Resistive metal layers for circuit boards,circuit boards containing the same and methods and plating baths for electrodepositing a resistive layer

IL89407A0Inactive Publication Date: 1989-09-10GOULD INC

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Patent Information

Application Number: IL89407
Authority / Receiving Office: IL · IL
Patent Type: Applications
Current Assignee / Owner
Priority Date: 1989-02-09
Filing Date: 1989-02-24
Publication Date: 1989-09-10
Estimated Expiration: Not applicable · inactive patent

Application Information

Patent Timeline

09 Feb 1989

Priority

24 Feb 1989

Application

IL89407

10 Sep 1989

Publication

IL89407A0

IPC: H01C7/00; H01C17/16; H05K1/16; H05K3/38

CPC: H01C7/006; H01C17/16; H05K1/167; H05K3/384; H05K2201/0323; H05K2201/0355; H05K2203/0361; H05K2203/0384

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