Cooling system comprising a condenser and two-phase cold plates plumbed in parallel

Abstract

A cooling system can include a horizonal supply manifold configured to supply a refrigerant received from a pump in liquid form, a first vertical manifold configured to receive the refrigerant from the supply manifold, a horizontal return manifold configured to supply the refrigerant to a condenser, a second vertical manifold configured to supply the refrigerant to the return manifold, and a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold. Each cold plate can be thermally coupled to a processor or other heat source within a computer equipment rack or cabinet. The internal volume of the return manifold can function as a vapor receiver to accommodate changes in vapor volume, such as in response to changes in the thermal load of the system.

Description

PUMPED TWO-PHASE CHARGE MANAGEMENTCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 605,494 filed December 2, 2023, the entire contents of which are incorporated herein by reference.TECHNICAL FIELD

[0002] The present disclosure relates generally to pumped two-phase cooling systems, such as those used with high density computer equipment in data centers, and more specifically relates to charge management for pumped two-phase cooling systems.BACKGROUND

[0003] Two-phase direct to chip liquid cooling can have the high heat transfer coefficients necessary to cool Machine Learning I Artificial Intelligence (ML / AI) High Performance Compute (HPC) servers. For example, some systems replace air to refrigerant evaporators with chip mounted two-phase cold plates.

[0004] Closed loop phase-change thermal transport processes can involve relatively constant vapor and liquid volumes that change location in response to changes in the thermal load of the system. Thus, such systems often require some sort of receiver to accommodate changes in vapor volume location. Pumping units for such systems can include such vapor receivers and can be located within a row of computer equipment racks or cabinets. However, locating such vapor receivers in pumping units or in otherwise dedicated space within a row of computer equipment occupies space that could otherwise be utilized for more computer equipment, or otherwise used more efficiently.SUMMARY

[0005] Applicant has created new and useful devices, systems and methods for pumped two-phase cooling systems, such as for charge management of pumped two-phase cooling systems. In at least one embodiment, a system according to the disclosure can help minimize pumping unit size and / or maximize density in a cooling aisle or row, such as by including a return manifold disposed at least partially above computer equipment racks or cabinets. The return manifold can be plumbed fluidically between a plurality of two-phase cold plates and a condenser, and can be configured to accommodate changes in vapor volume as a thermal load of the system varies. In at least one embodiment, the charge management aspects of the present disclosure can provide for any of various advantages, such as improved vapor location and pressure management and / or minimizing the overall liquid refrigerant volume required for a given cooling capacity or implementation of the disclosure. In at least one embodiment, the return internal volume can be configured to accommodate displaced liquid volume during system operations sufficiently to avoid adverse pressure conditions in the condenser.

[0006] In at least one embodiment, a cooling system can include a horizonal supply manifold configured to supply a refrigerant received from a pump in liquid form, a first vertical manifold configured to receive the refrigerant from the supply manifold, a horizontal return manifold configured to supply the refrigerant to a condenser, a second vertical manifold configured to supply the refrigerant to the return manifold, a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold, or any combination thereof. In at least one embodiment, each cold plate can be thermally coupled to a processor or other heat source disposed within a computer equipment rack or cabinet. In at least one embodiment, the return internal volume, of the return manifold, can be or constitute a vaporreceiver and accommodate changes in vapor volume, such as in response to changes in the thermal load of the system.

[0007] In at least one embodiment, the horizonal supply manifold can have a supply internal volume. In at least one embodiment, the first vertical manifold can have a first internal volume. In at least one embodiment, the horizontal return manifold can have a return internal volume. In at least one embodiment, the second vertical manifold can have a second internal volume. In at least one embodiment, the plurality of two-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume, of the return manifold, can be more than a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1 .5 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1.7 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume and the collective internal cold plate volume.

[0008] In at least one embodiment, a cooling system can include a plurality of two-phase hoses connecting the cold plates to the second vertical manifold. In at least one embodiment, the plurality of hoses can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more than a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .5 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hosevolume. In at least one embodiment, the return internal volume can be more than 1.7 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or twice, a sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume and a collective internal volume of any piping in fluid communication between the second vertical manifold and the return manifold.

[0009] In at least one embodiment, the return manifold can be sized or otherwise configured to receive vapor (e.g., at a vapor flow rate) from the cold plates, such as upstream of the condenser, when some or most of the refrigerant flow is in a vapor phase. In at least one embodiment, the return manifold can be sized or otherwise configured to receive vapor from the cold plates, such as between the cold plates and the condenser, at full system heat load, when most of the refrigerant flow is in a vapor phase, plus a volume of liquid equal to the sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume, or any combination thereof.

[0010] In at least one embodiment, the return manifold can include an outlet port sized to accommodate a rated flow of the refrigerant at no system heat load, when the refrigerant flow is in a liquid phase. In at least one embodiment, the return manifold has a larger internal cross sectional area than the outlet port. In at least one embodiment, the return manifold can include one or more sightglasses configured to allow visual observation of a liquid level of the refrigerant within the return manifold. In at least one embodiment, the liquid level of the refrigerant within the return manifold can be even with a top of the outlet port at no system heat load, when the refrigerant flow is in a liquid phase. In at least one embodiment, the liquid level of the refrigerant within the return manifold can occupy less than one quarter of the internal cross sectional area of the return manifold at full system heat load, when most of the refrigerant flow is in a vapor phase.

[0011] In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, the return manifold can be positioned at or above the supply manifold. In at least one embodiment, there can be some vertical overlap between the return manifold and the supply manifold. In at least one embodiment, the return internal volume can be distributed across multiple pipes, with one or more of the pipes being positioned at the supply manifold and / or with one or more of the pipes being positioned above the supply manifold.

[0012] In at least one embodiment, a cooling system can include a horizonal supply manifold configured to supply a refrigerant received from a pump in liquid form, a first vertical manifold configured to receive the refrigerant from the supply manifold, a horizontal return manifold configured to supply the refrigerant to a condenser, a second vertical manifold configured to supply the refrigerant to the return manifold, a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold, or any combination thereof. In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, any or all of the return manifold can be positioned at or above the supply manifold.

[0013] In at least one embodiment, the horizonal supply manifold can have a supply internal volume. In at least one embodiment, the first vertical manifold can have a first internal volume. In at least one embodiment, the horizontal return manifold can have a return internal volume. In at least one embodiment, the second vertical manifold can have a second internal volume. In at least one embodiment, the plurality of two-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the first internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the supply internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the supply internal volume, the first internal volume, the second internal volume, and the collective internal cold plate volume.

[0014] In at least one embodiment, a cooling system can include a plurality of computer equipment racks, a horizonal supply manifold having a supply internal volume spanning the computer equipment racks, and a horizontal return manifold having a return internal volume spanning the computer equipment racks. In at least one embodiment, each computer equipment rack can include a first vertical manifold having a first internal volume, a second vertical manifold having a second internal volume, and a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold. In at least one embodiment, the plurality oftwo-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volumes and the collective internal cold plate volumes.

[0015] In at least one embodiment, the horizonal supply manifold can be configured to supply a refrigerant received from a pump to each first vertical manifold. In at least one embodiment, the horizontal return manifold can be configured to supply the refrigerant received from each second vertical manifold to a condenser. In at least one embodiment, the return internal volume can be positioned above the supply internal volume. In at least one embodiment, the return manifold can be positioned above the supply manifold.

[0016] In at least one embodiment, each computer equipment rack can include a plurality of two-phase hoses connecting the cold plates to the second vertical manifold. In at least one embodiment, the plurality of hoses can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more than, such as 1.5 times, 1.7 times, 1.9 times, or at least twice, a sum of the second internal volumes, the collective internal cold plate volumes, and the collective internal hose volumes.BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG. 1 is a perspective view of one of many embodiments of a row of computer equipment racks or cabinets according to the disclosure.

[0018] FIG. 2 is a diagram of one of many embodiments of a cooling system according to the disclosure.

[0019] FIG. 3 is a close-up cut-away view of a portion of the cooling system of FIG. 2.

[0020] FIGS. 4-11 are positioning diagrams of supply and return manifolds of one of many embodiments of a cooling system according to the disclosure.

[0021] FIG. 12 is a diagram of a sight glass arrangement of one of many embodiments of a cooling system according to the disclosure.

[0022] FIG. 13 is a diagram of another sight glass arrangement of one of many embodiments of a cooling system according to the disclosure.DETAILED DESCRIPTION

[0023] The figures described above and the written description of specific structures and functions below are not presented to limit the scope of what Applicant has invented or the scope of the appended claims. Rather, the figures and written description are provided to teach any person skilled in the art to make and use the inventions for which patent protection is sought. Those skilled in the art will appreciate that not all features of a commercial embodiment of the inventions are described or shown for the sake of clarity and understanding. Persons of skill in this art will also appreciate that the development of an actual commercial embodiment incorporating aspects of the present inventions will require numerous implementation-specific decisions to achieve the developer’s ultimate goal for the commercial embodiment. Such implementation-specific decisions may include, and likely are not limited to, compliance with system- related, business-related, government-related and other constraints, which may vary by specific implementation, location and from time to time. While a developer’s efforts might be complex and time-consuming in an absolute sense, such efforts would be, nevertheless, a routine undertaking for those of skill in this art having benefit of this disclosure. It must be understood that the inventions disclosed and taught herein are susceptible to numerous and various modifications and alternative forms.

[0024] The use of a singular term, such as, but not limited to, “a,” is not intended as limiting of the number of items. Also, the use of relational terms, such as, but not limited to, “top,” “bottom,” “left,” “right,” “upper,” “lower,” “down,” “up,” “side,” and the like are used in the written description for clarity in specific reference to the figures and are not intended to limit the scope of the inventions or the appended claims. The terms “including” and “such as” are illustrative and not limitative. The terms “couple,” “coupled,” “coupling,” “coupler,” and like terms are used broadly herein and can include any method or device for securing, binding, bonding, fastening, attaching, joining, inserting therein, forming thereon or therein, communicating, or otherwise associating, for example, mechanically, magnetically, electrically, chemically, operably, directly or indirectly with intermediate elements, one or more pieces of members together and can further include without limitation integrally forming one functional member with another in a unity fashion. The coupling can occur in any direction, including rotationally. Further, all parts and components of the disclosure that are capable of being physically embodied inherently include imaginary and real characteristics regardless of whether such characteristics are expressly described herein, including but not limited to characteristics such as axes, ends, inner and outer surfaces, interior spaces, tops, bottoms, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume and density, among others.

[0025] Any process flowcharts discussed herein illustrate the operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in a flowchart may represent a module, segment, or portion of code, which can comprise one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some implementations, the function(s) noted in the block(s) might occur out of the order depicted in thefigures. For example, blocks shown in succession may, in fact, be executed substantially concurrently. It will also be noted that each block of flowchart illustration can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

[0026] Applicant has created new and useful devices, systems and methods for pumped two-phase cooling systems, such as for charge management of pumped two-phase cooling systems. Two-phase cooling systems can require a vapor receiver, or tank, to accommodate changes in vapor volume location as a system’s heat load changes. In at least one embodiment, a cooling system according to the disclosure can position a vapor receiver, or tank, above the computer equipment and / or across multiple computer equipment racks or cabinets, thereby freeing up space for additional computer equipment racks or cabinets, rather than dedicating valuable space within a row of computer equipment racks or cabinets to a vapor receiver, or tank. In at least one embodiment, a system according to the disclosure can help minimize pumping unit size and / or maximize density in a cooling aisle or row, thereby helping maximize cooling capacity and cost effectiveness per unit of available space. In at least one embodiment, a cooling system according to the disclosure can include a return manifold disposed f lu id ically between an evaporator, such as one or more cold plates, and a condenser, and configured to accommodate changes in vapor volume as a thermal load of the system varies. In at least one embodiment, the charge management aspects of the present disclosure can provide for any of various advantages, such as improved vapor location and pressure management and / or minimizing the overall liquid refrigerant volume required for a given cooling capacity or implementation of the disclosure. In at least one embodiment, the return internal volume can be configured to accommodate displaced liquid volume during system operations sufficiently toavoid adverse pressure conditions in the condenser. In at least one embodiment, a return internal volume of the return manifold can be configured as the sole vapor receiver in the system.

[0027] FIG. 1 is a perspective view of one of many embodiments of a row of computer equipment racks or cabinets according to the disclosure. FIG. 2 is a diagram of one of many embodiments of a cooling system according to the disclosure. FIG. 3 is a close-up cut-away view of a portion of the cooling system of FIG. 2. FIGS. 4-11 are positioning diagrams of supply and return manifolds of some of many embodiments of a cooling system according to the disclosure. FIG. 12 is a diagram of a sight glass arrangement of one of many embodiments of a cooling system according to the disclosure. FIG. 13 is a diagram of another sight glass arrangement of one of many embodiments of a cooling system according to the disclosure. FIGS. 1-13 are described in conjunction with one another.

[0028] In at least one embodiment, a cooling system 100 according to the disclosure can include one or more horizonal supply manifolds 102 configured to supply a refrigerant received from a pump or pump unit 104, such as in liquid form, one or more first vertical manifolds 106 configured to receive the refrigerant from the supply manifold 102, one or more horizontal return manifolds 108 configured to supply the refrigerant to one or more condensers 130 (e.g., brazed plate heat exchanger(s)), one or more second vertical manifolds 110 configured to supply the refrigerant to the return manifold 108, a plurality of two-phase cold plates 112 plumbed in parallel with one another fluidically between the first vertical manifold 106 and the second vertical manifold 110, or any combination thereof. In at least one embodiment, each cold plate 112 can be thermally coupled to a processor, processing unit, or other heat source within one or more computer equipment racks or cabinets 114. In at least one embodiment, aninternal volume, such as a return internal volume, of the return manifold 108 can be configured to act or function as a vapor receiver for accommodating changes in vapor volume, such as in response to changes in the thermal load of the system 100 during cooling operations. In at least one embodiment, at least a portion of the return manifold 108, and thus of the vapor receiver, can be located above the computer equipment mounted to the racks or cabinets 114. Thus, in at least one embodiment, the vapor receiver(s) or vapor tank(s) need not occupy valuable space within a pump unit 104 or elsewhere in a row of computer equipment racks or cabinets 114, which can thereby help maximize cooling density.

[0029] In at least one embodiment, both the supply manifold 102 and the return manifold 108 are perfectly level horizontally. In at least one embodiment, the supply manifold 102 and / or the return manifold 108 are at least substantially level horizontally. In at least one embodiment, the system 100 and / or the racks 114 can include adjustment features for leveling the supply manifold 102 and / or the return manifold 108.

[0030] In at least one embodiment, a cooling system 100 according to the disclosure can include one or more pumps, or pumping units, 104 configured to pump the refrigerant in liquid form, one or more condensers 130 configured to cool the refrigerant and thereby convert the refrigerant received in vapor form to liquid form, control equipment configured to control various elements of the system 100, hoses and / or piping to fluidically couple any of various elements of the system 100, one or more flow regulators, such as to ensure constant volume flow rates, one or more computer equipment racks or cabinets 114, or any combination thereof.

[0031] In at least one embodiment, the refrigerant can be pumped by one or more of the pumps or pumping units 104, and can be in liquid form (or phase) upstream of the cold plates 112. Depending on a thermal load of the system 100,a portion of the refrigerant will turn to vapor in extracting heat from the cold plates 112, and thus from the processors or other heat sources cooled by the cold plates 112. For example, at full system heat load, most or all of the refrigerant can be in a vapor phase upon leaving the cold plates 112, and at no system heat load, most or all of the refrigerant can be in a liquid phase upon leaving the cold plates 112.

[0032] In at least one embodiment, the horizonal supply manifold 102 can have a supply internal volume. In at least one embodiment, the first vertical manifold 106 can have a first internal volume. In at least one embodiment, the horizontal return manifold 108 can have a return internal volume. In at least one embodiment, the second vertical manifold 110 can have a second internal volume. In at least one embodiment, the plurality of two-phase cold plates 112 can have a collective internal cold plate volume. In at least one embodiment, the return internal volume, of the return manifold 108, can be more than a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1.5 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1.7 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return manifold 108 and the return internal volume can be sized and configured for receiving enough vapor during cooling operations so as to minimize the size of, or eliminate, any vapor receiver or vapor tank other than the return manifold 108 within the system.

[0033] In at least one embodiment, a cooling system 100 according to the disclosure can include a plurality of supply hoses 116 connecting respective ones of the cold plates 112 to the first vertical manifold 106. In at least one embodiment, a cooling system 100 according to the disclosure can include a plurality of two-phase return hoses 118 connecting respective ones of the cold plates 112 to the second vertical manifold 110. In at least one embodiment, the plurality of return hoses 118 can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more than a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1.5 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .7 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than, such as 1.5 times, 1.7 times, 1.9 times, or twice, a sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume and a collective internal volume of any piping in fluid communication between the second vertical manifold 110 and the return manifold 108. For example, the second vertical manifold 110 and the return manifold 108 need not be directly coupled, and there may be a length of pipe(s) in fluid communication between the second vertical manifold 110 and the return manifold 108. In at least one embodiment, the return internal volume canbe more than, such as 1.5 times, 1.7 times, 1.9 times, or twice, a sum of the internal volume of the cold plates 112 and the internal volumes between the cold plates 112 and the return manifold 108. In at least one embodiment, the return internal volume can be from 10 percent to 100 percent (or more) larger than a sum of the internal volume of the cold plates 1 12 and the internal volumes between the cold plates 112 and the return manifold 108.

[0034] In at least one embodiment, the return manifold 108 can be sized or otherwise configured to receive vapor from the cold plates 112, such as upstream of the condenser 130, which can include when some or most (or all) of the refrigerant flow is in a vapor phase. In at least one embodiment, the return manifold 108 can be sized or otherwise configured to receive vapor from the cold plates 1 12, such as fluidically between the cold plates 112 and the condenser 130, at full system heat load, when most of the refrigerant flow is in a vapor phase, plus a volume of liquid equal to, or greater than, the sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume, or any combination thereof.

[0035] In at least one embodiment, the return manifold 108 can include one or more sight glasses 120 configured to allow visual observation of a liquid level of the refrigerant within the return manifold. In at least one embodiment, the return manifold 108 can include a single sight glass 120 spanning most or all of the return manifold 108, such as shown in FIG. 12. In at least one embodiment, the return manifold 108 can include a plurality of sight glasses 120, each spanning a portion of the height of the return manifold 108, such as shown in FIG. 13.

[0036] In at least one embodiment, the return manifold 108 can include one or more outlet ports 122 sized to accommodate flow, such as a rated flow of the refrigerant at no system heat load, when the refrigerant flow is in a liquid phase.In at least one embodiment, the return manifold 108 can have a larger internal cross sectional area than the outlet port 122. In at least one embodiment, the liquid level of the refrigerant within the return manifold 108 can be even with a top of the outlet port at no system heat load, when the refrigerant flow is in a liquid phase. In at least one embodiment, the liquid level of the refrigerant within the return manifold 108 can occupy less than half, less than one quarter, less than one fifth, or less than one tenth of the internal cross sectional area of the return manifold 108 at full system heat load, when most of the refrigerant flow is in a vapor phase. In at least one embodiment, the liquid level of the refrigerant within the return manifold 108 can be proportional to the system heat load, such that as the system heat load increases between no system heat load and full system heat load, the liquid level of the refrigerant within the return manifold 108 increases from at or near a bottom of the outlet port 122 to at or near a top of the outlet port 122.

[0037] In at least one embodiment, a cooling system 100 according to the disclosure can be charged until one or more sight glasses 120 indicate that the liquid level in the return manifold 108 is even with a top of the outlet port 122 of the return manifold 108. In at least one embodiment, the remaining space within the return manifold 108 can be or constitute a vapor receiver for accommodating changes in vapor volume as the system’s heat load changes. For example, in at least one embodiment, as the system’s heat load increases, more of the refrigerant can turn to vapor in the cold plates 112, thereby displacing liquid refrigerant and increasing the liquid level in the return manifold 108, and the return manifold 108 can be sized to accommodate the displaced liquid volume. In at least one embodiment, a cooling system 100 according to the disclosure can thereby control or minimize pressure increases in the system 100 (and specifically in the condenser 130) as the system’s heat load increases. In at least one embodiment, a cooling system 100 according to the disclosure can therebyinclude a vapor receiver, or tank, positioned above the computer equipment and / or across multiple computer equipment racks or cabinets 114, thus freeing up space for additional computer equipment racks or cabinets 114, rather than dedicating valuable space within a row of computer equipment racks or cabinets 114 to a vapor receiver, or tank. In at least one embodiment, a cooling system 100 according to the disclosure can include one or more vapor receivers or tanks fluidically between the cold plates 112 and the condenser 130. In at least one embodiment, a cooling system 100 according to the disclosure can include one or more vapor receivers or tanks fluidically between one or more evaporators and one or more condensers.

[0038] In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, the return manifold 108 can be positioned at or above the supply manifold 102. In at least one embodiment, there can be some vertical overlap between the return manifold 108 and the supply manifold 102. In at least one embodiment, the return manifold 108 can be vertically centered on the supply manifold 102. In at least one embodiment, the return manifold 108 and the supply manifold 102 can be positioned such that the lowest points of each are vertically aligned, or at the same elevation, as shown in FIG. 4. In at least one embodiment, the return manifold 108 and the supply manifold 102 can be positioned such that a lowest point of the supply manifold 102 is lower than a lowest point of the return manifold 108, as shown in FIG. 5. In at least one embodiment, the return internal volume can be positioned above the supply internal volume, but there can be some overlap in the return manifold 108 and the supply manifold 102, such as due to pipe thicknesses, as shown in FIG. 6. In at least one embodiment, the return manifold 108 can be positioned completely above the supply manifold 102, as shown in FIG. 7. Of course, the embodiments shown in the figures are illustrative, and are not limitative.

[0039] In at least one embodiment, the return internal volume can be distributed across one, two, three, or more pipes or other conduits, such as parallel plumbed pipes, with one or more of the pipes being positioned at or near the same elevation as the supply manifold 102 and / or with one or more of the pipes being positioned above the supply manifold 102. In at least one embodiment, such as where multiple pipes are utilized to form the return manifold 108, the pipes of the return manifold 108 can be the same size, or different than, the supply manifold 102. In at least one embodiment, pipes of the return manifold 108 and the supply manifold 102 can be positioned such that the lowest points of each are vertically aligned, or at the same elevation, as shown in FIG. 8. In at least one embodiment, the pipes of the return manifold 108 and the supply manifold 102 can be positioned such that a lowest point of the supply manifold 102 is lower than a lowest point of the return manifold 108, as shown in FIG. 9. In at least one embodiment, the return internal volume can be positioned above the supply internal volume, but there can be some overlap in the pipes of the return manifold 108 and the supply manifold 102, such as due to pipe thicknesses, as shown in FIG. 10. In at least one embodiment, the pipes of the return manifold 108 can be positioned completely above the supply manifold 102, as shown in FIG. 1 1. Of course, the embodiments shown in the figures are illustrative, and are not limitative.

[0040] In at least one embodiment, a cooling system 100 according to the disclosure can include a horizonal supply manifold 102 configured to supply a refrigerant received from a pump 104 in liquid form, a first vertical manifold 106 configured to receive the refrigerant from the supply manifold 102, a horizontal return manifold 108 configured to supply the refrigerant to a condenser 130, a second vertical manifold 110 configured to supply the refrigerant to the return manifold, a plurality of two-phase cold plates 112 plumbed in parallel with one another in fluid communication between the first vertical manifold 106 and thesecond vertical manifold 110, or any combination thereof. In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, any or all of the return manifold 108 can be positioned at or above the supply manifold 102.

[0041] In at least one embodiment, the horizonal supply manifold 102 can have a supply internal volume. In at least one embodiment, the first vertical manifold 106 can have a first internal volume. In at least one embodiment, the horizontal return manifold 108 can have a return internal volume. In at least one embodiment, the second vertical manifold 110 can have a second internal volume. In at least one embodiment, the plurality of two-phase cold plates 112 can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, a sum of the first internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1.5 times, 1.7 times, 1 .9 times, or at least twice, a sum of the supply internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1.5 times, 1.7 times, 1 .9 times, or at least twice, a sum of the supply internal volume, the first internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1.5 times, 1.7 times, 1.9 times, or at least twice, a sum of the internal volume of the cold plates 112 and the internal volumes between the cold plates 112 and the return manifold 108. The ratios mentioned herein are exemplary and not exclusive, and can vary from one implementation of the disclosure to another, such as anywhere within the rangeof 1 .5 times to more than 2 times, or as otherwise required or desired for a given implementation at hand.

[0042] In at least one embodiment, a cooling system 100 according to the disclosure can include a plurality of computer equipment racks 114, a horizonal supply manifold 102 having a supply internal volume spanning the computer equipment racks 114, and a horizontal return manifold 108 having a return internal volume spanning the computer equipment racks 114. In at least one embodiment, each computer equipment rack 114 can include a first vertical manifold 106 having a first internal volume, a second vertical manifold 110 having a second internal volume, and a plurality of two-phase cold plates 112 plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold. In at least one embodiment, the plurality of two-phase cold plates 112 can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volumes and the collective internal cold plate volumes. In at least one embodiment, the return internal volume can be configured to accommodate displaced liquid volume during system operations sufficiently to avoid adverse pressure conditions in the condenser 130. In at least one embodiment, the return internal volume of the return manifold 108 can be configured as the sole vapor receiver in the system.

[0043] In at least one embodiment, the horizonal supply manifold 102 can be configured to supply a refrigerant received from a pump 104 to each first vertical manifold 106. In at least one embodiment, the horizontal return manifold 108 can be configured to supply the refrigerant received from each second vertical manifold 110 to a condenser 130. In at least one embodiment, the return internal volume can be positioned above the supply internal volume. In at leastone embodiment, the return manifold 108 can be positioned above the supply manifold 102.

[0044] In at least one embodiment, each computer equipment rack 114 can include a plurality of two-phase hoses 118 connecting the cold plates 112 to the second vertical manifold 110. In at least one embodiment, the plurality of hoses 118 can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, a sum of the second internal volumes, the collective internal cold plate volumes, and the collective internal hose volumes.

[0045] In at least one embodiment, a cooling system can include a horizonal supply manifold configured to supply a refrigerant received from a pump in liquid form, a first vertical manifold configured to receive the refrigerant from the supply manifold, a horizontal return manifold configured to supply the refrigerant to a condenser, a second vertical manifold configured to supply the refrigerant to the return manifold, a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold, or any combination thereof. In at least one embodiment, each cold plate can be thermally coupled to a processor, or other heat source within a computer equipment rack or cabinet. In at least one embodiment, the return internal volume, of the return manifold, can be or constitute a vapor receiver and accommodate changes in vapor volume location, such as in response to changes in the thermal load of the system.

[0046] In at least one embodiment, the horizonal supply manifold can have a supply internal volume. In at least one embodiment, the first vertical manifold can have a first internal volume. In at least one embodiment, the horizontal return manifold can have a return internal volume. In at least one embodiment, the second vertical manifold can have a second internal volume. In at least oneembodiment, the plurality of two-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume, of the return manifold, can be more than a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1 .5 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1.7 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume and the collective internal cold plate volume.

[0047] In at least one embodiment, a cooling system can include a plurality of two-phase hoses connecting the cold plates to the second vertical manifold. In at least one embodiment, the plurality of hoses can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more than a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .5 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1.7 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be more than 1 .9 times a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, thereturn internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or twice, a sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume and a collective internal volume of any piping in fluid communication between the second vertical manifold and the return manifold.

[0048] In at least one embodiment, the return manifold can be sized or otherwise configured to receive vapor from the cold plates, such as upstream of the condenser, when some or most of the refrigerant flow is in a vapor phase. In at least one embodiment, the return manifold can be sized or otherwise configured to receive vapor from the cold plates, such as between the cold plates and the condenser, at full system heat load, when most of the refrigerant flow is in a vapor phase, plus a volume of liquid equal to the sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume, or any combination thereof.

[0049] In at least one embodiment, the return manifold can include an outlet port sized to accommodate a rated flow of the refrigerant at no system heat load, when the refrigerant flow is in a liquid phase. In at least one embodiment, the return manifold has a larger internal cross sectional area than the outlet port. In at least one embodiment, the return manifold can include one or more sight glasses configured to allow visual observation of a liquid level of the refrigerant within the return manifold. In at least one embodiment, the liquid level of the refrigerant within the return manifold can be even with a top of the outlet port at no system heat load, when the refrigerant flow is in a liquid phase. In at least one embodiment, the liquid level of the refrigerant within the return manifold can occupy less than one quarter of the internal cross sectional area of the return manifold at full system heat load, when most of the refrigerant flow is in a vapor phase.

[0050] In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, the return manifold can be positioned at or above the supply manifold. In at least one embodiment, there can be some vertical overlap between the return manifold and the supply manifold. In at least one embodiment, the return internal volume can be distributed across multiple pipes, with one or more of the pipes being positioned at the supply manifold and / or with one or more of the pipes being positioned above the supply manifold.

[0051] In at least one embodiment, a cooling system can include a horizonal supply manifold configured to supply a refrigerant received from a pump in liquid form, a first vertical manifold configured to receive the refrigerant from the supply manifold, a horizontal return manifold configured to supply the refrigerant to a condenser, a second vertical manifold configured to supply the refrigerant to the return manifold, a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold, or any combination thereof. In at least one embodiment, the return internal volume can be positioned at or above the supply internal volume. For example, any or all of the return manifold can be positioned at or above the supply manifold.

[0052] In at least one embodiment, the horizonal supply manifold can have a supply internal volume. In at least one embodiment, the first vertical manifold can have a first internal volume. In at least one embodiment, the horizontal return manifold can have a return internal volume. In at least one embodiment, the second vertical manifold can have a second internal volume. In at least one embodiment, the plurality of two-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, a sum of thesecond internal volume and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the first internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the supply internal volume, the second internal volume, and the collective internal cold plate volume. In at least one embodiment, the return internal volume can be more than, such as 1 .5 times,1.7 times, 1.9 times, or at least twice, a sum of the supply internal volume, the first internal volume, the second internal volume, and the collective internal cold plate volume.

[0053] In at least one embodiment, a cooling system can include a plurality of computer equipment racks, a horizonal supply manifold having a supply internal volume spanning the computer equipment racks, and a horizontal return manifold having a return internal volume spanning the computer equipment racks. In at least one embodiment, each computer equipment rack can include a first vertical manifold having a first internal volume, a second vertical manifold having a second internal volume, and a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold. In at least one embodiment, the plurality of two-phase cold plates can have a collective internal cold plate volume. In at least one embodiment, the return internal volume can be at least twice a sum of the second internal volumes and the collective internal cold plate volumes.

[0054] In at least one embodiment, the horizonal supply manifold can be configured to supply a refrigerant received from a pump to each first vertical manifold. In at least one embodiment, the horizontal return manifold can be configured to supply the refrigerant received from each second vertical manifoldto a condenser. In at least one embodiment, the return internal volume can be positioned above the supply internal volume. In at least one embodiment, the return manifold can be positioned above the supply manifold.

[0055] In at least one embodiment, each computer equipment rack can include a plurality of two-phase hoses connecting the cold plates to the second vertical manifold. In at least one embodiment, the plurality of hoses can have a collective internal hose volume. In at least one embodiment, the return internal volume can be more or greater than a sum of the second internal volumes, the collective internal cold plate volumes, and the collective internal hose volumes, such as 1 .5 times, 1 .7 times, 1 .9 times, or at least twice, such sum.

[0056] In at least one embodiment, a cooling system according to the disclosure can include a plurality of computer equipment racks, which can include a first computer equipment rack and a second computer equipment rack, a third vertical manifold having a third internal volume and configured to receive the refrigerant from the supply manifold, and a fourth vertical manifold having a fourth internal volume and configured to supply the refrigerant to the return manifold. In at least one embodiment, the first vertical manifold and the second vertical manifold can be coupled to the first computer equipment rack, and a plurality of two-phase cold plates can be or include a first plurality of two-phase cold plates coupled to the first computer equipment rack. In at least one embodiment, a second plurality of two-phase cold plates can be plumbed in parallel with one another in fluid communication between the third vertical manifold and the fourth vertical manifold, and the third vertical manifold, the fourth vertical manifold and the second plurality of two-phase cold plates can be coupled to the second computer equipment rack. In at least one embodiment, a collective internal cold plate volume can include an internal cold plate volume of the second plurality of two-phase cold plates, and the return internal volume can be greater than, suchas at least twice, a sum of the second and fourth internal volumes and the collective internal cold plate volume.

[0057] In at least one embodiment, the return internal volume can be positioned at least partially above the supply internal volume. In at least one embodiment, the return manifold can be positioned at least partially above the supply manifold. In at least one embodiment, each of a plurality of computer equipment racks can include a plurality of two-phase hoses connecting a plurality of cold plates to one or more vertical manifolds, such as the second and fourth vertical manifolds, respectively. In at least one embodiment, the pluralities of two- phase hoses can collectively have an internal hose volume, such as a collective internal hose volume. In at least one embodiment, a return internal volume can be greater than, such as at least twice, a sum of the second and fourth internal volumes, the collective internal cold plate volume, and the collective internal hose volume. In at least one embodiment, a horizonal supply manifold can have a supply internal volume spanning two or more computer equipment racks and can supply refrigerant to each of a plurality of manifolds, such as first and third (or other) vertical manifolds. In at least one embodiment, a horizontal return manifold can have a return internal volume spanning two or more computer equipment racks and can supply refrigerant received from each of a plurality of manifolds, such as second and fourth (or other) vertical manifolds to a condenser.

[0058] Other and further embodiments utilizing one or more aspects of the disclosure can be devised without departing from the spirit of Applicant’s disclosure. For example, the devices, systems and methods can be implemented for numerous different types and sizes in numerous different industries. Further, the various methods and embodiments of the devices, systems and methods can be included in combination with each other to produce variations of the disclosed methods and embodiments. Discussion of singular elements can include pluralelements and vice versa. The order of steps can occur in a variety of sequences unless otherwise specifically limited. The various steps described herein can be combined with other steps, interlineated with the stated steps, and / or split into multiple steps. Similarly, elements have been described functionally and can be embodied as separate components or can be combined into components having multiple functions.

[0059] The inventions have been described in the context of preferred and other embodiments and not every embodiment of the inventions has been described. Obvious modifications and alterations to the described embodiments are available to those of ordinary skill in the art having the benefits of the present disclosure. The disclosed and undisclosed embodiments are not intended to limit or restrict the scope or applicability of the inventions conceived of by the Applicant, but rather, in conformity with the patent laws, Applicant intends to fully protect all such modifications and improvements that come within the scope or range of equivalents of the following claims.

Claims

WHAT IS CLAIMED IS:1 . A cooling system comprising: a horizonal supply manifold having a supply internal volume and configured to supply a refrigerant received from a pump in liquid form; a first vertical manifold having a first internal volume and configured to receive the refrigerant from the supply manifold; a horizontal return manifold having a return internal volume and configured to supply the refrigerant to a condenser; a second vertical manifold having a second internal volume and configured to supply the refrigerant to the return manifold; and a plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the first vertical manifold and the second vertical manifold, wherein the plurality of two-phase cold plates collectively have a collective internal cold plate volume; wherein the return internal volume is positioned at or above the supply internal volume.

2. The cooling system of claim 1 , wherein the return manifold is positioned above the supply manifold.

3. The cooling system of claim 1 , wherein the return internal volume is at least twice a sum of the second internal volume and the collective internal cold plate volume.

4. The cooling system of claim 1 , further comprising a plurality of two-phase hoses connecting the cold plates to the second vertical manifold, wherein the plurality of hoses collectively have a collective internal hose volume; and whereinthe return internal volume is at least twice a sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume.

5. The cooling system of claim 4, wherein the return internal volume is at least twice a sum of the second internal volume, the collective internal cold plate volume, the collective internal hose volume and a collective internal volume of any piping in fluid communication between the second vertical manifold and the return manifold.

6. The cooling system of claim 4, wherein the return internal volume is positioned at or above the supply internal volume.

7. The cooling system of claim 4, wherein the return manifold is positioned at or above the supply manifold.

8. The cooling system of claim 4, wherein the return manifold is configured to receive vapor from the cold plates when a portion of the refrigerant flow is in a vapor phase.

9. The cooling system of claim 4, wherein the return manifold is sized to receive vapor from the cold plates, upstream of the condenser, when a portion of the refrigerant flow is in a vapor phase.

10. The cooling system of claim 4, wherein the return manifold is configured to receive vapor from the cold plates at full system heat load when most of the refrigerant flow is in a vapor phase and a volume of liquid equal to the sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume.

11. The cooling system of claim 4, wherein the return manifold is sized to receive a vapor volume flow rate fluidically between the cold plates and the condenser at full system heat load, when most of the refrigerant flow is in a vapor phase, and a volume of liquid equal to the sum of the second internal volume, the collective internal cold plate volume, and the collective internal hose volume.

12. The cooling system of claim 4, wherein the return manifold comprises an outlet port sized to accommodate a rated flow of the refrigerant at no system heat load, when the refrigerant flow is in a liquid phase.

13. The cooling system of claim 12, wherein the return manifold has a larger internal cross sectional area than the outlet port.

14. The cooling system of claim 12, wherein the return manifold comprises a sight glass configured to allow visual observation of a liquid level of the refrigerant within the return manifold.

15. The cooling system of claim 14, wherein the liquid level of the refrigerant within the return manifold is even with a top of the outlet port at no system heat load, when the refrigerant flow is in a liquid phase.

16. The cooling system of claim 14, wherein the liquid level of the refrigerant within the return manifold occupies less than one quarter of the internal cross sectional area of the return manifold at full system heat load, when most of the refrigerant flow is in a vapor phase.

17. The cooling system of claim 1 , further comprising :a plurality of computer equipment racks, including a first computer equipment rack and a second computer equipment rack; a third vertical manifold having a third internal volume and configured to receive the refrigerant from the supply manifold; and a fourth vertical manifold having a fourth internal volume and configured to supply the refrigerant to the return manifold; wherein the first vertical manifold and the second vertical manifold are coupled to the first computer equipment rack; wherein the plurality of two-phase cold plates is a first plurality of two-phase cold plates coupled to the first computer equipment rack; further comprising a second plurality of two-phase cold plates plumbed in parallel with one another in fluid communication between the third vertical manifold and the fourth vertical manifold, wherein the third vertical manifold, the fourth vertical manifold and the second plurality of two-phase cold plates are coupled to the second computer equipment rack; wherein the collective internal cold plate volume includes an internal cold plate volume of the second plurality of two-phase cold plates; and wherein the return internal volume is at least twice a sum of the second and fourth internal volumes and the collective internal cold plate volume.

18. The cooling system of claim 17, wherein the return internal volume is positioned above the supply internal volume.

19. The cooling system of claim 17, wherein the return manifold is positioned above the supply manifold.

20. The cooling system of claim 17, wherein each of the first and second computer equipment racks further comprises a plurality of two-phase hoses connecting the cold plates to the second and fourth vertical manifolds, respectively; wherein the pluralities of two-phase hoses collectively have a collective internal hose volume; and wherein the return internal volume is at least twice a sum of the second and fourth internal volumes, the collective internal cold plate volume, and the collective internal hose volume.

Images