Epoxy resin composition

JP2024075032A5Pending Publication Date: 2025-05-20SHIN ETSU CHEMICAL CO LTD +1

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Patent Information

Application Number: JP2022186143
Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2022-11-22
Publication Date: 2025-05-20

Application Information

Patent Timeline

22 Nov 2022

Application

JP2022186143

20 May 2025

Publication

JP2024075032A5

IPC: C08G59/30

CPC: C08L63/00; C08G59/30; C08K3/013

Inventors: 野田大輔; 中川秀夫

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Abstract

To provide an epoxy resin composition containing polyorganosiloxane.SOLUTION: An epoxy resin composition comprises (A) an epoxy resin having two or more epoxy groups per molecule, (B) urethane bond-containing polyorganosiloxane represented by a formula (1), (C) mesogen group-containing polyorganosiloxane represented by a formula (2), and (D) an epoxy resin curing agent.SELECTED DRAWING: None

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