Head cooling pad

JP1793555SActive Publication Date: 2025-03-14YURYOKOKUSAI
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Patent Information

Application Number
JP2024017594D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-08-27
Publication Date
2025-03-14
Estimated Expiration
2049-08-27

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Abstract

The article of this design is a head cooling pad for cooling the head of a user, in which a liquid latent heat material (phase change material) is filled inside a pad molded from synthetic resin. In the reference bottom view showing the names of each part, the head cooling pad has six pads including an outer circumferential cold insulation part, an inner circumferential cold insulation part, and a communication flow path that connects them, which are arranged at approximately equal pitches in a concentric circle around the central cold insulation part. In the reference bottom view showing the names of each part, the white material filled in the outer circumferential cold insulation part, the inner circumferential cold insulation part, and the central cold insulation part is the above-mentioned liquid latent heat material. In the reference bottom view showing the transparent part, the hatched part indicates the part covered with a transparent material. That is, the bottom side of the head cooling pad is covered with a transparent material. As shown in the reference view showing the usage state, after the head cooling pad is cooled by a refrigerator, a freezer, etc., the head of the user is cooled by wearing it on the head in a state where it is set inside a hat (by sandwiching the head cooling pad between the hat and the head). The head cooling pad may be placed not only on the hat but also on the inside of the helmet.
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