Component placement system and method of operation thereof
JP2023551966A5Active Publication Date: 2024-12-16アセンブリオン ビーブイ
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Patent Information
- Application Number
- JP2023534073
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-12-07
- Filing Date
- 2021-12-06
- Publication Date
- 2024-12-16
- Estimated Expiration
- 2041-12-06
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Abstract
A component placement system is provided that includes a first bondhead array configured to simultaneously transport a first plurality of electronic components, a second bondhead array configured to simultaneously transport a second plurality of electronic components, a first motion system that simultaneously transports the first bondhead array and the second bondhead array along a first axis of motion, and a second motion system that transports the first bondhead array independently of the second bondhead array.
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