Sealing material for semiconductor manufacturing equipment

Abstract

This article is a sealing material for semiconductor manufacturing equipment suitable for use in semiconductor manufacturing equipment such as CVD and dry etching equipment. The sealing material for semiconductor manufacturing equipment of this article is annular, and as shown in the enlarged cross-sectional view of B-B, the cross-sectional shape is D-shaped. Further, as shown in the reference diagram showing the usage state of this article, this article is disposed in a groove provided between the outer peripheral ends of a first member and a second member adhesively bonded to each other via an adhesive layer, and a cylindrical member located outside the first member and the second member, and is used.

Images