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JP1806490SActive Publication Date: 2025-08-20LAM RES CORP
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Patent Information

Application Number
JP2024026974D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-07-02
Filing Date
2024-12-26
Publication Date
2025-08-20
Estimated Expiration
2049-12-26

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Abstract

The article according to the present application (hereinafter referred to as "the article") is a substrate support that can be used together with a carrier ring to support a semiconductor substrate in a semiconductor processing apparatus.
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