Adhesive tape material for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding of semiconductor chips obtained by dicing. To use it, the PET separator is peeled off, the wafer ring is attached to the adhesive layer, and the semiconductor wafer is attached to the adhesive layer. This product features a design where the left and right portions of the adhesive layer are formed in a straight line when viewed from the front, allowing for closer spacing between adhesive layers. This improves the placement efficiency of the adhesive layers and enhances yield. This product can be used with both circular and rectangular semiconductor wafers.

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