Power Module

JP1786519SActive Publication Date: 2024-12-10WOLFSPEED INC
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Patent Information

Application Number
JP2023002154D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2021-04-23
Filing Date
2021-10-25
Publication Date
2024-12-10
Estimated Expiration
2046-10-25

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Abstract

The article is a power module in which multiple semiconductor devices are packaged, and is used in high power switching systems such as electric vehicles and power conversion devices.
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