Additive heat exchanger and method of forming

JP2022136029A5Active Publication Date: 2025-02-07UNISON INDUSTRIES LLC
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Patent Information

Application Number
JP2022032627
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-03-04
Filing Date
2022-03-03
Publication Date
2025-02-07
Estimated Expiration
2042-03-03

AI Technical Summary

Technical Problem

Existing heat exchangers face challenges in achieving optimal surface finish and wall thickness control, leading to inefficiencies in heat transfer, turbulence, and increased weight due to rough surfaces and thicker walls.

Method used

A method of electroforming heat exchangers involves polishing a conductive mandrel surface to a smooth finish (rms < 32 microinches) and electroforming a heat exchanger with thin walls (3-4 mils) to integrate tubes and manifolds as a monolithic unit, reducing porosity and turbulence.

Benefits of technology

The method results in improved heat transfer, reduced weight, and lower manufacturing costs by achieving smoother surfaces and thinner walls, enhancing thermal conductivity and structural integrity.

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Abstract

To provide an additive heat exchanger and a method of forming.SOLUTION: A method of electroforming can be used to prepare a heat exchanger by electroforming the heat exchanger on a mandrel having a smooth and conductive surface. The mandrel is in the shape of at least part of the heat exchanger, and is removed from the electroformed heat exchanger.SELECTED DRAWING: Figure 2
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