SOLDER ALLOYS, SOLDER PASTE, SOLDER BALLS, PRE-FORMED SOLDER, AND SOLDER JOINTS

Abstract

[Problem] Provided are a solder alloy, a solder paste, a solder ball, a solder preform, and a solder joint having superior drop impact resistance and heat cycle resistance, suppressing the occurrence of standing chips, bridges and icicles, and also suppressing the occurrence of electromigration. [Solution] A solder alloy has an alloy composition comprising, on a mass % basis, Ag: 0.3 to 1.9%, Cu: 0.40 to 1.00%, Bi: 0.5 to 4.9%, P: 0.00100 to 0.02000%, with the remainder being Sn. The alloy composition may further contain, on a mass % basis, each of Ge, Co and Ga in an amount of 0.06% or less, and at least one. In addition, the alloy composition may further contain, on a mass % basis, each of As, In, Zr, Mn, Ti, Zn, Fe, Al, Ni, Au, Mg, Cr and Pt in an amount of 0.06% or less, and at least one.