Sensor module

JP1822802SActive Publication Date: 2026-03-27TDK CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-03-27

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Abstract

This product is a small sensor module used for predictive maintenance of various equipment and devices. It incorporates multiple sensors, including an accelerometer, gyroscope, and temperature sensor, to detect the status of the target equipment and transmit the collected data wirelessly. Furthermore, it is equipped with AI, allowing it to automatically analyze the failure risk of the target equipment by processing the collected data internally.
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