Semiconductor module

JP1794490SActive Publication Date: 2026-04-01ROHM CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-08-29
Publication Date
2026-04-01

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Abstract

The article relating to this design is a semiconductor module equipped with insulating and heat dissipating members, which is used for power control in, for example, a power supply circuit.
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