Retainer ring for semiconductor substrate polishing

Abstract

This product is used in the substrate polishing process in the manufacturing of semiconductors and the like, and is attached to the head of a polishing device to hold the outside of the substrate in place during polishing to prevent it from detaching. A storage pocket 10 for accommodating a non-circular (square) substrate is provided in the center of the front (see reference perspective view (bottom perspective view)), and one side of the substrate is polished while it is contained in this storage pocket 10. A groove 14 is formed at the corner of the storage pocket 10, which connects from the storage pocket 10 to the outside of the template 20 to discharge the slurry used during substrate polishing, in order to suppress the effect of slurry accumulation on the substrate polishing process.

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