Temperature Sensor

JP1806165SActive Publication Date: 2025-08-15MITSUBISHI MATERIALS CORP
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Patent Information

Application Number
JP2024021885D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-10-22
Publication Date
2025-08-15
Estimated Expiration
2049-10-22

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Abstract

This article is a temperature sensor used in automobile-related devices, etc. As shown in the reference perspective view, this temperature sensor includes a metal case made of aluminum or the like, an FPC (flexible printed circuit board) with its tip inserted into the metal case and a thermistor element (not shown) mounted on the tip and its base end extending outside the metal case, a pair of lead wires connected to the base end of the FPC, a heat-shrinkable tube covering the connection between the lead wires and the FPC, and a sealing resin filled into the metal case to seal the thermistor element.
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