Thermally Conductive Particles

JP1715089SActive Publication Date: 2025-05-23DENKA CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2020017398D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2020-08-20
Publication Date
2025-05-23
Estimated Expiration
2045-08-20

Smart Images

  • Figure 0001715089000001
    Figure 0001715089000001
  • Figure 0001715089000002
    Figure 0001715089000002
  • Figure 0001715089000003
    Figure 0001715089000003
Patent Text Reader

Abstract

This product is a thermally conductive particle used to manufacture a thermally conductive sheet. This product is made of boron nitride, which has excellent thermal conductivity. The thermally conductive sheet is used by sandwiching it between a heat source member such as a circuit and a heat dissipation member such as a heat sink in, for example, an inverter. A thermally conductive sheet is manufactured by forming a resin mixed with this product into a sheet. This product is generally tubular. Therefore, as shown in the "Reference Enlarged Cross-Sectional View Showing the Usage State", when this product is vertical in the thermally conductive sheet, it can efficiently conduct heat from the heat source member to the heat dissipation member. In addition, when this product is mixed into a resin, it does not become smaller due to pressure, so a thermally conductive sheet with excellent thermal conductivity can be manufactured with a small amount. The longitudinal length of this product is about 300 μm. In normal transactions, an enlarged photograph or an enlarged view of this product is attached.
Need to check novelty before this filing date? Find Prior Art