Filler material support
JP1821589SActive Publication Date: 2026-03-13MIRAI KOGYO KK
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-12-10
- Publication Date
- 2026-03-13
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Abstract
This article relates to a support for filling material used to fill gaps between wiring and piping materials such as cables, conduits, and drainage pipes that penetrate through holes in the building's structure. As illustrated in the reference diagram of use, this article comprises a clamping portion formed by overlapping wires to be elastically deformable, and is fixed to the periphery of a through-hole so that the clamping portion is located inside the through-hole penetrating the building's structure. The clamping portion can support a support plate on which filling material is placed between the inner surface of the through-hole and the outer surface of a cable inserted through the through-hole by sandwiching it between the overlapping wires.
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