Die bonder for semiconductor manufacturing

JP1822797SActive Publication Date: 2026-03-27FASFORD TECH
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-09-19
Publication Date
2026-03-27

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Abstract

This product is a die bonder for semiconductor manufacturing, which picks up semiconductor elements from a wafer and transfers them to a lead frame or substrate for mounting. The die bonder has a manufacturing space inside where the transfer and mounting of semiconductor elements to the lead frame or substrate takes place. The die bonder also includes a monitor for displaying manufacturing conditions and status for semiconductor manufacturing.
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