Clamping piece for electrolytic plating equipment

JP1745531SPending Publication Date: 2026-06-12SUMITOMO METAL MINING CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
SUMITOMO METAL MINING CO LTD
Filing Date
2022-12-19
Publication Date
2026-06-12

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Abstract

This article is a clamping piece for an electroplating apparatus. The electroplating apparatus is a device that performs electroplating on a substrate while conveying a long, strip-shaped substrate by roll-to-roll. The electroplating apparatus has an endless belt for conveying the substrate. As shown in the reference front view and reference right side view of the usage state, the endless belt is provided with a plurality of clamps 2 for gripping the substrate 1. The substrate 1 is in a suspended position with its width direction aligned with the vertical direction, and its upper edge is gripped by the clamps 2. The clamps 2 have a pair of arms 22, 22 connected via hinges 21. The clamping piece 23 of this article is fixed to the tip of each arm 22.
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