8. A transaction device comprising: a metal layer having a front surface, a back surface, and a periphery; an opening in the metal layer extending from the metal layer to a top surface of the device; one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending between the periphery of the metal layer and the opening in the metal layer; a back fiber-reinforced epoxy laminate material layer disposed over the back surface of the metal layer; a booster antenna separate from the metal layer; a transponder chip module disposed in the opening and having a top surface accessible from the top surface of thedevice, the transponder chipmodule in communicationwith thebooster antennaand togetherwith thebooster antenna forming a portion of a payment circuit configured for wireless communication with a device reader; wherein the metal layer is isolated from the payment circuit. 18 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 9. The device of claim 8, further comprising a front fiber-reinforced epoxy laminatematerial layer disposed over the front side of the metal layer. 10. The device of claim 9, wherein the front and back fiber-reinforced epoxy laminate material layers are each bonded directly to the metal layer by the epoxy of the front and back fiber-reinforced epoxy laminate material layers. 11. The device of any one of claims 8‑10, wherein the metal layer is isolated from the payment circuit and the booster antenna and comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer. 12. The device of claim 11, wherein the plurality of metallizations are disposed on a back surface of the back fiber- reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations. 13. The device of claim 9, wherein the respective fiber-reinforced epoxy laminate material layers disposed over the front side and back side of the metal layer are discrete layers that are bonded to the metal layer by an adhesive other than the epoxy of the fiber-reinforced epoxy laminate material layers. 14. Thedeviceof claim13,wherein themetal layer is electrically isolated from thepayment circuit and theboosterantenna comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer. 15. Thedevice of claim14,wherein at least a portion of the plurality ofmetallizations are disposedonaback surfaceof the back fiber-reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations. 16. Thedevice of claim14,wherein at least a portion of the plurality ofmetallizations are disposed on a front surface of the back fiber-reinforced epoxy laminatematerial layer and separated from themetal layer by a non-metal layer disposed between the fiber-reinforced epoxy laminate material layer and the metal layer. 17. The device of claim 16, wherein the non-metal layer comprises a substrate of an adhesive layer. 18. A process for manufacturing a transaction device, the process comprising steps of: (a) providing a premade laminate comprising a metal layer having a front surface, a back surface, and a periphery; a first cured fiber-reinforced epoxy laminate layer bonded to the front surface of the metal layer; a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of the metal layer; (b) formingoneormorediscontinuities in themetal layerof thepremade laminate, eachdiscontinuity comprisinga gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer, each of the one or more discontinuities also extending through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer; (c) disposing a booster antenna over an outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer, the booster antenna comprising a plurality of metallizations; (d) forming an opening in themetal layer extending through the first fiberglass layer to a top surface of the device; (h) disposing a transponder chip module in the opening. 19. The process of claim 18, further comprising forming the booster antenna by forming a plurality ofmetallizations on the outer surface of or embedded within one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer. 20. The process of claim 18, wherein forming the plurality of metallizations comprises disposing a metal layer on the outside surface of the respective cured fiber-reinforced epoxy laminate material layer, and etching away a portion of the metal layer to leave the metallizations. 19 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 21. Theprocessof claim18, comprisingdisposinganon-metal layer over theoutside surfaceof the respective curedfiber- reinforced epoxy laminate material and the plurality of metallizations disposed thereon. 22. The process of claim 18, wherein forming the plurality of metallizations comprises embedding wire in the respective first or second cured fiber-reinforced epoxy laminate layer. 23. The process of claim 18, wherein forming the plurality of metallizations comprises forming each of the plurality of metallizations as being electrically isolated from the metal layer. 20 EP 4 651 020 A2 5 10 15 20 25 30 35 40 45 50 55 21 EP 4 651 020 A2 22 EP 4 651 020 A2 23 EP 4 651 020 A2 24 EP 4 651 020 A2 25 EP 4 651 020 A2 26 EP 4 651 020 A2 27 EP 4 651 020 A2 28 EP 4 651 020 A2 29 EP 4 651 020 A2 30 EP 4 651 020 A2 31 EP 4 651 020 A2 32 EP 4 651 020 A2 33 EP 4 651 020 A2 REFERENCES CITED IN THE DESCRIPTION This list of references cited by the applicant is for the reader’s convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard. Patent documents cited in the description • US 62971439 A

[0001] • US 8608082 B, Garrec

[0037] • US 9812782 B, Finn

[0037] • US 92881318 A

[0037] • US 75128520 A

[0039] • US 201950592 W

[0041] • US 62730282 A

[0041] • US 9390366 B

[0062] 摘 要 一种交易装置，包括：金属层，所述金属层具有前表面、后表面、周边以及所 述金属层中的一个或多个不连续面，每个不连续面包括在所述金属层中从所述 前表面延伸到所述后表面的间隙，包括至少一个延伸至金属层周边的不连续面； 设置在所述金属层的前表面上的第一非金属增强层；设置在所述金属层后表面 上的增强天线，所述增强天线包括多个与金属层隔离的金属化层；设置在所述 金属层的后表面上的第二非金属增强层；所述金属层中的延伸穿过所述第一非 金属增强层的开口；设置在所述开口中的应答器芯片模块，所述应答器芯片模 块与所述增强天线通信，并且与所述增强天线一起构成支付电路的一部分，所 述支付电路被配置用于与装置读卡器进行无线通信。

Claims

1. A transaction device comprising: a metal layer having a front surface, a back surface, a periphery, and one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer; a first non-metal, reinforcing layer disposed over the front surface of the metal layer; a booster antenna disposed over the back surface of the metal layer, the booster antenna comprising a plurality of metallizations isolated from the metal layer; a second non-metal, reinforcing layer disposed over the back surface of the metal layer; an opening in the metal layer extending through the first non-metal, reinforcing layer; a transponder chip module disposed in the opening, the transponder chip module in communication with the booster antenna and together with the booster antenna forming a portion of a payment circuit configured for wireless communication with a device reader.

2. The transaction device of claim 1, wherein at least a first one of the discontinuities extends from the periphery to the opening in the metal layer.

3. The transaction device of claim 2, wherein at least second one of the discontinuities extends from the periphery to an endpoint not in the opening in the metal layer.

4. The transaction device of claim 3, wherein at least a third one of the discontinuities extends from an intersection with the first discontinuity to and endpoint that is neither in the opening nor at the periphery.

5. The transaction device of any one of claims 1-4, wherein the metal layer is electrically isolated from the payment circuit.

6. The transaction device of any one of claims 1-4, wherein the metal layer is part of the payment circuit.

7. The transaction card of any one of claims 1-4, wherein the first non-metal layer and the second non-metal layer each comprise fiber-reinforced epoxy laminate material.

8. A transaction device comprising: a metal layer having a front surface, a back surface, and a periphery; an opening in the metal layer extending from the metal layer to a top surface of the device; one or more discontinuities in the metal layer, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending between the periphery of the metal layer and the opening in the metal layer; a back fiber-reinforced epoxy laminate material layer disposed over the back surface of the metal layer; a booster antenna separate from the metal layer; a transponder chip module disposed in the opening and having a top surface accessible from the top surface of the device, the transponder chip module in communication with the booster antenna and together with the booster antenna forming a portion of a payment circuit configured for wireless communication with a device reader; wherein the metal layer is isolated from the payment circuit.

9. The device of claim 8, further comprising a front fiber-reinforced epoxy laminate material layer disposed over the front side of the metal layer.

10. The device of claim 9, wherein the front and back fiber-reinforced epoxy laminate material layers are each bonded directly to the metal layer by the epoxy of the front and back fiber-reinforced epoxy laminate material layers.

11. The device of any one of claims 8-10, wherein the metal layer is isolated from the payment circuit and the booster antenna and comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer.

12. The device of claim 11, wherein the plurality of metallizations are disposed on a back surface of the back fiber-reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations.

13. The device of claim 9, wherein the respective fiber-reinforced epoxy laminate material layers disposed over the front side and back side of the metal layer are discrete layers that are bonded to the metal layer by an adhesive other than the epoxy of the fiber-reinforced epoxy laminate material layers.

14. The device of claim 13, wherein the metal layer is electrically isolated from the payment circuit and the booster antenna comprises a plurality of metallizations on or embedded in the back fiber-reinforced epoxy laminate material layer.

15. The device of claim 14, wherein at least a portion of the plurality of metallizations are disposed on a back surface of the back fiber-reinforced epoxy laminate material layer and the device includes a non-metal layer disposed over the plurality of metallizations.

16. The device of claim 14, wherein at least a portion of the plurality of metallizations are disposed on a front surface of the back fiber-reinforced epoxy laminate material layer and separated from the metal layer by a non-metal layer disposed between the fiber-reinforced epoxy laminate material layer and the metal layer.

17. The device of claim 16, wherein the non-metal layer comprises a substrate of an adhesive layer.

18. A process for manufacturing a transaction device, the process comprising steps of: (a) providing a premade laminate comprising a metal layer having a front surface, a back surface, and a periphery; a first cured fiber-reinforced epoxy laminate layer bonded to the front surface of the metal layer; a second cured fiber-reinforced epoxy laminate layer bonded to the back surface of the metal layer; (b) forming one or more discontinuities in the metal layer of the premade laminate, each discontinuity comprising a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity extending to the periphery of the metal layer, each of the one or more discontinuities also extending through at least one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer; (c) disposing a booster antenna over an outer surface of one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer, the booster antenna comprising a plurality of metallizations; (d) forming an opening in the metal layer extending through the first fiberglass layer to a top surface of the device; (h) disposing a transponder chip module in the opening.

19. The process of claim 18, further comprising forming the booster antenna by forming a plurality of metallizations on the outer surface of or embedded within one of the first cured fiber-reinforced epoxy laminate layer or the second cured fiber-reinforced epoxy laminate layer.

20. The process of claim 18, wherein forming the plurality of metallizations comprises disposing a metal layer on the outside surface of the respective cured fiber-reinforced epoxy laminate material layer, and etching away a portion of the metal layer to leave the metallizations.

21. The process of claim 18, comprising disposing a non-metal layer over the outside surface of the respective cured fiber-reinforced epoxy laminate material and the plurality of metallizations disposed thereon.

22. The process of claim 18, wherein forming the plurality of metallizations comprises embedding wire in the respective first or second cured fiber-reinforced epoxy laminate layer.

23. The process of claim 18, wherein forming the plurality of metallizations comprises forming each of the plurality of metallizations as being electrically isolated from the metal layer.

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