Die bonder for semiconductor manufacturing

Abstract

This product is a die bonder for semiconductor manufacturing, which picks up semiconductor elements from a wafer and transfers them to a lead frame or substrate for mounting. The die bonder has a manufacturing space inside where the transfer and mounting of semiconductor elements to the lead frame or substrate takes place. The die bonder is equipped with an openable and closable door for accessing the manufacturing space from the outside. During semiconductor manufacturing, the die bonder is used with the door closed. The die bonder is also equipped with a monitor for displaying manufacturing conditions and status for semiconductor manufacturing.

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