Composite sealing material

JP1809568SActive Publication Date: 2025-10-01VALQUA LTD
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Patent Information

Application Number
JP2025006151D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2025-10-01
Estimated Expiration
2050-03-27

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Abstract

This product is a composite sealant used in semiconductor manufacturing equipment, etc. As can be seen in the enlarged view of the BB portion, this composite sealant is composed of a first sealant and a second sealant located on the outer periphery of the first sealant.
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