Sealing material for semiconductor manufacturing equipment

Abstract

This article is a sealing material for semiconductor manufacturing equipment suitable for use in semiconductor manufacturing equipment such as CVD and dry etching equipment. The sealing material for semiconductor manufacturing equipment of this article is annular, and as shown in the enlarged cross-sectional view B-B and the reference diagram showing the configuration of this article, it consists of a substantially rectangular main body portion and a lip portion extending on this main body portion in an inclined posture toward the inner diameter side. The starting position where the lip portion extends with respect to the main body portion is a position slightly inside from the outer diameter side end of the main body portion, and thus a protrusion is formed between the main body portion and the lip portion. Also, as shown in the reference diagram showing the usage state of this article, when this article is mounted in the single-sided groove provided in the first member, by moving the second member toward the first member side in this state, the lip portion is tilted toward the first member side by the second member, and the space between the first member and the second member is sealed. At this time, the protrusion of this article abuts on the inclined surface of the single-sided groove and preferentially deforms, thereby preventing the rolling of this article in the single-sided groove. Also, when this article thermally expands, the protrusion preferentially deforms, making it difficult for stress concentration to occur at any position of this article.

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