Method of operating PVD apparatus

Abstract

To provide a processing method capable of further reducing a contact resistance without reducing a productivity of a system.SOLUTION: A method includes the steps of: providing a PVD apparatus including a chamber having a substrate support body, a target, an RF bias signal supply part for applying an RF bias to the substrate support body, and an electric signal supply part for supplying an electric signal to the target; arranging a semiconductor substrate having a conductive feature to the substrate support body; performing a cleaning step by introducing an inert gas to the chamber, applying the RF bias to the substrate support body, and supplying the electric signal to the target; and performing a deposition step by not applying the RF bias to the substrate support body, or applying the RF bias smaller than the RF bias applied to the substrate support body during the cleaning step, and supplying the electric signal to the target.SELECTED DRAWING: Figure 3

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