Parts for semiconductor testing equipment
JP1835723SActive Publication Date: 2026-09-15HAMAMATSU PHOTONICS KK +1
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Patent Information
- Application Number
- JP2026001150D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2026-01-23
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2051-01-23
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Abstract
This item is a component used in a semiconductor inspection machine that inspects wafers on which semiconductor devices are formed for the presence or absence of defects. This item is a metal plate-shaped member with a camera hole in the center and grooves for vacuum suction around it. When in use, an infrared-transmitting member is fitted into the camera hole and installed in the semiconductor inspection machine as shown in the "Reference Diagram Showing Usage State". Since the infrared-transmitting member is flush with the front surface of this item when installed, the wafer can be stably placed on this item without bending. In addition, this item has suction holes for vacuum suction in the grooves. By performing vacuum suction in a wide, strip-shaped area, the wafer can be securely fixed.
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