Inspection substrate for a substrate processing apparatus

Abstract

This article is an inspection substrate for inspecting whether the positional relationship between a substrate such as a semiconductor wafer to be processed and various members of a substrate processing apparatus (such as a processing cup and a supply nozzle for a processing liquid) close to the substrate is appropriate in a substrate processing apparatus such as a coating and developing apparatus. When performing an inspection using this article, this article is transported into the substrate processing apparatus, the distance between this article and various members of the adjacent substrate processing apparatus is detected by a position sensor unit equipped with a camera or the like, and whether this article and various members of the adjacent substrate processing apparatus come into contact (interfere) is detected by a contact sensor unit, and the inspection is performed by wirelessly transmitting the detected information.

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