Inspection substrate for substrate processing apparatus

Abstract

This article is an inspection substrate for inspecting whether the positional relationship between a substrate such as a semiconductor wafer to be processed and various members of a substrate processing apparatus (such as a processing cup and a supply nozzle for a processing liquid) close to the substrate is appropriate within a substrate processing apparatus such as a coating and developing apparatus. When performing an inspection using this article, this article is transported into the substrate processing apparatus, and a distance between this article and various members of the adjacent substrate processing apparatus is detected by a position sensor unit equipped with a camera or the like, and it is detected by a contact sensor unit whether this article and various members of the adjacent substrate processing apparatus come into contact (interfere), and the inspection is performed by wirelessly transmitting the detected information.

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