Power Semiconductor Modules

JP1794781SActive Publication Date: 2025-04-01ROHM CO LTD
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Patent Information

Application Number
JP2024011691D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-06-10
Publication Date
2025-04-01
Estimated Expiration
2049-06-10

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Abstract

The article of this design is a power semiconductor module including multiple power semiconductor elements, and has holes between adjacent packages. This reduces the load when the resin hardens, for example, when molding the package by pouring thermosetting resin.
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