Polishing pad

JP1807022SActive Publication Date: 2025-08-26FUJIBO HLDG
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Patent Information

Application Number
JP2025007095D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-04-08
Publication Date
2025-08-26
Estimated Expiration
2050-04-08

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Abstract

This article is primarily used for polishing electronic devices and electronic components. It consists of an abrasive layer and a substrate layer, with grooves and cylindrical convex portions formed on the surface of the abrasive layer. The convex portions are arranged in L-shaped and rectangular regions, and the L-shaped and rectangular regions are arranged in a predetermined pattern, eliminating variations in the convex portions that come into contact with the workpiece, enabling uniform and stable polishing of the entire workpiece.
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