Press system for punching multiple leads of an electronic device, and method for manufacturing electronic devices
Patent Information
- Application Number
- HK42026126423
- Authority / Receiving Office
- HK · HK
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2026-07-21
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2045-12-25
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Abstract
Description
(19) State Intellectual Property Office (12) Invention Patent Application (10) Application Publication Number (43) Application Publication Date (21) Application Number 202511993233.0 (22) Application Date 2025.12.26 (30) Priority Data 19 / 003,778 2024.12.27 US (71) Applicant Advanced Technology Singapore Limited Address Singapore (72) Inventors Xie Honglong Su Xiangyuan Li Kangyang Zheng Zhihua (74) Patent Agency Beijing J&J Intellectual Property Agency Co., Ltd. 11227 Patent Attorney Shao Pan (51) Int.Cl. B21F 1 / 00 (2006.01) B21C 51 / 00 (2006.01) (54) Invention Title Pressure System for Stamping Multiple Pins of Electronic Devices and Method for Manufacturing Electronic Devices (57) Abstract This disclosure provides a pressure system for stamping multiple pins of electronic devices and a method for manufacturing electronic devices. The pressure system includes: a body casting on which a first module is fixedly mounted; and a second module movable relative to the first module between a standby height and a stamping height. At the standby height, the first module and the second module are located at a preset separation distance. At the stamping height, the first module and / or the second module apply stamping force to the plurality of pins of the electronic device. A fine-tuning motor is operatively connected to the body casting for adjusting the position of the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height to allow the first module and the second module to stamp subsequent electronic devices. Claims (2 pages), Description (4 pages), Drawings (3 pages), CN 122298887 A, 2026.06.30, CN 1 22 29 88 87 A. 1. A pressure system for stamping multiple pins of an electronic device, characterized in that the pressure system comprises: a body casting on which a first module is fixedly mounted; a second module that can be driven to move relative to the first module between a standby height and a stamping height, wherein at the standby height, the first module and the second module are located at a preset separation distance, and at the stamping height, the first module and / or the second module apply stamping force to the multiple pins of the electronic device; and a fine-tuning motor operably connected to the body casting, the fine-tuning motor being used to adjust the position of the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height so as to use the first module and the second module to stamp subsequent electronic devices. 2. The pressure system of claim 1, characterized in that it further comprises a fine-tuning motor controller, the fine-tuning motor...3. The pressure system of claim 2, wherein the fine-tuning motor controller is configured to provide a signal to the fine-tuning motor to drive the fine-tuning motor to adjust the position of the body casting. 4. The pressure system of claim 2, wherein the fine-tuning motor controller is configured to determine whether the stamping height should be changed by measuring the reaction force from the pins of the electronic device when the first module and / or the second module clamps the pins. 5. The pressure system of claim 2, wherein the fine-tuning motor controller is configured to determine whether the stamping height should be changed by measuring the relative position of the first module and the second module when the first module and / or the second module clamps the pins of the electronic device. 6. The pressure system of claim 2, further comprising an image sensor for acquiring an image of the pins stamped by the first module and / or the second module for inspection. 7. The pressure system of claim 6, further comprising a transfer rail for conveying the electronic device from the position of the first module and the second module to the position of the image sensor. 8. The pressure system of claim 6, wherein the fine-tuning motor controller is configured to determine whether the stamping height should be changed by examining an image of the pin. 9. The pressure system of claim 1, wherein the second module is driven to move by a stamping motor, and the first module is relatively stationary, such that the second module is configured to move from the standby height to the stamping height to stamp the pin of the electronic device. 10. The pressure system of claim 1, wherein the body casting is mounted on and supported by a plurality of columns, and both the body casting and the second module can be driven to move along the plurality of columns to adjust the position of the body casting. 11. The pressure system of claim 1, further comprising an extension arm extending from the body casting, the fine-tuning motor being connected to the extension arm for adjusting the position of the body casting. 12. The pressure system of claim 11, wherein the extension arm is connected to a fine-tuning belt, the fine-tuning belt being driven by the fine-tuning motor via pulleys. 13. The pressure system of claim 11, wherein the extension arm is connected to a ball screw, the ball screw being rotatable by the fine-tuning motor to adjust the position of the body casting. 14. A method for manufacturing an electronic device, characterized in that the electronic device is manufactured by stamping a plurality of pins of the electronic device in a pressure system, the method comprising: fixing a first module to a body casting; Claims 1 / 2 page 2 CN 122298887 AThe second module is driven to move relative to the first module between a standby height and a stamping height. At the standby height, the first module and the second module are located at a preset separation distance. At the stamping height, the first module and / or the second module apply stamping force to multiple pins of the electronic device. The position of the body casting is adjusted by a fine-tuning motor operably connected to the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height so as to use the first module and the second module to stamp subsequent electronic devices. The subsequent electronic devices are then stamped at the changed stamping height. Claims 2 / 2 Page 3 CN 122298887 A Pressure system for stamping multiple pins of electronic devices and a method for manufacturing electronic devices Technical Field
[0001] This disclosure relates to a mechanical press for electronic devices, and more particularly to a mechanical press with an automatic adjustment function for improving the output quality of the processed electronic devices. Background Art
[0002] Mechanical presses are commonly used in the semiconductor assembly and packaging industry to cut, bend, shape, or separate electronic devices or components by stamping. Manufacturers of traditional mechanical presses typically focus on making the press operate with a regular and constant reciprocating motion.
[0003] To improve flexibility, some manufacturers integrate additional vision systems to monitor output quality issues and stop the mechanical press if any defects are found. For example, if the forming angle or pin spacing of the output electronic device exceeds specification limits, the die components are manually adjusted after the mechanical press stops operating to prevent such defects from appearing in subsequently processed electronic devices. Aside from focusing on correcting obvious defects found on packaged electronic devices, manufacturers do not consider adjusting or improving output quality by fine-tuning the press's drive force.
[0004] The drawback of the above methods is that production is only stopped when defects are found during preventative maintenance or visual inspection. Furthermore, to ensure output quality, problematic die components, such as worn parts, must be manually adjusted or replaced.
[0005] It would be beneficial to design a mechanical press that avoids the above-mentioned disadvantages of the prior art.
[0006] Therefore, the object of this disclosure is to provide a mechanical press that can automatically adjust the driving force of the press to improve output quality without stopping the mechanical press during processing operations.
[0007] According to a first aspect of this disclosure, a pressure system for stamping multiple pins of electronic devices is provided. The pressure system includes: a body casting on which a first module is fixedly mounted; and a second module that can be driven to move relative to the first module between a standby height and a stamping height, wherein at the standby height, the first module and the second module...The first module and / or the second module are located at a preset separation distance, and at the stamping height, the first module and / or the second module apply stamping force to the plurality of pins of the electronic device; and a fine-tuning motor is operatively connected to the body casting, the fine-tuning motor being used to adjust the position of the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height so as to use the first module and the second module to stamp subsequent electronic devices.
[0008] According to a second aspect of this disclosure, a method for manufacturing an electronic device is provided, wherein the electronic device is manufactured by stamping a plurality of pins of the electronic device in a pressure system, the method comprising: fixing a first module to a body casting; driving a second module relative to the first module between a standby height and a stamping height, wherein at the standby height the first module and the second module are located at a preset separation distance, and at the stamping height the first module and / or the second module apply stamping force to a plurality of pins of the electronic device; adjusting the position of the body casting by means of a fine-tuning motor operably connected to the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height so as to stamp a subsequent electronic device using the first module and the second module; and stamping the subsequent electronic device at the changed stamping height.
[0009] The present disclosure will now be described in more detail with reference to the accompanying drawings, which illustrate specific preferred embodiments of the present disclosure. The specific details of the drawings and their related descriptions are not intended to replace the generality of the disclosure as defined by the claims.
[0010] The following description, with reference to the accompanying drawings, illustrates specific examples of manufacturing methods for pressure systems and electronic devices provided in embodiments of the present disclosure, wherein:
[0011] FIG1 is a side view of an electronic device whose pins are formed by a mechanical press;
[0012] FIG2 is an isometric view of a pressure system according to a preferred embodiment of the present disclosure, showing a feedback system for automatically adjusting the stamping height of the mechanical press;
[0013] FIG3 is an exemplary flowchart illustrating how the pressure system automatically adjusts the stamping height of the mechanical press;
[0014] FIG4 is a side view of a mechanical press, showing how automatic stamping height adjustment is achieved according to a first embodiment of the mechanical press;
[0015] FIG5 is a side view of a mechanical press, showing how automatic stamping height adjustment is achieved according to a second embodiment of the mechanical press. Detailed Description
[0016] FIG1 is a side view of an electronic device 100 whose pins 102 are formed by stamping with a mechanical press during the manufacturing process of the electronic device 100. The electronic device 100 is typically contained within a lead frame and located in the upper module of the mechanical press.Between upper module 10A and lower module 10B. Clamping members 12 of upper module 10A and lower module 10B clamp portions of pins 102 on both sides of electronic device 100. A forming punch 14 located near clamping member 12 presses down and punches the end of pin 102 relative to clamping member 12 until a punching height 18 is reached, thereby bending pin 102 and forming a Z-shape.
[0017] The depth to which the forming punch 14 presses into and punches pin 102 determines the lead angle 16 of pin 102. The lead angle 16 should be within a defined specification, which is typically determined by the punching depth or punching height 18. The lead angle 16 may change due to wear caused by repeated use of the mechanical press, such as wear on the surface of the forming punch 14. Therefore, it would be very beneficial if the punching depth or punching height could be automatically controlled to ensure that the lead angle 16 remains within the required specification without manual intervention.
[0018] FIG2 is an isometric view of a pressure system according to a preferred embodiment of the present disclosure, showing a feedback system for automatically adjusting the stamping height 18 of a mechanical press 20. The pressure system typically includes a mechanical press 20, an image sensor (e.g., a CCD camera 28), a fine-tuning motor controller 30, and a conveyor rail 24. The conveyor rail 24 is configured for bidirectional transport of lead frames 26 (and their electronics 100) from the locations of upper and lower modules 10A and 10B on the mechanical press 20 to the location of the CCD camera 28, and then to an unloading position (not shown) for removal of the lead frames 26 after processing. Each lead frame 26 typically contains multiple electronics 100 arranged in a matrix, whose pins 102 need to be formed at the mechanical press 20 during processing.
[0019] The mechanical press 20 includes a body casting 22 located at its top, which is supported by screws 23 and mounted on a plurality of columns 25. The body casting 22 is slidably movable on the plurality of columns 25 to adjust its position. Both the main body casting 22 and the lower module 10B can be driven to slide along the plurality of columns 25.
[0020] In this embodiment, the first module, namely the upper module 10A, is fixedly mounted on the main body casting 22 and remains relatively stationary during the stamping operation. On the other hand, the second module, namely the lower module 10B, is generally movable up and down relative to the upper module 10A, and its position is between the standby height (representing the maximum preset separation distance between the upper and lower modules 10A and 10B) and the stamping height 18. At the stamping height 18, the upper module 10A and / or the lower module 10B apply stamping force to the pins 102 of the electronic device 100. During the stamping operation, the lower module 10B is used to move from the standby height so that the electronic device 100 on the lead frame 26 reaches the stamping height 18 and contacts the forming punch 14, thereby bending the pins 102 by stamping, as shown in FIG1.
[0021] After the pin 102 is bent and formed on the mechanical press 20, the transfer rail 24 moves the lead frame 26 from the mechanical press 20 to below the CCD camera 28 so that the CCD camera 28 can detect the pin 102. The CCD camera 28 captures an image of the stamped pin 102 and transmits it to the fine-tuning motor controller 30. The fine-tuning motor controller 30 is used to determine whether the stamping height 18 needs to be adjusted based on the result of stamping the electronic device 100. In this embodiment, the fine-tuning motor controller 30 detects and optically determines whether the pin angle 106 of the pin 102 is within a predetermined specification. If it is determined that the pin angle 106 needs to be adjusted, the fine-tuning motor controller 30 can provide a signal to adjust the position of the body casting 22 to the necessary extent, thereby keeping the pin angle 106 within the required predetermined specification.
[0022] Figure 3 is an exemplary flowchart illustrating how the pressure system automatically adjusts the stamping height 18 of the mechanical press 20. After the lead frame 26 is formed by the mechanical press 20 and conveyed away from the mechanical press 20 (S32), the CCD camera 28 performs a visual inspection to check the quality of the pins 102 of the electronic device 100 (S34). Next, the fine-tuning motor controller 30 determines whether the quality of the lead frame 26 is acceptable (S36).
[0023] If the quality of the lead frame 26 is unacceptable, the fine-tuning motor controller 30 will automatically adjust the mechanical press 20 to ensure that the stamping depth or stamping height of the upper module 10A is sufficient to process the next lead frame 26 (S38). If the quality of the lead frame 26 is acceptable, no adjustment is required, and the lead frame 26 is conveyed to the next module (S40), such as the unloading module.
[0024] Figure 4 is a side view of the mechanical press 20, showing how automatic stamping height adjustment is achieved according to a first embodiment of the mechanical press 20. The mechanical press 20 has a mechanical press motor 42, which drives a press belt 44 connected to a press pulley, thereby causing the press pulley 46 to rotate. The rotation of the press pulley 46 in turn drives a crank 48, which is used to lift and lower the lower platen 50 on which the lower module 10B is mounted. When the lead frame 26 is placed between the upper module 10A and the lower module 10B, the lower platen 50 lifts the lower module 10B toward the upper module 10A, while the upper module 10A remains relatively stationary. The lower module 10B will continue to lift until the forming punch 14 on the upper module 10A completely bends the pin 102 on the electronic device 100.
[0025] In addition, the body casting 22 is configured to be adjustable along the support column 25 supporting it. For this purpose, an extension arm 52 extends from the body casting 22. The extension arm 52 is connected via a pulley 56 to a fine-tuning belt 54 driven by a fine-tuning motor 58, thereby operably connecting the fine-tuning motor 58 to the main casting 22. In this way, the fine-tuning motor 58 can adjust the position of the main casting 22, thereby...The maximum preset separation distance between the upper and lower modules 10A and 10B (the distance is related to the standby height of the lower module 10B) is changed, thereby automatically changing the stamping position 18 so that the upper module 10A and / or the lower module 10B can be used to stamp the subsequent electronic device 100.
[0026] After the CCD camera 28 captures an image of the lead frame 26, the fine-tuning motor controller 30 processes the image to determine whether the forming of the pin 102 meets the required size specifications. For example, if it is determined after a period of use that the stamping height 18 needs to be increased, the fine-tuning motor controller 30 sends a signal to the fine-tuning motor 58 to drive the fine-tuning motor 58 to adjust the position of the body casting 22. When the stamping height 18 needs to be increased, the fine-tuning motor 58 will operate, as shown in FIG4, driving the conveyor belt to rotate clockwise, thereby lowering the extension arm 52, so that the body casting 22 and the upper module 10A mounted on it are closer to the lower module 10B. Therefore, the penetration force of the forming punch 14 relative to the lower die 10B on the pin 102 will increase, thereby increasing the stamping height 18.
[0027] FIG5 is a side view of the mechanical press 20, showing how automatic stamping height adjustment is achieved according to a second embodiment of the mechanical press 20. In this embodiment, the extension arm 52 extending from the body casting 22 is connected to the ball screw 60 instead of the fine-tuning belt 54. The ball screw 60 is driven to rotate by the fine-tuning motor 62 (e.g., a stepper motor), thereby raising and lowering the extension arm 52. Similar to the previous embodiment, the raising and lowering of the extension arm 52 will correspondingly raise and lower the body casting 22 along the column 25 supporting the body casting 22.
[0028] In this embodiment, after the CCD camera 28 captures an image of the lead frame 26, the fine-tuning motor controller 30 processes the image to determine whether the forming of the pin 102 meets the required specifications. If it is determined that the stamping height 18 needs to be increased, the fine-tuning motor controller 30 sends a signal to the fine-tuning motor 62. When the stamping height 18 needs to be increased, the fine-tuning motor 62 rotates the ball screw 60, causing the extension arm 52 connected to it to descend. As a result, the casting 22 and the upper die 10A mounted on it will be closer to the lower die 10B. Consequently, the penetration depth of the forming punch 14 relative to the lower die 10B to the pin 102 increases, thereby increasing the stamping height 18.
[0029] In addition to the electronic device 100 described in FIG. 1, embodiments of this disclosure can also be used to stamp other dedicated lead frames, such as the dedicated lead frames described in US Patent No. 11,264,310.
[0030] In addition to optical or visual inspection of the lead frame 26, those skilled in the art will understand that data feedback can also be provided to the fine-tuning motor controller 30 in other ways, for example, when the upper die 10A and / or the lower die 10B clamp the lead frame.When pin 102 is engaged, the fine-tuning motor controller 30 can measure the reaction force on pin 102 of electronic device 100. Alternatively, the fine-tuning motor controller 30 can measure feedback on the relative positions of upper and lower modules 10A and 10B when the upper module 10A and / or lower module 10B clamps pin 102 of electronic device 100. Other measurement methods may also be used. Based on this data feedback, the fine-tuning motor controller 30 can provide signals to adjust the position of body casting 22, thereby adjusting the stamping height 18.
[0031] It should be understood that the pressure system according to the preferred embodiment of this disclosure can continuously automate without human intervention, thereby maintaining the quality of the processed lead frame 26. Therefore, production can be increased and product quality can be maintained.
[0032] Various changes, modifications and / or additions may be made to the invention described herein, and it is not limited to the specific descriptions. It should be understood that this disclosure includes all variations, modifications and / or additions falling within the spirit and scope of the foregoing description. Instruction manual, page 4 / 4, CN 122298887 A, Figure 1, Figure 2; Instruction manual, Figure 1 / 3, page 8, CN 122298887 A, Figure 3, Figure 4; Instruction manual, Figure 2 / 3, page 9, CN 122298887 A, Figure 5; Instruction manual, Figure 3 / 3, page 10, CN 122298887 AA. A press system for punching multiple leads of an electronic device and a method for manufacturing electronic devices are provided in embodiments of the present disclosure. The press system includes a body casting onto which a first die set is fixedly attached, and a second die set which is drivable to move relative to the first die set between a standby level where the first and second die sets are at a preset separation distance and a punch level where a punching force is applied onto the leads of...the electronic device by the first and / or second die sets. A fine-tuning motor operatively coupled to the body casting is operative to adjust a position of the body casting to vary the preset separation distance between the first and second die sets, whereby to automatically vary the punch level for punching a subsequent electronic device using the first and second die sets.
Claims
1. A pressure system for punching a plurality of pins of an electronic device, characterized by, The pressure system includes: A main body casting, on which a first module is fixedly installed; A second module, which can be driven to move relative to the first module between a standby height and a stamping height, wherein at the standby height, the first module and the second module are located at a preset separation distance, and at the stamping height, the first module and / or the second module apply stamping force to the plurality of pins of the electronic device; and A fine-tuning motor is operably connected to the body casting. The fine-tuning motor is used to adjust the position of the body casting to change the preset separation distance between the first module and the second module, thereby automatically changing the stamping height so that the first module and the second module can be used to stamp subsequent electronic devices.
2. The pressure system as described in claim 1, characterized in that, It also includes a fine-tuning motor controller configured to determine whether the stamping height should be changed based on the results of the stamping electronics.
3. The pressure system as described in claim 2, characterized in that, The fine-tuning motor controller is used to provide signals to the fine-tuning motor to drive the fine-tuning motor to adjust the position of the body casting.
4. The pressure system as described in claim 2, characterized in that, The fine-tuning motor controller is configured to determine whether the stamping height should be changed by measuring the reaction force from the pins of the electronic device when the first module and / or the second module clamps the pins.
5. The pressure system as described in claim 2, characterized in that, The fine-tuning motor controller is configured to determine whether the stamping height should be changed by measuring the relative positions of the first module and the second module when the first module and / or the second module clamp the pins of the electronic device.
6. The pressure system as described in claim 2, characterized in that, It also includes an image sensor for acquiring images of the pins stamped out by the first module and / or the second module for inspection.
7. The pressure system as described in claim 6, characterized in that, It also includes a transport rail for transporting the electronic device from the positions of the first module and the second module to the position of the image sensor.
8. The pressure system as described in claim 6, characterized in that, The fine-tuning motor controller is configured to determine whether the stamping height should be changed by examining the image of the pin.
9. The pressure system as claimed in claim 1, characterized in that, The second module is driven to move by a stamping motor, while the first module is relatively stationary, such that the second module is configured to move from the standby height to the stamping height to stamp the pins of the electronic device.
10. The pressure system as claimed in claim 1, characterized in that, The main body casting is mounted on and supported by multiple columns. Both the main body casting and the second module can be driven to move along the multiple columns to adjust the position of the main body casting.
11. The pressure system as claimed in claim 1, characterized in that, It also includes an extension arm extending from the main body casting, the fine-tuning motor being connected to the extension arm for adjusting the position of the main body casting.
12. The pressure system as claimed in claim 11, characterized in that, The extension arm is connected to a fine-tuning belt, which is driven by the fine-tuning motor via pulleys.
13. The pressure system as claimed in claim 11, characterized in that, The extension arm is connected to a ball screw, which can be rotated by the fine-tuning motor to adjust the position of the main body casting.
14. A method for manufacturing an electronic device, characterized in that, The method of manufacturing the electronic device by stamping multiple pins of the electronic device in a pressure system includes: The first module is fixedly connected to the main body casting; The second module is driven to move relative to the first module between a standby height and a stamping height. At the standby height, the first module and the second module are located at a preset separation distance. At the stamping height, the first module and / or the second module apply stamping force to multiple pins of the electronic device. By adjusting the position of the body casting via a fine-tuning motor operably connected to the body casting, the preset separation distance between the first module and the second module is changed, thereby automatically changing the stamping height so that the first module and the second module can be used to stamp subsequent electronic equipment; and The subsequent electronic equipment is stamped at the changed stamping height.