Sensor module
JP1822801SActive Publication Date: 2026-03-27TDK CORP
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2026-03-27
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Abstract
This product is a small sensor module used for predictive maintenance of various equipment and devices. It incorporates multiple sensors, including an accelerometer, gyroscope, and temperature sensor, to detect the status of the target equipment and transmit the collected data wirelessly. Furthermore, it is equipped with AI, allowing it to automatically analyze the failure risk of the target equipment by processing the collected data internally. The product has mounting holes and can be attached to equipment and devices using screws or attachments. The battery cover can be opened and closed while the product is attached to the equipment or device.
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