Semiconductor Module

JP1794243SActive Publication Date: 2025-03-25SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Application Number
JP2024013644D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-07-02
Publication Date
2025-03-25
Estimated Expiration
2049-07-02

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Abstract

This item is a semiconductor module (DIP semiconductor module) with an exposed heat sink on one side (the bottom side) and multiple terminals extending from the side with single or bifurcated ends that are arranged symmetrically in the longitudinal direction.
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