Semiconductor Module

JP1820367SActive Publication Date: 2026-03-03SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2026-03-03

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Abstract

This product is a semiconductor module having a resin sealing portion in which a semiconductor element is encapsulated, with many cylindrical terminals provided on the flat surface side and many pin terminals provided on the front surface side.
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