Electronic semiconductor components and method for producing pre-treated composite substrates for electronic semiconductor components
JP2023553477A5Active Publication Date: 2024-12-17MI2 FACTORY GMBH
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Patent Information
- Application Number
- JP2023535862
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-04-16
- Filing Date
- 2021-12-10
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2041-12-10
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Abstract
We provide high-performance, high-quality electronic semiconductor components. The electronic semiconductor component (50) includes a crystal (53) made of single-crystal SiC, wherein the orientation of at least some subareas of a first surface (58) of the SiC crystal (52) extends in a direction extending substantially perpendicular to the c-direction (c) of the crystalline structure of the crystal (53). A manufacturing process is also disclosed.
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