Rotating shaft sealing device
JP1828753SActive Publication Date: 2026-06-09SEALINK
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- SEALINK
- Filing Date
- 2026-01-21
- Publication Date
- 2026-06-09
Smart Images

Figure 0001828753000001 
Figure 0001828753000002 
Figure 0001828753000003
Abstract
This article is a sealing device for a rotating shaft in a substrate processing apparatus for processing wafers, which prevents fluid leakage from between the rotating shaft and the housing. The rotating shaft is located in a hollow rotating section, and the rotating section rotates due to a motor attached to it, causing the rotating shaft to rotate. Furthermore, a wafer boat is attached to the rotating shaft, and the wafer rotates.
Need to check novelty before this filing date? Find Prior Art