Wearable device body
JP1788498SActive Publication Date: 2025-01-08TAIWAN ASIA SEMICONDUCTOR CORPORATION
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Patent Information
- Application Number
- JP2024014314D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Priority Date
- 2024-01-16
- Filing Date
- 2024-07-11
- Publication Date
- 2025-01-08
- Estimated Expiration
- 2049-07-11
Abstract
This item is the main body of a wearable device equipped with a sensor module in which multiple isosceles trapezoidal photodiodes are arranged in a ring shape and used to receive light and convert it into a current signal or a voltage signal.
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