Retainer ring for semiconductor substrate polishing

JP1835045SActive Publication Date: 2026-09-03TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
JP2025024138D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2025-11-30
Publication Date
2026-09-03
Estimated Expiration
2050-11-30

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Abstract

This product is used in the substrate polishing process in the manufacturing of semiconductors and the like, and is attached to the head of a polishing device to hold the outside of the substrate in place during polishing to prevent it from detaching. A storage pocket 10 for accommodating a non-circular (square) substrate is provided in the center of the front (see reference perspective view (bottom perspective view)), and one side of the substrate is polished while it is housed in this storage pocket 10. Recesses 11 are formed at the corners of the storage pocket to allow slurry to escape in order to suppress the influence of slurry accumulation on the polishing of the substrate.
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