Die-level lateral heat offloading in three-dimensional semiconductor die stacks
IL328639A0Pending Publication Date: 2026-07-01ARYEH ROSENZWEIG
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Patent Information
- Application Number
- IL328639
- Authority / Receiving Office
- IL · IL
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-05-25
- Publication Date
- 2026-07-01
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