Probe pin for integrated circuits testing
JP1821889SActive Publication Date: 2026-03-17HICON CO LTD +2
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2026-03-17
Smart Images

Figure 0001821889000001 
Figure 0001821889000002 
Figure 0001821889000003
Abstract
The material of this design is metal. This design is a probe pin that contacts electrodes, terminals, pads, etc., and is used for inspecting electronic components such as semiconductor devices, semiconductor packages, integrated circuits (ICs), and printed circuit boards. This design increases the stability of contact with IC terminals by forming a crown-shaped contact terminal at the top. Shoulders (projections) are formed on the upper and lower pins, allowing adjustment of how much the pins protrude from the socket. The main feature of this creation is the shape and combination of shapes of the IC inspection probe pin. 1.1) Perspective view; 1.2) Front view; 1.3) Rear view; 1.4) Left side view; 1.5) Right side view; 1.6) Top view; 1.7) Bottom view; 1.8) Reference drawing
Need to check novelty before this filing date? Find Prior Art