Heat Conduction Unit

JP1702681SActive Publication Date: 2024-12-16SHIN ETSU POLYMER CO LTD
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Patent Information

Application Number
JP2021005659D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2021-03-19
Publication Date
2024-12-16
Estimated Expiration
2046-03-19

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Abstract

This article is a thermally conductive unit that can be interposed between a heat source and a cooling member to promote heat dissipation from the heat source.
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