Resin molding mold

Abstract

This product is an upper mold used in a resin molding apparatus for sealing substrates on which semiconductor chips and the like are fixed with resin. It is used in combination with a lower mold having a cavity recess, which is positioned opposite the upper mold. The substrate is held in the upper mold, and a release film and resin are supplied to the cavity recess of the lower mold. Conventionally, the film pressing portion of the upper mold, which presses down on the surface of the lower mold from above on the surface of the lower mold, was positioned outside the entire work clamper for holding the substrate. However, in this product, the pusher portion and claw portion of the work clamper are positioned to straddle the film pressing portion, and the film pressing portion is positioned further inward than before, i.e., closer to the cavity recess of the lower mold positioned opposite it, thereby making it possible to reduce the size of the release film.

Images