Method for evaluating wiring boards

JP2023177157A5Active Publication Date: 2025-04-28QUALTEC CO LTD
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Patent Information

Application Number
JP2022089929
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2022-06-01
Publication Date
2025-04-28
Estimated Expiration
2042-06-01

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Abstract

To solve the problem that although migration occurs when a line / space of a wiring pattern is narrow, relation between the line / space and the migration occurrence has not been quantified.SOLUTION: By immersing a wiring board 102 in water 202, copper ions are eluted from a copper wiring pattern 104 into the water 202. The eluted copper ions are adsorbed by an ion exchange resin 203. The ion exchange resin 203 having adsorbed copper ions is immersed in regeneration liquid 204, and the copper ions are eluted into the regeneration liquid 204. After the regeneration liquid 204 is neutralized with neutralization liquid 205, reagent bathocuproine is dripped to develop color. An absorbance (Abs) of the colored regeneration liquid is measured using a wavelength spectrometer to quantify an amount of copper ions.SELECTED DRAWING: Figure 1
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